Patents by Inventor Mark D. Korich
Mark D. Korich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9337558Abstract: An electrical system includes an alternating current (AC) connector rod assembly and a polyphase electric machine. The electric machine has a plurality of phase leads each electrically connected to the AC connector rod assembly. The assembly includes spaced AC connector rods each having a center axis. The assembly also includes insulating housings and a carrier plate defining through holes that receive and space the AC connector rods. The carrier plate defines features that engage mating features of the insulating housings while allowing each of the rods to rotate about its respective center axis within the carrier plate. A vehicle includes a direct current (DC) battery pack, a DC bus, an AC bus, a PIM that is electrically connected on a first side to the DC bus and on a second side to the AC bus, the AC connector rod assembly, a traction motor, and a transmission.Type: GrantFiled: October 15, 2012Date of Patent: May 10, 2016Assignee: GM Global Technology Operations LLCInventors: Young M Doo, Jimmy M Chang, Anthony P. Tata, Mark D. Korich, Robert T. Dawsey
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Patent number: 9295184Abstract: A power electronic building block includes a housing; a power module mounted within the housing; a controller mounted within the housing and coupled to the power module; a capacitor assembly coupled to the power module and mounted within the housing; an AC bus bar mounted within the housing; and a DC bus bar coupling the capacitor assembly to the power module and mounted within the housing.Type: GrantFiled: December 2, 2013Date of Patent: March 22, 2016Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLCInventors: Mark D. Korich, Vicentiu Grosu, David Tang, Gregory S. Smith, Konstantinos Triantos
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Publication number: 20140168900Abstract: A power electronic building block includes a housing; a power module mounted within the housing; a controller mounted within the housing and coupled to the power module; a capacitor assembly coupled to the power module and mounted within the housing; an AC bus bar mounted within the housing; and a DC bus bar coupling the capacitor assembly to the power module and mounted within the housing.Type: ApplicationFiled: December 2, 2013Publication date: June 19, 2014Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLCInventors: MARK D. KORICH, VICENTIU GROSU, DAVID TANG, GREGORY S. SMITH, KONSTANTINOS TRIANTOS
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Publication number: 20140103758Abstract: An electrical system includes an alternating current (AC) connector rod assembly and a polyphase electric machine. The electric machine has a plurality of phase leads each electrically connected to the AC connector rod assembly. The assembly includes spaced AC connector rods each having a center axis. The assembly also includes insulating housings and a carrier plate defining through holes that receive and space the AC connector rods. The carrier plate defines features that engage mating features of the insulating housings while allowing each of the rods to rotate about its respective center axis within the carrier plate. A vehicle includes a direct current (DC) battery pack, a DC bus, an AC bus, a PIM that is electrically connected on a first side to the DC bus and on a second side to the AC bus, the AC connector rod assembly, a traction motor, and a transmission.Type: ApplicationFiled: October 15, 2012Publication date: April 17, 2014Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLCInventors: Young M Doo, Jimmy M Chang, Anthony P. Tata, Mark D. Korich, Robert T. Dawsey
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Patent number: 8570132Abstract: A power electronics assembly is provided. The assembly includes a housing defining at least one cavity and having a fluid passageway extending therethrough, the fluid passageway having first and second portions on respective first and second opposing sides of the at least one cavity, and a plurality of inductors housed within the at least one cavity of the housing such that the first and second portions of the fluid passageway are on first and second opposing sides of each of the plurality of inductors.Type: GrantFiled: October 27, 2009Date of Patent: October 29, 2013Assignee: GM Global Technology Operations LLCInventors: Yong M. Doo, Mark D. Korich, Konstantinos Triantos
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Publication number: 20130279119Abstract: Electronic assemblies and methods of fabricating electronic assemblies are provided herein. The electronic assembly includes a heat sink, a metal layer, and an electrical insulator layer. The metal layer defines at least a portion of an electrical circuit. The electrical insulator layer is disposed between the heat sink and the metal layer and is directly bonded to the heat sink.Type: ApplicationFiled: May 25, 2012Publication date: October 24, 2013Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLCInventors: Vicentiu GROSU, Mark D. KORICH, Terence G. WARD, Gregory S. SMITH
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Patent number: 8488315Abstract: A manifold is provided for supporting a power module assembly with a plurality of power modules. The manifold includes a first manifold section. The first face of the first manifold section is configured to receive the first power module, and the second face of the first manifold section defines a first cavity with a first baseplate thermally coupled to the first power module. The first face of the second manifold section is configured to receive the second power module, and the second face of the second manifold section defines a second cavity with a second baseplate thermally coupled to the second power module. The second face of the first manifold section and the second face of the second manifold section are coupled together such that the first cavity and the second cavity form a coolant channel. The first cavity is at least partially staggered with respect to second cavity.Type: GrantFiled: August 18, 2009Date of Patent: July 16, 2013Assignee: GM Global Technology Operations LLCInventors: Nicholas Hayden Herron, Brooks S. Mann, Mark D. Korich
