Patents by Inventor Mark David Poliks
Mark David Poliks has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6581280Abstract: High aspect ratio (5:1-30:1) and small (5 &mgr;m-125 &mgr;m) diameter holes in a dielectric substrate are provided, which are filled with a solidified conductive material, as well as a method of filling such holes using pressure and vacuum. In certain embodiments, the holes are lined with conductive material and/or capped with a conductive material. The invention also contemplates a chip carrier formed by such material.Type: GrantFiled: July 17, 2002Date of Patent: June 24, 2003Assignee: International Business Machines CorporationInventors: Brian Eugene Curcio, Peter Alfred Gruber, Frederic Maurer, Konstantinos I. Papathomas, Mark David Poliks
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Publication number: 20020179335Abstract: High aspect ratio (5:1-30:1) and small (5 &mgr;m-125 &mgr;m) diameter holes in a dielectric substrate are provided, which are filled with a solidified conductive material, as well as a method of filling such holes using pressure and vacuum. In certain embodiments, the holes are lined with conductive material and/or capped with a conductive material. The invention also contemplates a chip carrier formed by such material.Type: ApplicationFiled: July 17, 2002Publication date: December 5, 2002Applicant: International Business Machines CorporationInventors: Brian Eugene Curcio, Peter Alfred Gruber, Frederic Maurer, Konstantinos I. Papathomas, Mark David Poliks
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Patent number: 6452117Abstract: High aspect ratio (5:1-30:1) and small (5 &mgr;m-125 &mgr;m) diameter holes in a dielectric substrate are provided, which are filled with a solidified conductive material, as well as a method of filling such holes using pressure and vacuum. In certain embodiments, the holes are lined with conductive material and/or capped with a conductive material. The invention also contemplates a chip carrier formed by such material.Type: GrantFiled: May 31, 2001Date of Patent: September 17, 2002Assignee: International Business Machines CorporationInventors: Brian Eugene Curcio, Peter Alfred Gruber, Frederic Maurer, Konstantinos I. Papathomas, Mark David Poliks
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Patent number: 6387205Abstract: A method for coating cloth especially fiberglass sheets with a thermosetting resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin/solvent mixture while maintaining at least some of the interstices or openings essentially free of the solvent mixture. This first coating is then partially cured to between about 70% and 90% of full cure. The coated fiberglass with partially cured resin thereon is then given a second coating of either the same or different thermosetting resin mixture which coats the first coating and fills in the interstices between the fibers. This second coating is then partially cured, which advances the cure of the first coating past 80% full cure and results in an impregnated fiberglass cloth structure for use as sticker sheets.Type: GrantFiled: January 24, 2000Date of Patent: May 14, 2002Assignee: International Business Machines CorporationInventors: Bernd Karl Appelt, William Thomas Fotorny, Robert Maynard Japp, Kostantinos Papathomas, Mark David Poliks
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Patent number: 6351030Abstract: The present invention is a method of providing a protective covering on an electronic package including a first circuitized substrate, a semiconductor chip positioned on and electrically coupled to the first substrate, and a plurality of conductors also on the substrate for electrically connecting the substrate to an external circuitized substrate. In one version, the method comprises covering substantially all of the external surfaces of the substrate, the semiconductor chip and a portion of the plurality of conductors with a protective covering from immersion in a dielectric solution (e.g., TEFLON AF). The coatings can also be applied by brushing, spraying, or chemical vapor deposition. In an alternative embodiment, all of the external surfaces, including all of the conductors, are coated with the protective covering (e.g., to facilitate package shipment or other handling). The resulting electronic packages are also described herein.Type: GrantFiled: March 25, 1999Date of Patent: February 26, 2002Assignee: International Business Machines CorporationInventors: Ross Downey Havens, Robert Maynard Japp, Jeffrey Alan Knight, Mark David Poliks, Anne M. Quinn
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Publication number: 20010027842Abstract: High aspect ratio (5:1-30:1) and small (5 &mgr;m-125 &mgr;m) diameter holes in a dielectric substrate are provided, which are filled with a solidified conductive material, as well as a method of filling such holes using pressure and vacuum. In certain embodiments, the holes are lined with conductive material and/or capped with a conductive material. The invention also contemplates a chip carrier formed by such material.Type: ApplicationFiled: May 31, 2001Publication date: October 11, 2001Applicant: International Business Machines CorporationInventors: Brian E. Curcio, Peter Alfred Gruber, Frederic Maurer, Konstantinos I. Papathomas, Mark David Poliks
