Abstract: An embodiment of a sensor device includes a base substrate, a circuit pattern formed overlying the interior surface of the substrate, a physiological characteristic sensor element on the exterior surface of the substrate, conductive plug elements located in vias formed through the substrate, each conductive plug element having one end coupled to a sensor electrode, and having another end coupled to the circuit pattern, a multilayer component stack carried on the substrate and connected to the circuit pattern, the stack including features and components to provide processing and wireless communication functionality for sensor data obtained in association with operation of the sensor device, and an enclosure structure coupled to the substrate to enclose the interior surface of the substrate, the circuit pattern, and the stack.

Abstract: An embodiment of a sensor device includes a base substrate, a circuit pattern formed overlying the interior surface of the substrate, a physiological characteristic sensor element on the exterior surface of the substrate, conductive plug elements located in vias formed through the substrate, each conductive plug element having one end coupled to a sensor electrode, and having another end coupled to the circuit pattern, a multilayer component stack carried on the substrate and connected to the circuit pattern, the stack including features and components to provide processing and wireless communication functionality for sensor data obtained in association with operation of the sensor device, and an enclosure structure coupled to the substrate to enclose the interior surface of the substrate, the circuit pattern, and the stack.

Abstract: An embodiment of a sensor device includes a base substrate, a circuit pattern formed overlying the interior surface of the substrate, a physiological characteristic sensor element on the exterior surface of the substrate, conductive plug elements located in vias formed through the substrate, each conductive plug element having one end coupled to a sensor electrode, and having another end coupled to the circuit pattern, a multilayer component stack carried on the substrate and connected to the circuit pattern, the stack including features and components to provide processing and wireless communication functionality for sensor data obtained in association with operation of the sensor device, and an enclosure structure coupled to the substrate to enclose the interior surface of the substrate, the circuit pattern, and the stack.

Abstract: An embodiment of a sensor device includes a base substrate, a circuit pattern formed overlying the interior surface of the substrate, a physiological characteristic sensor element on the exterior surface of the substrate, conductive plug elements located in vias formed through the substrate, each conductive plug element having one end coupled to a sensor electrode, and having another end coupled to the circuit pattern, a multilayer component stack carried on the substrate and connected to the circuit pattern, the stack including features and components to provide processing and wireless communication functionality for sensor data obtained in association with operation of the sensor device, and an enclosure structure coupled to the substrate to enclose the interior surface of the substrate, the circuit pattern, and the stack.

Abstract: Disclosed herein are biosensors for sensing analyte concentration values, and methods of operating such sensors. The biosensor includes a probe. The probe includes a base substrate and a plurality of electrode sets overlying the base substrate. Each set of the plurality of electrode sets being individually operable for measuring a glucose concentration value when the probe is implanted in a patient. The probe also includes a biodegradable coating covering at least one electrode set of the plurality of electrode sets. The biodegradable coating does not cover at least one other electrode set of the plurality of the electrode sets.

Abstract: An embodiment of a sensor device includes a base substrate, a circuit pattern formed overlying the interior surface of the substrate, a physiological characteristic sensor element on the exterior surface of the substrate, conductive plug elements located in vias formed through the substrate, each conductive plug element having one end coupled to a sensor electrode, and having another end coupled to the circuit pattern, a multilayer component stack carried on the substrate and connected to the circuit pattern, the stack including features and components to provide processing and wireless communication functionality for sensor data obtained in association with operation of the sensor device, and an enclosure structure coupled to the substrate to enclose the interior surface of the substrate, the circuit pattern, and the stack.

Abstract: Processes for fabricating physiological characteristic sensor devices are disclosed here. An embodiment of the fabrication process forms a circuit pattern on a base substrate, where the circuit pattern includes circuit layouts for multiple die locations. Component stacks are mounted to the circuit layouts. Each stack has features and components to provide processing and wireless communication functionality for obtained sensor data. An enclosure structure is formed overlying the base substrate to individually cover and enclose each of the component stacks. Sensor elements are fabricated on another surface of the substrate such that each sensor element has electrodes coupled to conductive plug elements formed through the substrate, and such that each sensor element corresponds to one die location. Next, the substrate is separated into physically discrete sensor device components.

Abstract: An improved medical electrical lead is disclosed herein. The lead may include a longitudinally extending body having a distal end, a proximal end, a conductive element extending between the distal and proximal ends, and an electrode coupled to the conductive element utilizing a reflow process. The conductive element and electrode may comprise materials that are incompatible.

