Abstract: Using a suction gripper cluster device is disclosed, including: causing airflows to be generated by a plurality of airflow generators of a respective plurality of suction gripper mechanisms included in a suction gripper cluster device comprising a plurality of suction gripper mechanisms, wherein the plurality of airflow generators is configured to cause the airflows to enter respective intake ports of the plurality of suction gripper mechanisms and exit respective outlet ports of the respective plurality of suction gripper mechanisms in response to receiving air at a respective air input port of the respective plurality of suction gripper mechanisms; causing a target object to be captured by the suction gripper cluster device using the airflows; activating a positioning actuator mechanism to position the suction gripper cluster device; and causing the target object to be ejected from the suction gripper cluster device.

Abstract: A compliant counter-flow cold plate for component cooling includes a manifold body configured to be thermally coupled to a heat generating component and configured to be compliant under a distributed pressure load, and a plurality of expanding channels within the manifold body. At least one of the plurality of expanding channels extends from an inlet portion of the manifold body to an outlet portion of the manifold body.

Abstract: An optical module includes an optoelectronic assembly and a heat spreader. The optoelectronic assembly includes a flat, rigid substrate, an array of electrical contacts positioned on a first portion of the substrate, and an optoelectronics assemblage that is electrically connected to the array of contacts and is positioned apart from the array of electrical contacts. The heat spreader is comprised of a thermally conductive material and comprises a second portion that is structurally connected to the first portion and a third portion that is thermally connected to the optoelectronics assemblage.

Abstract: An electronic module assembly is provided. The electronic module assembly may include one or more processors mounted to a laminate, a top frame mounted to the laminate and surrounding the one or more processors, and a removable lid covering the one or more processors. The removable lid includes latches arranged along a perimeter of the removable lid, the latches engage with a lip of the top frame and secure the removable lid to the module assembly, and the removable lid can only be removed from the module assembly by releasing all of the latches.

Abstract: A cold plate apparatus that has an outlet plenum leading to an outlet opening includes an outlet transition that connects the outlet opening to the outlet plenum. The outlet transition defines a smoothly curving flow path from a direction along a long dimension of the outlet plenum, which is parallel to a plane defined by the outlet opening, to a direction along a centerline of the outlet opening, which is at an angle from the plane defined by the outlet opening. The outlet transition provides a smooth variation of cross-sectional area from the outlet plenum to the outlet opening.

Abstract: A data center cooling system has an indoor portion wherein heat is absorbed from components in the data center, and an outdoor heat exchanger portion wherein outside air is used to cool a first heat transfer fluid (e.g., water) present in at least the outdoor heat exchanger portion of the cooling system during a first mode. When an appropriate time has been reached to switch from the first mode to a second mode, the outdoor heat exchanger portion of the data cooling system is switched to a second heat transfer fluid, which is a relatively low performance heat transfer fluid (compared to the first fluid). It has a second heat transfer fluid freezing point, lower than the first heat transfer fluid freezing point, and sufficiently low to operate without freezing when the outdoor air temperature drops below a first predetermined relationship with the first heat transfer fluid freezing point.

Abstract: A cold plate apparatus that has an outlet plenum leading to an outlet opening includes an outlet transition that connects the outlet opening to the outlet plenum. The outlet transition defines a smoothly curving flow path from a direction along a long dimension of the outlet plenum, which is parallel to a plane defined by the outlet opening, to a direction along a centerline of the outlet opening, which is at an angle from the plane defined by the outlet opening. The outlet transition provides a smooth variation of cross-sectional area from the outlet plenum to the outlet opening.

Abstract: An integrated circuit package provides a high bandwidth interconnect between wafers using a very high density interconnect using a silicon bridge or a multi-layer flex between wafers. In some embodiments, more than one wafer may be mounted and connected with a rigid silicon bridge onto a common substrate. This common substrate can be matched, with respect to their coefficients of thermal expansion (CTE), to the silicon wafer. The CTE matched substrate can reduce the thermal mechanical stress on the wafers and the rigid silicon bridge interconnect. In some embodiments, a thinned silicon bridge is utilized to interconnect wafers which are mounted on separate glass substrates. The thinned bridge would allow for mechanical compliance between the wafers. In some embodiments, the wafers can be mounted onto separate glass substrates and attached with a fine pitch multi-layer flex structure which provides compliance between the wafers.

Abstract: Embodiments of the invention include a method of preparing an integrated circuit (IC) chip to participate in test operations. The method includes accessing a back surface of the IC chip and adding a back-surface topography to the back surface. A surface area of the back-surface topography is greater than a surface area of the back surface.

Abstract: An electronic module assembly is provided. The electronic module assembly may include one or more processors mounted to a laminate, a top frame mounted to the laminate and surrounding the one or more processors, and a removable lid covering the one or more processors. The removable lid includes latches arranged along a perimeter of the removable lid, the latches engage with a lip of the top frame and secure the removable lid to the module assembly, and the removable lid can only be removed from the module assembly by releasing all of the latches.