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Publication number: 20010011773Abstract: The present invention is a method of providing a protective covering on an electronic package including a first circuitized substrate, a semiconductor chip positioned on and electrically coupled to the first substrate, and a plurality of conductors also on the substrate for electrically connecting the substrate to an external circuitized substrate. In one version, the method comprises covering substantially all of the external surfaces of the substrate, the semiconductor chip and a portion of the plurality of conductors with a protective covering from immersion in a dielectric solution (e.g., TEFLON AF). The coatings can also be applied by brushing, spraying, or chemical vapor deposition. In an alternative embodiment, all of the external surfaces, including all of the conductors, are coated with the protective covering (e.g., to facilitate package shipment or other handling). The resulting electronic packages are also described herein.Type: ApplicationFiled: March 25, 1999Publication date: August 9, 2001Inventors: ROSS DOWNEY HAVENS, ROBERT MAYNARD JAPP, JEFFREY ALAN KNIGHT, MARK DAVID POLIKS, ANNE M. QUINN, RONALD D. QUINN
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Patent number: 6080684Abstract: A method for coating cloth especially fiberglass sheets with a thermosetting resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin/solvent mixture while maintaining at least some of the interstices or openings essentially free of the solvent mixture. This first coating is then partially cured to between about 70% and 90% of full cure. The coated fiberglass with partially cured resin thereon is then given a second coating of either the same or different thermosetting resin mixture which coats the first coating and fills in the interstices between the fibers. This second coating is then partially cured, which advances the cure of the first coating past 80% full cure and results in an impregnated fiberglass cloth structure for use as sticker sheets.Type: GrantFiled: March 23, 1999Date of Patent: June 27, 2000Assignee: International Business Machines CorporationInventors: Bernd Karl Appelt, William Thomas Fotorny, Robert Maynard Japp, Kostantinos Papathomas, Mark David Poliks
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Patent number: 6071559Abstract: A method for coating cloth especially fiberglass sheets with a thermosetting resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin/solvent mixture while maintaining at least some of the interstices or openings essentially free of the solvent mixture. This first coating is then partially cured to between about 70% and 90% of full cure. The coated fiberglass with partially cured resin thereon is then given a second coating of either the same or different thermosetting resin mixture which coats the first coating and fills in the interstices between the fibers. This second coating is then partially cured, which advances the cure of the first coating past 80% full cure and results in an impregnated fiberglass cloth structure for use as sticker sheets.Type: GrantFiled: March 23, 1999Date of Patent: June 6, 2000Assignee: International Business Machines CorporationInventors: Bernd Karl Appelt, William Thomas Fotorny, Robert Maynard Japp, Kostantinos Papathomas, Mark David Poliks
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Patent number: 5928970Abstract: A method for coating cloth especially fiberglass sheets with a thermosetting resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin/solvent mixture while maintaining at least some of the interstices or openings essentially free of the solvent mixture. This first coating is then partially cured to between about 70% and 90% of full cure. The coated fiberglass with partially cured resin thereon is then given a second coating of either the same or different thermosetting resin mixture which coats the first coating and fills in the interstices between the fibers. This second coating is then partially cured, which advances the cure of the first coating past 80% full cure and results in an impregnated fiberglass cloth structure for use as sticker sheets.Type: GrantFiled: January 21, 1998Date of Patent: July 27, 1999Assignee: International Business Machines Corp.Inventors: Bernd Karl Appelt, William Thomas Fotorny, Robert Maynard Japp, Kostantinos Papathomas, Mark David Poliks
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Patent number: 5888850Abstract: The present invention is a method of providing a protective covering on an electronic package including a first circuitized substrate, a semiconductor chip positioned on and electrically coupled to the first substrate, and a plurality of conductors also on the substrate for electrically connecting the substrate to an external circuitized substrate. In one version, the method comprises covering substantially all of the external surfaces of the substrate, the semiconductor chip and a portion of the plurality of conductors with a protective covering from immersion in a dielectric solution (e.g., TEFLON AF). The coatings can also be applied by brushing, spraying, or chemical vapor deposition. In an alternative embodiment, all of the external surfaces, including all of the conductors, are coated with the protective covering (e.g., to facilitate package shipment or other handling). The resulting electronic packages are also described herein.Type: GrantFiled: September 29, 1997Date of Patent: March 30, 1999Assignee: International Business Machines CorporationInventors: Ross Downey Havens, Robert Maynard Japp, Jeffrey Alan Knight, Mark David Poliks, Anne M. Quinn, deceased
