Patents by Inventor Mark D. Simons

Mark D. Simons has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making conformal fluid data sensor
    Patent number: 7003873
    Abstract: A method of making a gaseous fluid data sensor assembly for acquiring data regarding the ambient environment adjacent a surface of an airframe with adjacent air speeds below 40 knots (or another aerodynamic structure with low speed gaseous fluid flow adjacent thereto) having a flexible substrate adhesively conforming to the airframe surface, a conformable cover layer and a relatively thin air data sensor for sensing air pressure between the substrate and the cover layer. The method includes forming a flexible printed circuit on a polymeric film, attaching thin air data sensor to the printed circuit and attaching a flexible substrate to form a conformal air data sensor. The method may also include attaching a data acquisition circuit to the printed circuit and may still further include providing an optical interconnection between the air data sensor and the data acquisition circuit.
    Type: Grant
    Filed: September 26, 2003
    Date of Patent: February 28, 2006
    Assignee: Honeywell International, Inc.
    Inventors: Jeffrey N. Schoess, Mark D. Simons
  • Method of making conformal fluid data sensor
    Publication number: 20040194300
    Abstract: A method of making a gaseous fluid data sensor assembly for acquiring data regarding the ambient environment adjacent a surface of an airframe with adjacent air speeds below 40 knots (or another aerodynamic structure with low speed gaseous fluid flow adjacent thereto) having a flexible substrate adhesively conforming to the airframe surface, a conformable cover layer and a relatively thin air data sensor for sensing air pressure between the substrate and the cover layer. The method includes forming a flexible printed circuit on a polymeric film, attaching thin air data sensor to the printed circuit and attaching a flexible substrate to form a conformal air data sensor. The method may also include attaching a data acquisition circuit to the printed circuit and may still further include providing an optical interconnection between the air data sensor and the data acquisition circuit.
    Type: Application
    Filed: September 26, 2003
    Publication date: October 7, 2004
    Applicant: Honeywell, Inc.
    Inventors: Jeffrey N. Schoess, Mark D. Simons
  • Conformal fluid data sensor
    Patent number: 6662647
    Abstract: A gaseous fluid data sensor assembly for acquiring data regarding the ambient environment adjacent a surface of an airframe with adjacent air speeds below 40 knots (or another aerodynamic structure with low speed gaseous fluid flow adjacent thereto) having a flexible substrate adhesively conforming to the airframe surface, a conformable cover layer and a relatively thin air data sensor for sensing air pressure between the substrate and the cover layer. The assembly also includes a fiber optic communication link, a battery, a data acquisition subsystem, and a flexible printed circuit, all between the substrate and the cover layer. The cover layer is formed of a polymer film.
    Type: Grant
    Filed: January 9, 2001
    Date of Patent: December 16, 2003
    Assignee: Honeywell International Inc.
    Inventors: Jeffrey N. Schoess, Mark D. Simons
  • Conformal fluid data sensor
    Publication number: 20020088277
    Abstract: A gaseous fluid data sensor assembly for acquiring data regarding the ambient environment adjacent a surface of an airframe with adjacent air speeds below 40 knots (or another aerodynamic structure with low speed gaseous fluid flow adjacent thereto) having a flexible substrate adhesively conforming to the airframe surface, a conformable cover layer and a relatively thin air data sensor for sensing air pressure between the substrate and the cover layer. The assembly also includes a fiber optic communication link, a battery, a data acquisition subsystem, and a flexible printed circuit, all between the substrate and the cover layer. The cover layer is formed of a polymer film.
    Type: Application
    Filed: January 9, 2001
    Publication date: July 11, 2002
    Inventors: Jeffrey N. Schoess, Mark D. Simons