Patents by Inventor Mark D. Schultz
Mark D. Schultz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8978401Abstract: A data center cooling system may include heat transfer equipment to cool a liquid coolant without vapor compression refrigeration, and the liquid coolant is used on a liquid cooled information technology equipment rack housed in the data center. The system may also include a controller-apparatus to regulate the liquid coolant flow to the liquid cooled information technology equipment rack through a range of liquid coolant flow values based upon information technology equipment temperature thresholds.Type: GrantFiled: August 17, 2012Date of Patent: March 17, 2015Assignee: International Business Machines CorporationInventors: Timothy J. Chainer, Hien P. Dang, Pritish R. Parida, Mark D. Schultz, Arun Sharma
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Publication number: 20140190681Abstract: A method for controlling a cooling system based on a heat dissipation of an electronic module and an ambient air temperature includes determining a combination of individual controls on components of the cooling system that achieve a specific amount of cooling based on a cooling power relationship for the plurality of components, the heat dissipation of the electronic module and the ambient air temperature, and applying the individual controls to the plurality of components.Type: ApplicationFiled: January 10, 2013Publication date: July 10, 2014Applicant: International Business Machines CorporationInventors: Timothy J. Chainer, Pritish R. Parida, Mark D. Schultz
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Patent number: 8760186Abstract: A probe apparatus is provided and includes a probe layer formed with a through-hole, a conductor, electrically coupled to test equipment, disposed on and insulated from a through-hole sidewall, a probe disposed within the through-hole to be spaced from the conductor and thereby movable upon application of an external force thereto and a compliant layer connected to the probe and sufficiently compliant to allow the probe to at least temporarily contact the conductor upon the application of the external force thereto.Type: GrantFiled: February 19, 2010Date of Patent: June 24, 2014Assignee: International Business Machines CorporationInventor: Mark D. Schultz
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Patent number: 8746000Abstract: According to one embodiment, a system for removing heat from a rack of information technology equipment may include a sidecar indoor air to liquid heat exchanger that cools warm air generated by the rack of information technology equipment. The system may also include a liquid to liquid heat exchanger and an outdoor heat exchanger. The system may further include configurable pathways to connect and control fluid flow through the sidecar heat exchanger, the liquid to liquid heat exchanger, the rack of information technology equipment, and the outdoor heat exchanger based upon ambient temperature and/or ambient humidity to remove heat from the rack of information technology equipment.Type: GrantFiled: August 16, 2012Date of Patent: June 10, 2014Assignee: International Business Machines CorporationInventor: Mark D. Schultz
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Publication number: 20140153607Abstract: A method includes determining a relationship between indirect thermal data for a processor and a measured temperature associated with the processor, during a calibration process, obtaining the indirect thermal data for the processor during actual operation of the processor, and determining an actual significant temperature associated with the processor during the actual operation using the indirect thermal data for the processor during actual operation of the processor and the relationship.Type: ApplicationFiled: November 30, 2012Publication date: June 5, 2014Applicant: International Business Machines CorporationInventors: Timothy J. Chainer, Pritish R. Parida, Mark D. Schultz
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Patent number: 8736048Abstract: A multi-chip module (MCM) structure comprises more than one semiconductor chip lying in a horizontal plane, the MCM having individual chip contact patches on the chips and a flexible heat sink having lateral compliance and extending in a plane in the MCM and secured in a heat exchange relation to the chips through the contact patches. The MCM has a mismatch between the coefficient of thermal expansion of the heat sink and the MCM and also has chip tilt and chip height mismatches. The flexible heat sink with lateral compliance minimizes or eliminates shear stress and shear strain developed in the horizontal direction at the interface between the heat sink and the chip contact patches by allowing for horizontal expansion and contraction of the heat sink relative to the MCM without moving the individual chip contact patches in a horizontal direction.Type: GrantFiled: February 16, 2012Date of Patent: May 27, 2014Assignee: International Business Machines CorporationInventor: Mark D. Schultz
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Patent number: 8649177Abstract: A method of fabricating a liquid-cooled electronic system is provided which includes an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket. The method includes providing a liquid-cooled cold rail at the one end of the socket, and a thermal spreader to couple the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.Type: GrantFiled: April 20, 2012Date of Patent: February 11, 2014Assignee: International Business Machines CorporationInventors: Timothy J. Chainer, Michael A. Gaynes, David P. Graybill, Madhusudan K. Iyengar, Vinod Kamath, Bejoy J. Kochuparambil, Roger R. Schmidt, Mark D. Schultz, Daniel P. Simco, Mark E. Steinke
