Abstract: A method and system for a dynamic keying system is disclosed. The method and system can include a male connector device having a first plurality of settings for one or more key features, and a female connector device having a second plurality of settings for one or more key features. The female connector device can be configured to operate in an initial mode in which it is configured to, in response to the introduction of the male connector device, correspond a first setting of the first plurality of settings to a second setting of the second plurality of settings. The female connector device can also be configured to operate in a subsequent mode, in which it can permit coupling with at least one male connector device having the first setting and consistently deny access to at least one male connector device having a third setting different than the first setting.

Abstract: A method and system for a dynamic keying system is disclosed. The method and system can include a male connector device having a first plurality of settings for one or more key features, and a female connector device having a second plurality of settings for one or more key features. The female connector device can be configured to operate in an initial mode in which it is configured to, in response to the introduction of the male connector device, correspond a first setting of the first plurality of settings to a second setting of the second plurality of settings. The female connector device can also be configured to operate in a subsequent mode, in which it can permit coupling with at least one male connector device having the first setting and consistently deny access to at least one male connector device having a third setting different than the first setting.

Abstract: In an example, a process includes forming a patterned layer on a polymer substrate. The process also includes depositing a graphene-containing material on the patterned layer to form a plurality of graphene traces of a tamper detection circuit.

Abstract: A computer system may determine a target position of the electronic component. The computer system may also determine a current position of the electronic component. The computer system may compare the current position to the target to position to determine whether the electronic component is in the target position. If the electronic component is not in the target position, the computer system may use an electroactive polymer to adjust the position of the electronic component to move the electronic component into the target position.

Abstract: A cable, system, and method for cooling a semiconductor chip on an active cable. The active cable includes a heat sink that is thermally coupled to the semiconductor chip and movable from a retracted position to an extended position. The heat sink is in the retracted position when the active cable is not installed in a card connector in a computer case. After the active cable is installed in the card connector, the heat sink is urged to the extended position in which the heat sink is exposed to air flow circulation within the computer case.

Abstract: Disclosed is a shape memory polymer (SMP) thermal interface material. The shape memory polymer may include a SMP matrix. The SMP matrix may include a liquid crystal elastomer. The SMP material may also include a thermally conductive filler embedded within the SMP matrix. The thermally conductive filler may include one or more substantially aligned subcomponents.

Abstract: An apparatus can dynamically adjust, in a card edge connector including first and second positions, an opening configured to receive a printed-circuit card. The apparatus may also include a set of contacts configured to connect with a set of edges of the printed-circuit card in the second position. The apparatus may also include a set of electroactive polymers configured to adjust the set of contacts between the first position and the second position by changing thickness in response to voltages applied to electrodes positioned adjacent to opposing faces of the set of electroactive polymers. The set of electroactive polymers can also include an electroactive polymer configured to control a single contact of the set of contacts.

Abstract: Embodiments of the disclosure relate to an apparatus and method for mitigation of warping of assembly components when subject to a thermal event. An interface unit with a complementary coefficient of thermal expansion is embodied in the assembly. The interface unit is configured to be received by a connector joined to the assembly substrate. The interface unit has a coefficient of thermal expansion (CTE) that complements the CTE of the assembly components in order to maintain the connector in alignment with the substrate and enable the connector to expand or contract with the substrate when subject to the thermal event.

Abstract: Embodiments of the disclosure relate to an apparatus and method for mitigation of warping of assembly components when subject to a thermal event. An interface unit with a complementary coefficient of thermal expansion is embodied in the assembly. The interface unit is configured to be received by a connector joined to the assembly substrate. The interface unit has a coefficient of thermal expansion (CTE) that complements the CTE of the assembly components in order to maintain the connector in alignment with the substrate and enable the connector to expand or contract with the substrate when subject to the thermal event.

Abstract: A cable, system, and method for cooling a semiconductor chip on an active cable. The active cable includes a heat sink that is thermally coupled to the semiconductor chip and movable from a retracted position to an extended position. The heat sink is in the retracted position when the active cable is not installed in a card connector in a computer case. After the active cable is installed in the card connector, the heat sink is urged to the extended position in which the heat sink is exposed to air flow circulation within the computer case.

Abstract: A method and system for a dynamic keying system is disclosed. The method and system can include a male connector device having a first plurality of settings for one or more key features, and a female connector device having a second plurality of settings for one or more key features. The female connector device can be configured to operate in an initial mode in which it is configured to, in response to the introduction of the male connector device, correspond a first setting of the first plurality of settings to a second setting of the second plurality of settings. The female connector device can also be configured to operate in a subsequent mode, in which it can permit coupling with at least one male connector device having the first setting and consistently deny access to at least one male connector device having a third setting different than the first setting.

