Abstract: A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).

Abstract: A card edge connector assembly with a housing with side walls and a housing base portion embodying an unique card edge auto thickness detection mechanism that includes a pair of movable block members with interconnected upstanding auto thickness detection members and contact pins, a pair of spring members positioned between the movable blocks and interior wall portions of the housing and a pair of stabilizing tie rod members cooperatively associated with the movable blocks for allowing translational movement, while preventing rotation. Each movable block having an extending projection slidably received within longitudinal channels formed in the base housing portion for maintaining the auto thickness detection mechanism in a selected position. Upon insertion of PCI cards between the contact pins and the auto thickness detection members, the contact pins and the auto thickness detection members are moved away from one another against the spring members for accommodating card edges of varying thicknesses.

Abstract: A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).

Abstract: A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).

Abstract: An electrical connector includes a housing having a slot formed therein. The electrical connector further includes a plurality of conductive contact bands disposed within the slot. Each of the contact bands has a surface with a roughness defined by a plurality of microscopic irregularities. Each of the contact bands additionally has a plurality of projections, each of which projects above the surface of the contact band by a distance equal to a value between about 0.1% and 99% of a width of the contact band. The projections of each contact band electrically engage, at a plurality of different locations, with a conductive member insertable into the slot.