Patents by Inventor Mark D. Kraman

Mark D. Kraman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Rolled-up electromagnetic component for on-chip applications and method of making a rolled-up electromagnetic component
    Patent number: 11031456
    Abstract: A rolled-up electromagnetic component for on-chip applications comprises: a multilayer sheet in a rolled configuration comprising at least one turn about a longitudinal axis; a core defined by a first turn of the rolled configuration; and a soft magnetic material disposed within the core, where the multilayer sheet comprises a conductive pattern layer on a strain-relieved layer. A method of making a rolled-up electromagnetic component for on-chip applications includes forming a rolled-up device comprising: a multilayer sheet in a rolled configuration having at least one turn about a longitudinal axis, where the multilayer sheet comprises a conductive pattern layer on a strain-relieved layer; and a core defined by a first turn of the rolled configuration. The method further includes introducing a soft magnetic material into the core.
    Type: Grant
    Filed: June 7, 2019
    Date of Patent: June 8, 2021
    Assignee: The Board of Trustees of the University of Illinois
    Inventors: Xiuling Li, Wen Huang, Zhendong Yang, Mark D. Kraman, Jimmy Ni, Zihao Ou, Qian Chen, J. Gary Eden
  • ROLLED-UP ELECTROMAGNETIC COMPONENT FOR ON-CHIP APPLICATIONS AND METHOD OF MAKING A ROLLED-UP ELECTROMAGNETIC COMPONENT
    Publication number: 20190378890
    Abstract: A rolled-up electromagnetic component for on-chip applications comprises: a multilayer sheet in a rolled configuration comprising at least one turn about a longitudinal axis; a core defined by a first turn of the rolled configuration; and a soft magnetic material disposed within the core, where the multilayer sheet comprises a conductive pattern layer on a strain-relieved layer. A method of making a rolled-up electromagnetic component for on-chip applications includes forming a rolled-up device comprising: a multilayer sheet in a rolled configuration having at least one turn about a longitudinal axis, where the multilayer sheet comprises a conductive pattern layer on a strain-relieved layer; and a core defined by a first turn of the rolled configuration. The method further includes introducing a soft magnetic material into the core.
    Type: Application
    Filed: June 7, 2019
    Publication date: December 12, 2019
    Inventors: Xiuling Li, Wen Huang, Zhendong Yang, Mark D. Kraman, Jimmy Ni, Zihao Ou, Qian Chen, J. Gary Eden