Patents by Inventor Mark D. Weierstall

Mark D. Weierstall has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12503021
    Abstract: A ventilated seating assembly comprises a first rigid component, a foam layer, and a second rigid component. The first rigid component comprises formed cloth and has a bonding surface, a ventilation surface opposite the bonding surface, and a 3-dimensional profile. The foam layer has an A-surface and a B-surface opposite the A-surface with the first rigid component bonded to the B-surface of the foam layer such that a portion of the B-surface includes the 3-dimensional profile. The second rigid component comprises a polymeric material affixed to a portion of the ventilation surface of the first rigid component. The first and second rigid components define a cavity including a plurality of air passageways defined by the 3-dimensional profile of the first rigid component.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: December 23, 2025
    Assignee: Proprietect L.P.
    Inventors: Aditya Chintaluri, Andrew Cappuccitti, Mark D. Weierstall
  • Publication number: 20230242021
    Abstract: A ventilated seating assembly comprises a first rigid component, a foam layer, and a second rigid component. The first rigid component comprises formed cloth and has a bonding surface, a ventilation surface opposite the bonding surface, and a 3-dimensional profile. The foam layer has an A-surface and a B-surface opposite the A-surface with the first rigid component bonded to the B-surface of the foam layer such that a portion of the B-surface includes the 3-dimensional profile. The second rigid component comprises a polymeric material affixed to a portion of the ventilation surface of the first rigid component. The first and second rigid components define a cavity including a plurality of air passageways defined by the 3-dimensional profile of the first rigid component.
    Type: Application
    Filed: June 29, 2021
    Publication date: August 3, 2023
    Inventors: Aditya Chintaluri, Andrew Cappuccitti, Mark D. Weierstall