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Publication number: 20140020418Abstract: A data center cooling system may include heat transfer equipment to cool a liquid coolant without vapor compression refrigeration, and the liquid coolant is used on a liquid cooled information technology equipment rack housed in the data center. The system may also include a controller-apparatus to regulate the liquid coolant flow to the liquid cooled information technology equipment rack through a range of liquid coolant flow values based upon information technology equipment temperature thresholds.Type: ApplicationFiled: August 17, 2012Publication date: January 23, 2014Applicant: International Business Machines CorporationInventors: Timothy J. Chainer, Hien P. Dang, Pritish R. Parida, Mark D. Schultz, Arun Sharma
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Publication number: 20140020885Abstract: A method aspect for removing heat from a data center may use liquid coolant cooled without vapor compression refrigeration on a liquid cooled information technology equipment rack. The method may also include regulating liquid coolant flow to the data center through a range of liquid coolant flow values with a controller-apparatus based upon information technology equipment temperature threshold of the data center.Type: ApplicationFiled: July 18, 2012Publication date: January 23, 2014Applicant: International Business Machines CorporationInventors: Timothy J. Chainer, Hien P. Dang, Pritish R. Parida, Mark D. Schultz, Arun Sharma
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Publication number: 20140020884Abstract: According to one embodiment, a system for removing heat from a rack of information technology equipment may include a sidecar indoor air to liquid heat exchanger that cools air utilized by the rack of information technology equipment to cool the rack of information technology equipment. The system may also include a liquid to liquid heat exchanger and an outdoor heat exchanger. The system may further include configurable pathways to connect and control fluid flow through the sidecar heat exchanger, the liquid to liquid heat exchanger, the rack of information technology equipment, and the outdoor heat exchanger based upon ambient temperature and/or ambient humidity to remove heat generated by the rack of information technology equipment.Type: ApplicationFiled: July 18, 2012Publication date: January 23, 2014Applicant: International Business Machines CorporationInventor: Mark D. Schultz
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Publication number: 20140022725Abstract: According to one embodiment, a system for removing heat from a rack of information technology equipment may include a sidecar indoor air to liquid heat exchanger that cools warm air generated by the rack of information technology equipment. The system may also include a liquid to liquid heat exchanger and an outdoor heat exchanger. The system may further include configurable pathways to connect and control fluid flow through the sidecar heat exchanger, the liquid to liquid heat exchanger, the rack of information technology equipment, and the outdoor heat exchanger based upon ambient temperature and/or ambient humidity to remove heat from the rack of information technology equipment.Type: ApplicationFiled: August 16, 2012Publication date: January 23, 2014Applicant: International Business Machines CorporationInventor: Mark D. Schultz
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Publication number: 20130214406Abstract: A multi-chip module (MCM) structure comprises more than one semiconductor chip lying in a horizontal plane, the MCM having individual chip contact patches on the chips and a flexible heat sink having lateral compliance and extending in a plane in the MCM and secured in a heat exchange relation to the chips through the contact patches. The MCM has a mismatch between the coefficient of thermal expansion of the heat sink and the MCM and also has chip tilt and chip height mismatches. The flexible heat sink with lateral compliance minimizes or eliminates shear stress and shear strain developed in the horizontal direction at the interface between the heat sink and the chip contact patches by allowing for horizontal expansion and contraction of the heat sink relative to the MCM without moving the individual chip contact patches in a horizontal direction.Type: ApplicationFiled: February 16, 2012Publication date: August 22, 2013Applicant: International Business Machines CorporationInventor: Mark D. Schultz
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Publication number: 20130199767Abstract: A heat sink includes a plurality of layers being disposed substantially parallel with a surface of a heat source. The layers include a plurality of pin portions spaced apart from each other in a planar arrangement wherein the pin portions of the layers are stacked and bonded to form pin fins extending in a transverse direction relative to the heat source to sink heat. A compliant layer is disposed between the pin fins and a mechanical load. The compliant layer provides compliance such that the pin fins accommodate dimensional differences when interfacing with the heat source.Type: ApplicationFiled: February 2, 2012Publication date: August 8, 2013Applicant: International Business Machines CorporationInventors: John P. Karidis, Mark D. Schultz