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Patent number: 8476989Abstract: A filter for an automotive electrical system includes a substrate having first and second conductive members. First and second input terminals are mounted to the substrate. The first input terminal is electrically connected to the first conductive member, and the second input terminal is electrically connected to the second conductive member. A plurality of capacitors are mounted to the substrate. Each of the capacitors is electrically connected to at least one of the first and second conductive members. First and second power connectors are mounted to the substrate. The first power connector is electrically connected to the first conductive member, and the second power connector is electrically connected to the second conductive member. A common mode choke is coupled to the substrate and arranged such that the common mode choke extends around at least a portion of the substrate and the first and second conductive members.Type: GrantFiled: August 18, 2009Date of Patent: July 2, 2013Assignee: GM Global Technology Operations LLCInventors: Nicholas Hayden Herron, Douglas S. Carlson, David Tang, Mark D. Korich
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Patent number: 8279620Abstract: A power electronics assembly is provided. A first support member includes a first plurality of conductors. A first plurality of power switching devices are coupled to the first support member. A first capacitor is coupled to the first support member. A second support member includes a second plurality of conductors. A second plurality of power switching devices are coupled to the second support member. A second capacitor is coupled to the second support member. The first and second pluralities of conductors, the first and second pluralities of power switching devices, and the first and second capacitors are electrically connected such that the first plurality of power switching devices is connected in parallel with the first capacitor and the second capacitor and the second plurality of power switching devices is connected in parallel with the second capacitor and the first capacitor.Type: GrantFiled: December 7, 2009Date of Patent: October 2, 2012Assignee: GM Global Technology Operations LLCInventors: Nicholas Hayden Herron, Brooks S. Mann, Mark D. Korich, Cindy Chou, David Tang, Douglas S. Carlson, Alan L. Barry
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Patent number: 8248809Abstract: Systems and/or methods are provided for an inverter power module with distributed support for direct substrate cooling. An inverter module comprises a power electronic substrate. A first support frame is adapted to house the power electronic substrate and has a first region adapted to allow direct cooling of the power electronic substrate. A gasket is interposed between the power electronic substrate and the first support frame. The gasket is configured to provide a seal between the first region and the power electronic substrate. A second support frame is adapted to house the power electronic substrate and joined to the first support frame to form the seal.Type: GrantFiled: August 26, 2008Date of Patent: August 21, 2012Assignee: GM Global Technology Operations LLCInventors: David Harold Miller, Mark D. Korich, Terence G. Ward, Brooks S. Mann
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Patent number: 8193449Abstract: A busbar assembly for an inverter module has a power module, a capacitor module with at least one capacitor, and a battery all interconnected by a busbar. The busbar includes a base busbar portion that is electrically coupled to the battery and a branch busbar portion that extends from the base busbar to the power module and that electrically connects to the capacitor module at points located between the base node and the power module.Type: GrantFiled: October 13, 2008Date of Patent: June 5, 2012Assignee: GM Global Technology Operations LLCInventors: Gholamreza Esmaili, Konstantinos Triantos, Constantin C. Stancu, Larry A. Hagerty, David Tang, Mark L. Selogie, Mark D. Korich
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Patent number: 8059404Abstract: Power inverters include a frame and a power module. The frame has a sidewall including an opening and defining a fluid passageway. The power module is coupled to the frame over the opening and includes a substrate, die, and an encasement. The substrate includes a first side, a second side, a center, an outer periphery, and an outer edge, and the first side of the substrate comprises a first outer layer including a metal material. The die are positioned in the substrate center and are coupled to the substrate first side. The encasement is molded over the outer periphery on the substrate first side, the substrate second side, and the substrate outer edge and around the die. The encasement, coupled to the substrate, forms a seal with the metal material. The second side of the substrate is positioned to directly contact a fluid flowing through the fluid passageway.Type: GrantFiled: October 9, 2008Date of Patent: November 15, 2011Assignee: GM Global Technology Operations LLCInventors: David H. Miller, Mark D. Korich, Gregory S. Smith
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Patent number: 8052427Abstract: A connector assembly is provided for coupling an electric motor to a power source, wherein the power source comprises a first conductive member. The connector assembly comprises a non-conductive member having an inner channel configured to receive at least a portion of the first conductive member, a second conductive member slidably disposed within the inner channel, coupled to the electric motor, and configured to be coupled to, and to receive a force having a first direction from, the first conductive member, and a spring member, retained between the non-conductive member and the second conductive member and configured to resist movement of the second conductive member in the first direction.Type: GrantFiled: April 1, 2009Date of Patent: November 8, 2011Assignee: GM Global Technology Operations LLCInventors: Young M. Doo, Mark D. Korich, Mark L. Selogie
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Publication number: 20110186265Abstract: An attachment arrangement for a heat sink includes, but is not limited to, an attachment surface defined on the heat sink. A thermally conductive adhesive is disposed on the attachment surface. A substrate is attached to the attachment surface via the thermally conductive adhesive. The thermally conductive adhesive defines a discontinuity that is disposed in a delamination path of the thermally conductive adhesive.Type: ApplicationFiled: February 4, 2010Publication date: August 4, 2011Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.Inventors: YUNQI ZHENG, VICENTIU GROSU, KHIET LE, MARK D. KORICH
