Abstract: A device can comprise a plurality of layers stacked and bonded on one another, wherein at least one layer of the plurality of layers comprises: a first active region comprising first pin portions positioned in a first planar arrangement; and a second active region comprising second pin portions positioned in a second planar arrangement, wherein the second planar arrangement is different from the first planar arrangement. The device can also comprise a conformable layer adjacent to at least one of the plurality of layers.

Abstract: Techniques are provided for system level modeling of two-phase cooling systems. In one example, a computer-implemented method comprises determining, by a system operatively coupled to a processor, respective sets of steady state values for parameters at inlet-outlet junctions using a system model, wherein the determining is based on first user input specifying a cooling system design comprising a plurality of part objects, wherein adjacent part objects in a flow direction are connected at the inlet-outlet junctions. The computer-implemented method can also comprise generating, by the system, a graphical display that depicts the respective sets of parameter values at the inlet-outlet junctions.

Abstract: Techniques that facilitate two-phase liquid cooling electronics are provided. In one example, a server system comprises a two-phase cooling system and an air moving system. The two-phase cooling system reduces a first temperature of a first electronic component in the server system using a pump that circulates a coolant refrigerant through a two-phase refrigerant loop associated with the first electronic component, where first electronic component satisfies a first defined criterion. The air moving system reduces a second temperature of a second electronic component in the server system using one or more fans associated with the second electronic component, where the second electronic component satisfies a second defined criterion.

Abstract: Techniques are provided for system level modeling of two-phase cooling systems. In one example, a computer-implemented method comprises determining, by a system operatively coupled to a processor, respective sets of steady state values for parameters at inlet-outlet junctions using a system model, wherein the determining is based on first user input specifying a cooling system design comprising a plurality of part objects, wherein adjacent part objects in a flow direction are connected at the inlet-outlet junctions. The computer-implemented method can also comprise generating, by the system, a graphical display that depicts the respective sets of parameter values at the inlet-outlet junctions.

Abstract: Devices that have integrated cooling structures for two-phase cooling and methods of assembly thereof are provided. In one example, a chip manifold can be affixed to a chip. An interface can be located at a first position between the chip manifold and the manifold cap. Furthermore, the interface can create a seal.

Abstract: A device can comprise a plurality of layers stacked and bonded on one another, wherein at least one layer of the plurality of layers comprises: a first active region comprising first pin portions positioned in a first planar arrangement; and a second active region comprising second pin portions positioned in a second planar arrangement, wherein the second planar arrangement is different from the first planar arrangement. The device can also comprise a conformable layer adjacent to at least one of the plurality of layers.

Abstract: Techniques are provided for system level modeling of two-phase cooling systems. In one example, a computer-implemented method comprises determining, by a system operatively coupled to a processor, respective sets of steady state values for parameters at inlet-outlet junctions using a system model, wherein the determining is based on first user input specifying a cooling system design comprising a plurality of part objects, wherein adjacent part objects in a flow direction are connected at the inlet-outlet junctions. The computer-implemented method can also comprise generating, by the system, a graphical display that depicts the respective sets of parameter values at the inlet-outlet junctions.

Abstract: A device can comprise a plurality of layers stacked and bonded on one another, wherein at least one layer of the plurality of layers comprises: a first active region comprising first pin portions positioned in a first planar arrangement; and a second active region comprising second pin portions positioned in a second planar arrangement, wherein the second planar arrangement is different from the first planar arrangement. The device can also comprise a conformable layer adjacent to at least one of the plurality of layers.

Abstract: Techniques that facilitate two-phase liquid cooling electronics are provided. In one example, a server system comprises a two-phase cooling system and an air moving system. The two-phase cooling system reduces a first temperature of a first electronic component in the server system using a pump that circulates a coolant refrigerant through a two-phase refrigerant loop associated with the first electronic component, where first electronic component satisfies a first defined criterion. The air moving system reduces a second temperature of a second electronic component in the server system using one or more fans associated with the second electronic component, where the second electronic component satisfies a second defined criterion.