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Patent number: 5800874Abstract: A method for coating cloth especially fiberglass sheets with a resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin solvent mixture while maintaining the interstices or openings essentially free of the solvent mixture. This first coating is then partially cured to the extent that it will not redissolve in a second coating of the same resin solution. The coated fiberglass with partially cured resin thereon is then given a second coating of the same resin mixture which coats the first coating and fills in the interstices between the fibers. This second coating is then partially cured, which advances the cure of the first coating and results in an impregnated fiberglass cloth structure for use as sticker sheets.Type: GrantFiled: July 9, 1997Date of Patent: September 1, 1998Assignee: International Business Machines CorporationInventors: Bernd Karl Appelt, William Thomas Fotorny, Robert Maynard Japp, Kostantinos Papathomas, Mark David Poliks
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Patent number: 5783252Abstract: A method for coating cloth especially fiberglass sheets with a resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin solvent mixture while maintaining the interstices or openings essentially free of the solvent mixture. This first coating is then partially cured to the extent that it will not redissolve in a second coating of the same resin solution. The coated fiberglass with partially cured resin thereon is then given a second coating of the same resin mixture which coats the first coating and fills in the interstices between the fibers. This second coating is then partially cured, which advances the cure of the first coating and results in an impregnated fiberglass cloth structure for use as sticker sheets.Type: GrantFiled: July 9, 1997Date of Patent: July 21, 1998Assignee: International Business Machines CorporationInventors: Bernd Karl Appelt, William Thomas Fotorny, Robert Maynard Japp, Kostantinos Papathomas, Mark David Poliks
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Patent number: 5773132Abstract: A method of minimizing forming of white spots and delamination of a copper plane bonded to one surface of a dielectric material following additive pattern plating of copper onto the other surface of the material and in vias contacting the copper plane utilizing a plating solution containing a reducing agent and the resulting product is provided. The surface of the copper which has been bonded to the one surface of the dielectric has been treated, preferably by a sodium chlorite treatment to form a chemical roughened surface of copper oxide (CuO and CuO(II)) on the copper. Prior to the bonding, the roughened surface of the copper oxide is treated with a solution such as benzotriazole, which complexes with the copper oxide to prevent formation of white spots and delamination as a result of such plating.Type: GrantFiled: February 28, 1997Date of Patent: June 30, 1998Assignee: International Business Machines CorporationInventors: Lawrence Robert Blumberg, William T. Chen, Mark David Poliks
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Patent number: 5773371Abstract: A method for coating cloth especially fiberglass sheets with a resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin solvent mixture while maintaining the interstices or openings essentially free of the solvent mixture. This first coating is then partially cured to the extent that it will not redissolve in a second coating of the same resin solution. The coated fiberglass with partially cured resin thereon is then given a second coating of the same resin mixture which coats the first coating and fills in the interstices between the fibers. This second coating is then partially cured, which advances the cure of the first coating and results in an impregnated fiberglass cloth structure for use as sticker sheets.Type: GrantFiled: July 9, 1997Date of Patent: June 30, 1998Assignee: International Business Machines CorporationInventors: Bernd Karl Appelt, William Thomas Fotorny, Robert Maynard Japp, Kostantinos Papathomas, Mark David Poliks
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Patent number: 5756405Abstract: A method for coating cloth especially fiberglass sheets with a resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin solvent mixture while maintaining the interstices or openings essentially free of the solvent mixture. This first coating is then partially cured to the extent that it will not redissolve in a second coating of the same resin solution. The coated fiberglass with partially cured resin thereon is then given a second coating of the same resin mixture which coats the first coating and fills in the interstices between the fibers. This second coating is then partially cured, which advances the cure of the first coating and results in an impregnated fiberglass cloth structure for use as sticker sheets.Type: GrantFiled: September 10, 1996Date of Patent: May 26, 1998Assignee: International Business Machines CorporationInventors: Bernd Karl Appelt, William Thomas Fotorny, Robert Maynard Japp, Kostantinos Papathomas, Mark David Poliks