Abstract: An improved medical electrical lead is disclosed herein. The lead may include a longitudinally extending body having a distal end, a proximal end, a conductive element extending between the distal and proximal ends, and an electrode coupled to the conductive element utilizing a reflow process. The conductive element and electrode may comprise materials that are incompatible.

Abstract: A complex connector and component within an implantable medical device in which the complex connector is positioned within the spacing footprint of the component to optimize packaging within the device.

Abstract: An improved medical electrical lead is disclosed herein. The lead may include a longitudinally extending body having a distal end, a proximal end, a conductive element extending between the distal and proximal ends, and an electrode coupled to the conductive element utilizing a reflow process. The conductive element and electrode may comprise materials that are incompatible.

Abstract: A complex connector and component within an implantable medical device in which the complex connector is positioned within the spacing footprint of the component to optimize packaging within the device.

Abstract: A complex connector and component within an implantable medical device in which the complex connector is positioned within the spacing footprint of the component to optimize packaging within the device.

Abstract: An electrical interconnect structure for an implantable medical device includes a feedthrough that has a pin extending therefrom. The pin defines a first end and a middle portion. A bonding surface is formed at the first end of the pin, and the bonding surface has a surface area greater than a cross-sectional area of the pin at its middle portion.

Abstract: An improved medical electrical lead is disclosed herein. The lead may include a longitudinally extending body having a distal end, a proximal end, a conductive element extending between the distal and proximal ends, and an electrode coupled to the conductive element utilizing a reflow process. The conductive element and electrode may comprise materials that are incompatible.

Abstract: At least one storage component, for example a capacitor or a battery, of an implantable medical device includes two perimeter surfaces. Linear extensions of the two perimeter surfaces define a zone. An electrical connector, which is coupled to the storage component and includes at least one connection point for electrically connecting the storage component with at least one other component within the medical device, is contained within the zone defined by the linear extensions of the two perimeter surfaces.

Abstract: A core component of a medical electrical lead extends within an inner conductive surface of a conductive ring such that an outer surface of the core holds a portion of a conductor against the inner conductive surface for electrical contact therewith. The outer surface of the core may be deformed by a compressive force of the conductor portion having been forced against the inner surface of the ring. Such a conductor junction may be formed by pushing the ring over the core to capture the conductor portion between the ring and the core and thereby displace a layer of insulation surrounding the conductor portion. The inner surface of the ring preferably has a diameter at one, or both terminal ends that is greater than a diameter of the inner surface between the ends.

Abstract: A sealed electrode enclosed in separator material is provided for use in a capacitor cell. The separator may either be adhered to the electrode in sheets, or may be formed into a pouch, which is used to enclose the electrode. A method of preparing the electrode sealed with separator is described in which an adhesive is used to secure the pouch to the electrode before sealing it. The prefabricated electrode and separator combination may be used in both coiled capacitor cells and flat capacitor cells that are often used in implantable medical devices. Electrodes prepared in this fashion can be efficiently and reliably aligned within the case of a capacitor cell, and have no exposed electrode surfaces that could lead to short-circuiting within the cell.

Abstract: A core component of a medical electrical lead extends within an inner conductive surface of a conductive ring such that an outer surface of the core holds a portion of a conductor against the inner conductive surface for electrical contact therewith. The outer surface of the core may be deformed by a compressive force of the conductor portion having been forced against the inner surface of the ring. Such a conductor junction may be formed by pushing the ring over the core to capture the conductor portion between the ring and the core and thereby displace a layer of insulation surrounding the conductor portion. The inner surface of the ring preferably has a diameter at one, or both terminal ends that is greater than a diameter of the inner surface between the ends.

Abstract: A sealed electrode enclosed in separator material is provided for use in a capacitor cell. The separator may either be adhered to the electrode in sheets, or may be formed into a pouch, which is used to enclose the electrode. A method of preparing the electrode sealed with separator is described in which an adhesive is used to secure the pouch to the electrode before sealing it. The prefabricated electrode and separator combination may be used in both coiled capacitor cells and flat capacitor cells that are often used in implantable medical devices. Electrodes prepared in this fashion can be efficiently and reliably aligned within the case of a capacitor cell, and have no exposed electrode surfaces that could lead to short-circuiting within the cell.