Patents by Inventor Mark D. Korich

Mark D. Korich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9337558
    Abstract: An electrical system includes an alternating current (AC) connector rod assembly and a polyphase electric machine. The electric machine has a plurality of phase leads each electrically connected to the AC connector rod assembly. The assembly includes spaced AC connector rods each having a center axis. The assembly also includes insulating housings and a carrier plate defining through holes that receive and space the AC connector rods. The carrier plate defines features that engage mating features of the insulating housings while allowing each of the rods to rotate about its respective center axis within the carrier plate. A vehicle includes a direct current (DC) battery pack, a DC bus, an AC bus, a PIM that is electrically connected on a first side to the DC bus and on a second side to the AC bus, the AC connector rod assembly, a traction motor, and a transmission.
    Type: Grant
    Filed: October 15, 2012
    Date of Patent: May 10, 2016
    Assignee: GM Global Technology Operations LLC
    Inventors: Young M Doo, Jimmy M Chang, Anthony P. Tata, Mark D. Korich, Robert T. Dawsey
  • Patent number: 9295184
    Abstract: A power electronic building block includes a housing; a power module mounted within the housing; a controller mounted within the housing and coupled to the power module; a capacitor assembly coupled to the power module and mounted within the housing; an AC bus bar mounted within the housing; and a DC bus bar coupling the capacitor assembly to the power module and mounted within the housing.
    Type: Grant
    Filed: December 2, 2013
    Date of Patent: March 22, 2016
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Mark D. Korich, Vicentiu Grosu, David Tang, Gregory S. Smith, Konstantinos Triantos
  • Publication number: 20140168900
    Abstract: A power electronic building block includes a housing; a power module mounted within the housing; a controller mounted within the housing and coupled to the power module; a capacitor assembly coupled to the power module and mounted within the housing; an AC bus bar mounted within the housing; and a DC bus bar coupling the capacitor assembly to the power module and mounted within the housing.
    Type: Application
    Filed: December 2, 2013
    Publication date: June 19, 2014
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: MARK D. KORICH, VICENTIU GROSU, DAVID TANG, GREGORY S. SMITH, KONSTANTINOS TRIANTOS
  • Publication number: 20140103758
    Abstract: An electrical system includes an alternating current (AC) connector rod assembly and a polyphase electric machine. The electric machine has a plurality of phase leads each electrically connected to the AC connector rod assembly. The assembly includes spaced AC connector rods each having a center axis. The assembly also includes insulating housings and a carrier plate defining through holes that receive and space the AC connector rods. The carrier plate defines features that engage mating features of the insulating housings while allowing each of the rods to rotate about its respective center axis within the carrier plate. A vehicle includes a direct current (DC) battery pack, a DC bus, an AC bus, a PIM that is electrically connected on a first side to the DC bus and on a second side to the AC bus, the AC connector rod assembly, a traction motor, and a transmission.
    Type: Application
    Filed: October 15, 2012
    Publication date: April 17, 2014
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Young M Doo, Jimmy M Chang, Anthony P. Tata, Mark D. Korich, Robert T. Dawsey
  • Patent number: 8570132
    Abstract: A power electronics assembly is provided. The assembly includes a housing defining at least one cavity and having a fluid passageway extending therethrough, the fluid passageway having first and second portions on respective first and second opposing sides of the at least one cavity, and a plurality of inductors housed within the at least one cavity of the housing such that the first and second portions of the fluid passageway are on first and second opposing sides of each of the plurality of inductors.
    Type: Grant
    Filed: October 27, 2009
    Date of Patent: October 29, 2013
    Assignee: GM Global Technology Operations LLC
    Inventors: Yong M. Doo, Mark D. Korich, Konstantinos Triantos
  • Publication number: 20130279119
    Abstract: Electronic assemblies and methods of fabricating electronic assemblies are provided herein. The electronic assembly includes a heat sink, a metal layer, and an electrical insulator layer. The metal layer defines at least a portion of an electrical circuit. The electrical insulator layer is disposed between the heat sink and the metal layer and is directly bonded to the heat sink.
