Patents by Inventor Mark D. Heal

Mark D. Heal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microwave probe for surface mount and hybrid assemblies
    Patent number: 6366104
    Abstract: A microwave probe for use with densely populated surface mount and hybrid microwave circuit assemblies includes a housing, a RF signal pin, and ground pins, wherein the pins extend outwardly from the housing. The pins are preferably individually spring-loaded contacts, and are oriented on the housing relative to each other so as to permit contact with a planar transmission line when the pins are perpendicular to the surface of the transmission line or circuit board.
    Type: Grant
    Filed: February 15, 2000
    Date of Patent: April 2, 2002
    Assignee: Hughes Electronics Corp.
    Inventors: Mark D. Heal, John R. Grebliunas
  • Microwave probe for surface mount and hybrid assemblies
    Publication number: 20020011855
    Abstract: A microwave probe for use with densely populated surface mount and hybrid microwave circuit assemblies includes a housing, a RF signal pin, and ground pins, wherein the pins extend outwardly from the housing. The pins are preferably individually spring loaded contacts, and are oriented on the housing relative to each other so as to permit contact with a planar transmission line when the pins are substantially perpendicular to the surface of the transmission line or circuit board.
    Type: Application
    Filed: February 15, 2000
    Publication date: January 31, 2002
    Inventors: Mark D. Heal, John R. Grebliunas
  • Tunable impedance matching network for a mic power amplifier module
    Patent number: 5973567
    Abstract: The output impedance matching network of a power amplifier module is improved by the addition of an intermediate set of bonding pads in close proximity to a power transistor in the power amplifier module. A tunable set of bond wires extend from the intermediate bonding pads to a transmission line that is coupled to the output of the power amplifier module. The tunable bond wires allow the inductance of the impedance matching network to be tuned and optimized.
    Type: Grant
    Filed: June 16, 1997
    Date of Patent: October 26, 1999
    Assignee: Hughes Electronics Corporation
    Inventors: Mark D. Heal, John R. Grebliunas, Howard T. Ozaki, Arnold L. Berman