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Patent number: 8493738Abstract: Liquid-cooled electronic systems are provided which include an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket or removal of the card from the socket. A liquid-cooled cold rail is disposed at the one end of the socket, and a thermal spreader couples the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The thermally conductive extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.Type: GrantFiled: May 6, 2011Date of Patent: July 23, 2013Assignee: International Business Machines CorporationInventors: Timothy J. Chainer, Michael A. Gaynes, David P. Graybill, Madhusudan K. Iyengar, Vinod Kamath, Bejoy J. Kochuparambil, Roger R. Schmidt, Mark D. Schultz, Daniel P. Simco, Mark E. Steinke
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Publication number: 20130138252Abstract: Cooling apparatuses and methods are provided which include one or more coolant-cooled structures associated with an electronics rack, a coolant loop coupled in fluid communication with one or more passages of the coolant-cooled structure(s), one or more heat exchange units coupled to facilitate heat transfer from coolant within the coolant loop, and N controllable components associated with the coolant loop or the heat exchange unit(s), wherein N?1. The N controllable components facilitate circulation of coolant through the coolant loop or transfer of heat from the coolant via the heat exchange unit(s). A controller is coupled to the N controllable components, and dynamically adjusts operation of the N controllable components, based on Z input parameters and one or more specified constraints, to provide a specified cooling to the coolant-cooled structure(s), while limiting energy consumed by the N controllable components, wherein Z?1.Type: ApplicationFiled: November 29, 2011Publication date: May 30, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Timothy J. CHAINER, Milnes P. DAVID, Madhusudan K. IYENGAR, Pritish R. PARIDA, Roger R. SCHMIDT, Mark D. SCHULTZ
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Publication number: 20130014926Abstract: A data center cooling system is operated in a first mode; it has an indoor portion wherein heat is absorbed from components in the data center, and an outdoor heat exchanger portion wherein outside air is used to cool a first heat transfer fluid (e.g., water) present in at least the outdoor heat exchanger portion of the cooling system during the first mode. The first heat transfer fluid is a relatively high performance heat transfer fluid (as compared to the second fluid), and has a first heat transfer fluid freezing point. A determination is made that an appropriate time has been reached to switch from the first mode to a second mode. Based on this determination, the outdoor heat exchanger portion of the data cooling system is switched to a second heat transfer fluid, which is a relatively low performance heat transfer fluid, as compared to the first heat transfer fluid.Type: ApplicationFiled: July 15, 2011Publication date: January 17, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Madhusudan K. Iyengar, Pritish R. Parida, Mark D. Schultz
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Publication number: 20120279047Abstract: A method of fabricating a liquid-cooled electronic system is provided which includes an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket. The method includes providing a liquid-cooled cold rail at the one end of the socket, and a thermal spreader to couple the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.Type: ApplicationFiled: April 20, 2012Publication date: November 8, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Timothy J. CHAINER, Michael A. GAYNES, David P. GRAYBILL, Madhusudan K. IYENGAR, Vinod KAMATH, Bejoy J. KOCHUPARAMBIL, Roger R. SCHMIDT, Mark D. SCHULTZ, Daniel P. SIMCO, Mark E. STEINKE
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Publication number: 20120281358Abstract: Liquid-cooled electronic systems are provided which include an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket or removal of the card from the socket. A liquid-cooled cold rail is disposed at the one end of the socket, and a thermal spreader couples the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The thermally conductive extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.Type: ApplicationFiled: May 6, 2011Publication date: November 8, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Timothy J. CHAINER, Michael A. GAYNES, David P. GRAYBILL, Madhusudan K. IYENGAR, Vinod KAMATH, Bejoy J. KOCHUPARAMBIL, Roger R. SCHMIDT, Mark D. SCHULTZ, Daniel P. SIMCO, Mark E. STEINKE
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Patent number: 8286855Abstract: A method are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The fill head and mold are transitioned so that the fill head is situated substantially directly above the mold and so that the plurality of cavities are facing in an upward direction with respect to the sealing member. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.Type: GrantFiled: April 9, 2012Date of Patent: October 16, 2012Assignee: International Business Machines CorporationInventors: Russell A. Budd, John P. Karidis, Mark D. Schultz
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Publication number: 20120193833Abstract: A method and apparatus are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.Type: ApplicationFiled: April 9, 2012Publication date: August 2, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Russell A. BUDD, John P. KARIDIS, Mark D. SCHULTZ