    Type: Application
    Filed: May 25, 2012
    Publication date: October 24, 2013
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Vicentiu GROSU, Mark D. KORICH, Terence G. WARD, Gregory S. SMITH
  • Patent number: 8488315
    Abstract: A manifold is provided for supporting a power module assembly with a plurality of power modules. The manifold includes a first manifold section. The first face of the first manifold section is configured to receive the first power module, and the second face of the first manifold section defines a first cavity with a first baseplate thermally coupled to the first power module. The first face of the second manifold section is configured to receive the second power module, and the second face of the second manifold section defines a second cavity with a second baseplate thermally coupled to the second power module. The second face of the first manifold section and the second face of the second manifold section are coupled together such that the first cavity and the second cavity form a coolant channel. The first cavity is at least partially staggered with respect to second cavity.
    Type: Grant
    Filed: August 18, 2009
    Date of Patent: July 16, 2013
    Assignee: GM Global Technology Operations LLC
    Inventors: Nicholas Hayden Herron, Brooks S. Mann, Mark D. Korich
  • Patent number: 8476989
    Abstract: A filter for an automotive electrical system includes a substrate having first and second conductive members. First and second input terminals are mounted to the substrate. The first input terminal is electrically connected to the first conductive member, and the second input terminal is electrically connected to the second conductive member. A plurality of capacitors are mounted to the substrate. Each of the capacitors is electrically connected to at least one of the first and second conductive members. First and second power connectors are mounted to the substrate. The first power connector is electrically connected to the first conductive member, and the second power connector is electrically connected to the second conductive member. A common mode choke is coupled to the substrate and arranged such that the common mode choke extends around at least a portion of the substrate and the first and second conductive members.
    Type: Grant
    Filed: August 18, 2009
    Date of Patent: July 2, 2013
    Assignee: GM Global Technology Operations LLC
    Inventors: Nicholas Hayden Herron, Douglas S. Carlson, David Tang, Mark D. Korich
  • Patent number: 8279620
    Abstract: A power electronics assembly is provided. A first support member includes a first plurality of conductors. A first plurality of power switching devices are coupled to the first support member. A first capacitor is coupled to the first support member. A second support member includes a second plurality of conductors. A second plurality of power switching devices are coupled to the second support member. A second capacitor is coupled to the second support member. The first and second pluralities of conductors, the first and second pluralities of power switching devices, and the first and second capacitors are electrically connected such that the first plurality of power switching devices is connected in parallel with the first capacitor and the second capacitor and the second plurality of power switching devices is connected in parallel with the second capacitor and the first capacitor.
    Type: Grant
    Filed: December 7, 2009
    Date of Patent: October 2, 2012
    Assignee: GM Global Technology Operations LLC
    Inventors: Nicholas Hayden Herron, Brooks S. Mann, Mark D. Korich, Cindy Chou, David Tang, Douglas S. Carlson, Alan L. Barry
  • Patent number: 8248809
    Abstract: Systems and/or methods are provided for an inverter power module with distributed support for direct substrate cooling. An inverter module comprises a power electronic substrate. A first support frame is adapted to house the power electronic substrate and has a first region adapted to allow direct cooling of the power electronic substrate. A gasket is interposed between the power electronic substrate and the first support frame. The gasket is configured to provide a seal between the first region and the power electronic substrate. A second support frame is adapted to house the power electronic substrate and joined to the first support frame to form the seal.
    Type: Grant
    Filed: August 26, 2008
    Date of Patent: August 21, 2012
    Assignee: GM Global Technology Operations LLC
    Inventors: David Harold Miller, Mark D. Korich, Terence G. Ward, Brooks S. Mann
  • Patent number: 8193449
    Abstract: A busbar assembly for an inverter module has a power module, a capacitor module with at least one capacitor, and a battery all interconnected by a busbar. The busbar includes a base busbar portion that is electrically coupled to the battery and a branch busbar portion that extends from the base busbar to the power module and that electrically connects to the capacitor module at points located between the base node and the power module.