Abstract: Disclosed aspects relate to managing a set of devices using a set of acoustic emission data which indicates device-health of the set of devices. The set of devices is coupled with a set of acoustic emission sensors. Based on the set of acoustic emission data, a triggering event related to a first device of the set of devices is detected. Using the set of acoustic emission data, an event response which includes a first modification with respect to operation of the first device is determined. Establishment of the event response which includes the first modification with respect to operation of the first device is initiated.

Abstract: A shape memory polymer thermal interface material (SMP TIM) pad may be deformed to a deformed SMP TIM pad. The deformed SMP TIM pad may be mated to a first surface of a computing chip. A heat dissipating structure may be mated to the deformed SMP TIM pad opposite of the first surface of the computing chip. A loading force may be applied to the SMP TIM pad. The deformed SMP TIM pad may be heated to a reformation temperature. The heat dissipating structure may be fastened to the computing chip using one or more fasteners.

Abstract: A method and system for a dynamic keying system is disclosed. The method and system can include a male connector device having a first plurality of settings for one or more key features, and a female connector device having a second plurality of settings for one or more key features. The female connector device can be configured to operate in an initial mode in which it is configured to, in response to the introduction of the male connector device, correspond a first setting of the first plurality of settings to a second setting of the second plurality of settings. The female connector device can also be configured to operate in a subsequent mode, in which it can permit coupling with at least one male connector device having the first setting and consistently deny access to at least one male connector device having a third setting different than the first setting.

Abstract: Disclosed is a shape memory polymer (SMP) thermal interface material. The shape memory polymer may include a SMP matrix. The SMP matrix may include a liquid crystal elastomer. The SMP material may also include a thermally conductive filler embedded within the SMP matrix. The thermally conductive filler may include one or more substantially aligned subcomponents.

Abstract: A method and system for a dynamic keying system is disclosed. The method and system can include a male connector device having a first plurality of settings for one or more key features, and a female connector device having a second plurality of settings for one or more key features. The female connector device can be configured to operate in an initial mode in which it is configured to, in response to the introduction of the male connector device, correspond a first setting of the first plurality of settings to a second setting of the second plurality of settings. The female connector device can also be configured to operate in a subsequent mode, in which it can permit coupling with at least one male connector device having the first setting and consistently deny access to at least one male connector device having a third setting different than the first setting.

Abstract: Disclosed aspects include an apparatus having a card edge connector which has first and second positions. The apparatus may include a set of contacts to connect with a set of card edges in the second position. To adjust the set of contacts between the first position and the second position, the apparatus may include a set of electroactive polymers. Disclosed aspects include card edge connector management. It may be detected that a card edge connector is in a first position. A request for the card edge connector to be in a second position can be received. It is determined to adjust the card edge connector. The card edge connector is adjusted using a set of electroactive polymers. In embodiments, such adjustment can include introducing a voltage which causes the set of electroactive polymers to adjust a set of contacts between the first and second positions.

Abstract: A system for mitigating vibration of a mass may include an elastic membrane enclosing at least one interior space and having an outer surface, where at least a bottom portion of the outer surface is coupled to a transportable supportive surface, and at least a top portion of the outer surface supports a load. The system may further include at least one port coupling the outer surface to the at least one interior space, where the port provides a source of fluid ingress into the interior space and fluid egress out of the interior space. The system may additionally include granular material distributed within the at least one interior space, where a packing density of the granular material is adjustable between a first jammed state having a first packing density of granular materials and a second jammed state having a second packing density of granular materials to accommodate different loads.

Abstract: A shape memory polymer thermal interface material (SMP TIM) pad may be deformed to a deformed SMP TIM pad. The deformed SMP TIM pad may be mated to a first surface of a computing chip. A heat dissipating structure may be mated to the deformed SMP TIM pad opposite of the first surface of the computing chip. A loading force may be applied to the SMP TIM pad. The deformed SMP TIM pad may be heated to a reformation temperature. The heat dissipating structure may be fastened to the computing chip using one or more fasteners.

Abstract: According to embodiments of the invention, an electronic component assembly may be provided. The electronic component assembly may include an electronic component body. The electronic component assembly may also include one or more elastic members affixed to the electronic component body. The electronic component assembly may also include a catch mechanism affixed to each elastic member adapted to allow insertion of the elastic member and the catch mechanism through a hole of a circuit board in an extended position, and upon release from the extended position, hold the electronic component body in a fixed position by the tension of the elastic member and the catch mechanism grasping an edge of a surface of the circuit board opposite a surface upon which the electronic component body rests.