Abstract: Epoxy laminates, e.g. CEM-1 laminates, include polymeric particles, particularly core-shell particles having an average diameter of about 0.05 to 30 ?m, which reduce the dust produced during manufacture of printed circuit boards.

Abstract: Epoxy laminates, e.g. CEM-1 laminates, include polymeric particles, particularly core-shell particles having an average diameter of about 0.05 to 30 ?m, which reduce the dust produced during manufacture of printed circuit boards.

Abstract: Epoxy laminates, e.g. CEM-1 laminates, include polymeric particles, particularly core-shell particles having an average diameter of about 0.05 to 30 ?m, which reduce the dust produced during manufacture of printed circuit boards.

Abstract: A jar clamp for stabilizing a jar so as to prevent slipping and twisting of the jar during opening of the jar, for freeing both hands so that they may be free to work at opening the jar lid, and for accommodating a wide array of jar diameters. The jar clamp incorporates a second elongate arm that is hingedly attached to a first elongate arm. A seat having a central strut as well as upper and lower cross bars is affixed to the first arm. The seat further incorporates rubberized padding and angled end portions on the upper and lower cross bars. A rubber or elastic rubberized strap is provided that is affixed to the second arm and releasably secured to the first arm.

Abstract: Homogeneous thermoset copolymers which may be used in the preparation of laminates for circuitry boards will comprise a poly(vinyl benzyl ether) of a polyphenol and a polyalkadiene in which the alkadiene monomer will contain from 3 to about 8 carbon atoms. The polymers are prepared by admixing a solution of the poly(vinyl benzyl ether) of a polyphenol dissolved in an organic solvent with a solution of the polyalkadiene also dissolved in an organic solvent. The admixing is done at an elevated temperature to form the desired composite. The resulting copolymer will possess desirable characteristics such as high glass transition temperature and low dielectric constant.

Abstract: Homogeneous thermoset terpolymers which may be used in the preparation of laminates for circuitry boards will comprise a diepoxide of a polyether of a polyphenol, a dicyanate ester of a polyether of a polyphenol and an alkenyl aryl compound. The polymers are prepared by admixing a solution of the diepoxide of a polyether of a polyphenol and an alkenyl aryl compound with a second solution of the dicyanate ester of a polyether of a polyphenol and the alkenyl aryl compound at elevated temperatures. The resulting terpolymer will possess desirable characteristics such as high glass transition temperature and low dielectric constant.

Abstract: Homogeneous thermoset terpolymers which may be used in the preparation of laminates for circuitry boards will comprise a poly(vinyl benzyl ether) of a polyphenol, a dicyanate ester of a polyether of a polyphenol and an alkenyl aryl compound. The polymers are prepared by admixing a solution of the poly(vinyl benzyl ether) of a polyphenol and an alkenyl aryl compound with a second solution of the dicyanate ester of a polyether of a polyphenol and the alkenyl aryl compound at elevated temperatures. The resulting terpolymer will possess desirable characteristics such as high glass transition temperature and low dielectric constant.