    Type: Grant
    Filed: October 13, 2008
    Date of Patent: June 5, 2012
    Assignee: GM Global Technology Operations LLC
    Inventors: Gholamreza Esmaili, Konstantinos Triantos, Constantin C. Stancu, Larry A. Hagerty, David Tang, Mark L. Selogie, Mark D. Korich
  • Patent number: 8059404
    Abstract: Power inverters include a frame and a power module. The frame has a sidewall including an opening and defining a fluid passageway. The power module is coupled to the frame over the opening and includes a substrate, die, and an encasement. The substrate includes a first side, a second side, a center, an outer periphery, and an outer edge, and the first side of the substrate comprises a first outer layer including a metal material. The die are positioned in the substrate center and are coupled to the substrate first side. The encasement is molded over the outer periphery on the substrate first side, the substrate second side, and the substrate outer edge and around the die. The encasement, coupled to the substrate, forms a seal with the metal material. The second side of the substrate is positioned to directly contact a fluid flowing through the fluid passageway.
    Type: Grant
    Filed: October 9, 2008
    Date of Patent: November 15, 2011
    Assignee: GM Global Technology Operations LLC
    Inventors: David H. Miller, Mark D. Korich, Gregory S. Smith
  • Patent number: 8052427
    Abstract: A connector assembly is provided for coupling an electric motor to a power source, wherein the power source comprises a first conductive member. The connector assembly comprises a non-conductive member having an inner channel configured to receive at least a portion of the first conductive member, a second conductive member slidably disposed within the inner channel, coupled to the electric motor, and configured to be coupled to, and to receive a force having a first direction from, the first conductive member, and a spring member, retained between the non-conductive member and the second conductive member and configured to resist movement of the second conductive member in the first direction.
    Type: Grant
    Filed: April 1, 2009
    Date of Patent: November 8, 2011
    Assignee: GM Global Technology Operations LLC
    Inventors: Young M. Doo, Mark D. Korich, Mark L. Selogie
  • Publication number: 20110186265
    Abstract: An attachment arrangement for a heat sink includes, but is not limited to, an attachment surface defined on the heat sink. A thermally conductive adhesive is disposed on the attachment surface. A substrate is attached to the attachment surface via the thermally conductive adhesive. The thermally conductive adhesive defines a discontinuity that is disposed in a delamination path of the thermally conductive adhesive.
    Type: Application
    Filed: February 4, 2010
    Publication date: August 4, 2011
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
    Inventors: YUNQI ZHENG, VICENTIU GROSU, KHIET LE, MARK D. KORICH
  • Publication number: 20110170259
    Abstract: Power inverters include a frame and a power module. The frame has a sidewall including an opening and defining a fluid passageway. The power module is coupled to the frame over the opening and includes a substrate, die, and an encasement. The substrate includes a first side, a second side, a center, an outer periphery, and an outer edge, and the first side of the substrate comprises a first outer layer including a metal material. The die are positioned in the substrate center and are coupled to the substrate first side. The encasement is molded over the outer periphery on the substrate first side, the substrate second side, and the substrate outer edge and around the die. The encasement, coupled to the substrate, forms a seal with the metal material. The second side of the substrate is positioned to directly contact a fluid flowing through the fluid passageway.
    Type: Application
    Filed: October 9, 2008
    Publication date: July 14, 2011
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
    Inventors: DAVID H. MILLER, MARK D. KORICH, GREGORY S. SMITH
  • Publication number: 20110168435
    Abstract: A printed circuit board includes, but is not limited to, a plurality of electrically conductive layers and a plurality of dielectric layers. Each dielectric layer is interposed between adjacent conductive layers to form a body of alternate conductive layers and dielectric layers. At least one of the electrically conductive layers protrudes beyond an end of the body.
