Abstract: An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.

Abstract: An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.

Abstract: The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a barrier stack adjacent the electronic device; and a weatherable sheet adjacent the barrier stack opposite the electronic device. The assembly additionally comprises a protective layer in contact with the electronic device and the weatherable sheet. The present application allows for the combination of any of the disclosed elements.

Abstract: The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a barrier stack adjacent the electronic device; and a weatherable sheet adjacent the barrier stack opposite the electronic device. The assembly additionally comprises a protective layer in contact with the electronic device and the weatherable sheet. The present application allows for the combination of any of the disclosed elements.

Abstract: Multi-layer optical film (10) comprising optical layers reflecting at least 50 percent of incident UV light over specified wavelength ranges. Embodiments of the multi-layer optical films are useful, for example, as a UV protective covering.

Abstract: An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.

Abstract: Multi-layer optical film comprising optical layers reflecting at least 50 percent of incident UV light over specified wavelength ranges. Embodiments of the multi-layer optical films are useful, for example, as a UV protective covering.

Abstract: A barrier film having a substrate, a base polymer layer applied to the substrate, an oxide layer applied to the base polymer layer, and a top coat polymer layer applied to the oxide layer. An optional inorganic layer can be applied over the top coat polymer layer. The top coat polymer includes a silane and an acrylate co-deposited to form the top coat layer. The use of a silane co-deposited with an acrylate to form the top coat layer of the barrier films provide for enhanced resistance to moisture and improved peel strength adhesion of the top coat layer to the underlying barrier stack layers.

Abstract: A barrier film having a substrate, a base polymer layer applied to the substrate, an oxide layer applied to the base polymer layer, and a top coat polymer layer applied to the oxide layer. An optional inorganic layer can be applied over the top coat polymer layer. The top coat polymer includes a silane and an acrylate co-deposited to form the top coat layer. The use of a silane co-deposited with an acrylate to form the top coat layer of the barrier films provide for enhanced resistance to moisture and improved peel strength adhesion of the top coat layer to the underlying barrier stack layers.

Abstract: The present disclosure generally relates to methods of forming barrier assemblies. Some embodiments include application and removal of a protective layer followed by application of a topsheet. Some embodiments include application and removal of a protective layer including a release agent and a monomer.

Abstract: The present disclosure generally relates to methods of forming barrier assemblies. Some embodiments include application of an adhesive layer and/or a topsheet to protect the exposed uppermost layer of the barrier stack during roll-to-roll processing. Some embodiments include application of an adhesive layer and/or a topsheet before the exposed, uppermost layer of the barrier film contacts a solid surface or processing roll. Inclusion of an adhesive layer and/or a topsheet protects the oxide layer during processing, which creates an excellent barrier assembly that can be manufactured using roll-to-roll processing.

Abstract: This disclosure generally relates to films capable of use in a flexible photovoltaic solar module, rolls of films capable of use in a flexible photovoltaic solar module, processes of making the films and rolls of films, to flexible photovoltaic solar modules including such films, and to methods of making flexible solar modules. One exemplary process involves providing at least two discrete segments of a multilayer barrier film and placing a segment of protective layer adjacent to two of the adjacent discrete segments of multilayer barrier film such that the first and second terminal edges of the segment of protective layer span the gap between the discrete segments of barrier film to form a continuous film.

Abstract: The present application is directed to an assembly comprising an electronic device; and a multilayer film. The multilayer film comprises a barrier stack adjacent the electronic device, and a weatherable sheet adjacent the barrier stack opposite the electronic device. The assembly additionally comprises an opaque protective layer adjacent the barrier stack opposite the electronic device.

Abstract: The present application is directed to an assembly comprising an electronic device and a multilayer film. The multilayer film comprises a barrier stack adjacent the electronic device, and a weatherable sheet adjacent the barrier stack opposite the electronic device. The weatherable sheet is bonded to the electronic device.

Abstract: The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a substrate adjacent the electronic device, a barrier stack adjacent the substrate opposite the electronic device, and a weatherable sheet adjacent the barrier stack opposite the substrate. The multilayer film is transparent and flexible and the barrier stack and the substrate are insulated from the environment.

Abstract: The present application is directed to a method of reducing delamination in an assembly. The method comprises providing an assembly and limiting visible light exposure to parts of the assembly to maintain a peel force of 20 grams/inch or greater where the light is limited. The assembly comprises an electronic device, a substrate having a first surface and a second surface opposite the first surface, wherein the second surface of the substrate is disposed on the electronic device, a barrier stack disposed on the first surface of the substrate, and a weatherable sheet adjacent the barrier film opposite the substrate. The assembly is transmissive to visible and infrared light.

Abstract: The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a substrate adjacent the electronic device, a barrier stack adjacent the substrate opposite the electronic device, and a weatherable sheet adjacent the barrier stack opposite the substrate. The multilayer film has been fused.

Abstract: The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a barrier stack adjacent the electronic device; and a weatherable sheet adjacent the barrier stack opposite the electronic device. The assembly additionally comprises a protective layer in contact with the electronic device and the weatherable sheet. The present application allows for the combination of any of the disclosed elements.

Abstract: A barrier film is disclosed that includes a polymeric film substrate and at least first and second polymer layers separated by an inorganic barrier layer. The first polymer layer is disposed on the polymeric film substrate. At least one of the first or second polymer layers is prepared from co-deposited amino silane and acrylate or methacrylate monomer. A method of making the barrier film is also disclosed.

Abstract: Multi-layer optical film (10) comprising optical layers reflecting at least 50 percent of incident UV light over specified wavelength ranges. Embodiments of the multi-layer optical films are useful, for example, as a UV protective covering.