Abstract: An electronic assembly is provided. The electronic assembly may include an electronic module mounted to a laminate, a cooling apparatus directly above the module, a single thermal interface material positioned between and directly contacting the module and the cooling apparatus, and a rotating cover rotatably attached to a top frame secured to the laminate, wherein the rotating cover includes an open position and a closed position.

Abstract: Methods and apparatus of forming a thermal interface with condensate are described. In an example, a device may be disposed in a test environment or a test apparatus. An amount of condensate may be accumulated on a heat sink to coat the heat sink with a layer of condensate. The coated heat sink may be disposed on the device, where the layer of condensate is directed towards the device, and the disposal of the coated heat sink causes the layer of condensate to spread among voids between the heat sink and the device to form a thermal interface that includes the condensate. A test may be executed on the device with the thermal interface comprising the condensate between the coated heat sink and the device.

Abstract: An assembled circuit board has a topology that defines positions, dimensions and power dissipation of components mounted to the circuit board, including a high power component and one or more low power components. A cold plate makes thermal contact to the high power component through a thermal interface material. A thermally conductive sheet overlays the circuit board and is formed to match the topology of the low power component or components. The sheet has a first portion that makes thermal contact with the cold plate and a second portion that overlays the low power component or components. The cold plate removes heat directly from the high power component and indirectly through the thermally conductive sheet from the low power component or components. The thermally conductive sheet conforms to the topology of the low power components either by preforming or by flexibility.

Abstract: An optical module includes an optoelectronic assembly and a heat spreader. The optoelectronic assembly includes a flat, rigid substrate, an array of electrical contacts positioned on a first portion of the substrate, and an optoelectronics assemblage that is electrically connected to the array of contacts and is positioned apart from the array of electrical contacts. The heat spreader is comprised of a thermally conductive material and comprises a second portion that is structurally connected to the first portion and a third portion that is thermally connected to the optoelectronics assemblage.

Abstract: A cold plate apparatus includes walls that surround an active volume adjacent to an inlet plenum; the walls include an inlet opening at one end of a top side of the inlet plenum and a plenum opening between the inlet plenum and the active volume. Also included is a blocker that partially separates the inlet plenum from the active volume. The blocker is structurally configured to preferentially redirect flow from the inlet plenum into the active volume.

Abstract: A cold plate apparatus that has an outlet plenum leading to an outlet opening includes an outlet transition that connects the outlet opening to the outlet plenum. The outlet transition defines a smoothly curving flow path from a direction along a long dimension of the outlet plenum, which is parallel to a plane defined by the outlet opening, to a direction along a centerline of the outlet opening, which is at an angle from the plane defined by the outlet opening. The outlet transition provides a smooth variation of cross-sectional area from the outlet plenum to the outlet opening.

Abstract: A data processing system includes a first wafer comprising a plurality of first chips, and kerf and crack-stop structures around perimeters of the first chips, and a second wafer comprising a plurality second chips, a plurality of interconnect structures through a connection zone between the second chips, and a plurality of thru silicon vias, wherein the first wafer and the second wafer are bonded face-to-face such that the interconnect structures of the second wafer electrically connect adjacent chip sites of the first wafer and where a pitch of the chips on the first and second wafer are equal.

Abstract: A drive system for a fluid displacement pump includes an electric motor, a drive coupled to the rotor at a first end of the electric motor, a fluid displacement member mechanically coupled to the drive, and a pump frame mechanically coupled to the electric motor. The electric motor includes a stator and a rotor disposed on an axis. The drive coupled to the rotor converts the rotational output to a linear, reciprocating input to the fluid displacement member. The rotor is disposed about the stator to rotate about the stator.

Abstract: An apparatus includes a fin pack of parallel plates that protrude from a base, a lid attachable to the fin pack opposite the base, and a brazing material painted onto the lid only in a plurality of wettable regions. The lid is positioned against the fin pack, opposite the base, with portions of the plurality of regions contacting edges of the parallel plates. The lid is brazed to the fin pack without intrusion of the brazing material between the parallel plates. This is accomplished by obtaining a lid to be attached to a fin pack of parallel plates that protrude from a base, painting the lid with the brazing material only in a plurality of wettable regions, positioning the lid against the fin pack, opposite the base, with portions of the plurality of regions contacting edges of the parallel plates, and brazing the lid to the fin pack.

Abstract: A data processing system includes a first wafer comprising a plurality of first chips, and kerf and crack-stop structures around perimeters of the first chips, and a second wafer comprising a plurality second chips, a plurality of interconnect structures through a connection zone between the second chips, and a plurality of thru silicon vias, wherein the first wafer and the second wafer are bonded face-to-face such that the interconnect structures of the second wafer electrically connect adjacent chip sites of the first wafer and where a pitch of the chips on the first and second wafer are equal.