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Publication number: 20110170259Abstract: Power inverters include a frame and a power module. The frame has a sidewall including an opening and defining a fluid passageway. The power module is coupled to the frame over the opening and includes a substrate, die, and an encasement. The substrate includes a first side, a second side, a center, an outer periphery, and an outer edge, and the first side of the substrate comprises a first outer layer including a metal material. The die are positioned in the substrate center and are coupled to the substrate first side. The encasement is molded over the outer periphery on the substrate first side, the substrate second side, and the substrate outer edge and around the die. The encasement, coupled to the substrate, forms a seal with the metal material. The second side of the substrate is positioned to directly contact a fluid flowing through the fluid passageway.Type: ApplicationFiled: October 9, 2008Publication date: July 14, 2011Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.Inventors: DAVID H. MILLER, MARK D. KORICH, GREGORY S. SMITH
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Publication number: 20110168435Abstract: A printed circuit board includes, but is not limited to, a plurality of electrically conductive layers and a plurality of dielectric layers. Each dielectric layer is interposed between adjacent conductive layers to form a body of alternate conductive layers and dielectric layers. At least one of the electrically conductive layers protrudes beyond an end of the body.Type: ApplicationFiled: January 13, 2010Publication date: July 14, 2011Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.Inventors: ALAN L. BARRY, ELI B. SMITH, BROOKS S. MANN, NICHOLAS HAYDEN HERRON, MARK D. KORICH, DAVID TANG, CINDY CHOU
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Publication number: 20110096496Abstract: A power electronics assembly is provided. The assembly includes a housing defining at least one cavity and having a fluid passageway extending therethrough, the fluid passageway having first and second portions on respective first and second opposing sides of the at least one cavity, and a plurality of inductors housed within the at least one cavity of the housing such that the first and second portions of the fluid passageway are on first and second opposing sides of each of the plurality of inductors.Type: ApplicationFiled: October 27, 2009Publication date: April 28, 2011Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.Inventors: YOUNG M. DOO, MARK D. KORICH, KONSTANTINOS TRIANTOS
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Publication number: 20110069466Abstract: A power electronics assembly is provided. A first support member includes a first plurality of conductors. A first plurality of power switching devices are coupled to the first support member. A first capacitor is coupled to the first support member. A second support member includes a second plurality of conductors. A second plurality of power switching devices are coupled to the second support member. A second capacitor is coupled to the second support member. The first and second pluralities of conductors, the first and second pluralities of power switching devices, and the first and second capacitors are electrically connected such that the first plurality of power switching devices is connected in parallel with the first capacitor and the second capacitor and the second plurality of power switching devices is connected in parallel with the second capacitor and the first capacitor.Type: ApplicationFiled: December 7, 2009Publication date: March 24, 2011Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.Inventors: NICHOLAS HAYDEN HERRON, BROOKS S. MANN, MARK D. KORICH, CINDY CHOU, DAVID TANG, DOUGLAS S. CARLSON, ALAN L. BARRY
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Publication number: 20110067841Abstract: A heat sink is provided for that eliminates inefficient coolant bypass channels. The heat sink comprises a coolant cavity that is defined by a cover and a body portion. The thermally conductive cover includes a first plurality of substantially uniformly dispersed pin fins that extend at an angle from the inside surface of the cover towards a section of the body portion that is opposite the cover. The body portion opposite the cover includes a second plurality of pin fins that extend in the opposite direction from the first plurality. The coolant cavity also includes thermal bosses that protrude from an inside surface of the body portion. The bosses run parallel to the first and second plurality of pin fins and extend from a point near the thermally conductive cover to the section of the thermally conductive body portion that is opposite to the thermally conductive cover.Type: ApplicationFiled: September 24, 2009Publication date: March 24, 2011Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.Inventors: YOUNG M. DOO, MARK D. KORICH, STUART MORIWAKI, KONSTANTINOS TRIANTOS
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Patent number: 7907385Abstract: Systems and apparatus are provided for capacitor segments for use in a vehicle. A capacitor segment comprises an inner conductor configured to receive a first potential and having a generally L-shaped longitudinal cross-section. An outer conductor is configured to receive a second potential, and is electrically insulated from the inner conductor. The outer conductor comprises a first section having a generally L-shaped longitudinal cross-section aligned with the inner conductor, and a second section coupled to the first section and having a generally L-shaped lateral cross-section. The second section and the inner conductor define an inner region. A capacitor is located in the inner region and coupled to the inner conductor and the second section. The capacitor segment is configured such that current flows through the capacitor in a first direction, and current flows through the second section in a second direction that generally opposes the first direction.Type: GrantFiled: July 14, 2008Date of Patent: March 15, 2011Assignee: GM Global Technology Operations LLCInventors: Mark D. Korich, David Tang, Mark L. Selogie