    Type: Application
    Filed: January 13, 2010
    Publication date: July 14, 2011
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
    Inventors: ALAN L. BARRY, ELI B. SMITH, BROOKS S. MANN, NICHOLAS HAYDEN HERRON, MARK D. KORICH, DAVID TANG, CINDY CHOU
  • Publication number: 20110096496
    Abstract: A power electronics assembly is provided. The assembly includes a housing defining at least one cavity and having a fluid passageway extending therethrough, the fluid passageway having first and second portions on respective first and second opposing sides of the at least one cavity, and a plurality of inductors housed within the at least one cavity of the housing such that the first and second portions of the fluid passageway are on first and second opposing sides of each of the plurality of inductors.
    Type: Application
    Filed: October 27, 2009
    Publication date: April 28, 2011
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
    Inventors: YOUNG M. DOO, MARK D. KORICH, KONSTANTINOS TRIANTOS
  • Publication number: 20110069466
    Abstract: A power electronics assembly is provided. A first support member includes a first plurality of conductors. A first plurality of power switching devices are coupled to the first support member. A first capacitor is coupled to the first support member. A second support member includes a second plurality of conductors. A second plurality of power switching devices are coupled to the second support member. A second capacitor is coupled to the second support member. The first and second pluralities of conductors, the first and second pluralities of power switching devices, and the first and second capacitors are electrically connected such that the first plurality of power switching devices is connected in parallel with the first capacitor and the second capacitor and the second plurality of power switching devices is connected in parallel with the second capacitor and the first capacitor.
    Type: Application
    Filed: December 7, 2009
    Publication date: March 24, 2011
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
    Inventors: NICHOLAS HAYDEN HERRON, BROOKS S. MANN, MARK D. KORICH, CINDY CHOU, DAVID TANG, DOUGLAS S. CARLSON, ALAN L. BARRY
  • Publication number: 20110067841
    Abstract: A heat sink is provided for that eliminates inefficient coolant bypass channels. The heat sink comprises a coolant cavity that is defined by a cover and a body portion. The thermally conductive cover includes a first plurality of substantially uniformly dispersed pin fins that extend at an angle from the inside surface of the cover towards a section of the body portion that is opposite the cover. The body portion opposite the cover includes a second plurality of pin fins that extend in the opposite direction from the first plurality. The coolant cavity also includes thermal bosses that protrude from an inside surface of the body portion. The bosses run parallel to the first and second plurality of pin fins and extend from a point near the thermally conductive cover to the section of the thermally conductive body portion that is opposite to the thermally conductive cover.
    Type: Application
    Filed: September 24, 2009
    Publication date: March 24, 2011
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
    Inventors: YOUNG M. DOO, MARK D. KORICH, STUART MORIWAKI, KONSTANTINOS TRIANTOS
  • Patent number: 7907385
    Abstract: Systems and apparatus are provided for capacitor segments for use in a vehicle. A capacitor segment comprises an inner conductor configured to receive a first potential and having a generally L-shaped longitudinal cross-section. An outer conductor is configured to receive a second potential, and is electrically insulated from the inner conductor. The outer conductor comprises a first section having a generally L-shaped longitudinal cross-section aligned with the inner conductor, and a second section coupled to the first section and having a generally L-shaped lateral cross-section. The second section and the inner conductor define an inner region. A capacitor is located in the inner region and coupled to the inner conductor and the second section. The capacitor segment is configured such that current flows through the capacitor in a first direction, and current flows through the second section in a second direction that generally opposes the first direction.
    Type: Grant
    Filed: July 14, 2008
    Date of Patent: March 15, 2011
    Assignee: GM Global Technology Operations LLC
    Inventors: Mark D. Korich, David Tang, Mark L. Selogie