Abstract: Techniques that facilitate two-phase liquid cooling electronics are provided. In one example, a server system comprises a two-phase cooling system and an air moving system. The two-phase cooling system reduces a first temperature of a first electronic component in the server system using a pump that circulates a coolant refrigerant through a two-phase refrigerant loop associated with the first electronic component, where first electronic component satisfies a first defined criterion. The air moving system reduces a second temperature of a second electronic component in the server system using one or more fans associated with the second electronic component, where the second electronic component satisfies a second defined criterion.

Abstract: Techniques for wafer level integration of embedded cooling structures for integrated circuit devices are provided. In one embodiment, a method includes forming channel structures on a first surface of a silicon first wafer, wherein the channel structures respectively include radial channels that extend from central fluid distribution areas, and wherein integrated circuits are formed on a second surface of the silicon first wafer that opposes the first surface. The method can further include bonding a manifold wafer to the first surface of the silicon wafer such that inlet openings formed through the manifold wafer respectively connect to the central fluid distribution areas, thereby enclosing the radial channels and forming a bonded structure.

Abstract: Techniques that facilitate two-phase liquid cooling electronics are provided. In one example, a system comprises a pump and a valve. The pump circulates a coolant refrigerant through a two-phase refrigerant system associated with an electronic component. The valve controls a flow path of the coolant refrigerant that flows through the two-phase refrigerant system. Furthermore, the valve modifies the flow path of the coolant refrigerant through the two-phase refrigerant system in response to a determination that an operation of the pump satisfies a defined criterion.

Abstract: Techniques that facilitate two-phase liquid cooling electronics are provided. In one example, a system comprises a pump and a valve. The pump circulates a coolant refrigerant through a two-phase refrigerant system associated with an electronic component. The valve controls a flow path of the coolant refrigerant that flows through the two-phase refrigerant system. Furthermore, the valve modifies the flow path of the coolant refrigerant through the two-phase refrigerant system in response to a determination that an operation of the pump satisfies a defined criterion.

Abstract: Techniques for wafer level integration of embedded cooling structures for integrated circuit devices are provided. In one embodiment, a method includes forming channel structures on a first surface of a silicon first wafer, wherein the channel structures respectively comprise radial channels that extend from central fluid distribution areas, and wherein integrated circuits are formed on a second surface of the silicon first wafer that opposes the first surface. The method can further include bonding a manifold wafer to the first surface of the silicon wafer such that inlet openings formed through the manifold wafer respectively connect to the central fluid distribution areas, thereby enclosing the radial channels and forming a bonded structure.

Abstract: Techniques for wafer level integration of embedded cooling structures for integrated circuit devices are provided. In one embodiment, a method includes forming channel structures on a first surface of a silicon first wafer, wherein the channel structures respectively include radial channels that extend from central fluid distribution areas, and wherein integrated circuits are formed on a second surface of the silicon first wafer that opposes the first surface. The method can further include bonding a manifold wafer to the first surface of the silicon wafer such that inlet openings formed through the manifold wafer respectively connect to the central fluid distribution areas, thereby enclosing the radial channels and forming a bonded structure.

Abstract: Techniques that facilitate two-phase liquid cooling electronics are provided. In one example, a system comprises a pump and a valve. The pump circulates a coolant refrigerant through a two-phase refrigerant system associated with an electronic component. The valve controls a flow path of the coolant refrigerant that flows through the two-phase refrigerant system. Furthermore, the valve modifies the flow path of the coolant refrigerant through the two-phase refrigerant system in response to a determination that an operation of the pump satisfies a defined criterion.

Abstract: Techniques that facilitate two-phase liquid cooling electronics are provided. In one example, a system comprises a pump and a valve. The pump circulates a coolant refrigerant through a two-phase refrigerant system associated with an electronic component. The valve controls a flow path of the coolant refrigerant that flows through the two-phase refrigerant system. Furthermore, the valve modifies the flow path of the coolant refrigerant through the two-phase refrigerant system in response to a determination that an operation of the pump satisfies a defined criterion.

Abstract: Techniques that facilitate two-phase liquid cooling electronics are provided. In one example, a server system comprises a two-phase cooling system and an air moving system. The two-phase cooling system reduces a first temperature of a first electronic component in the server system using a pump that circulates a coolant refrigerant through a two-phase refrigerant loop associated with the first electronic component, where first electronic component satisfies a first defined criterion. The air moving system reduces a second temperature of a second electronic component in the server system using one or more fans associated with the second electronic component, where the second electronic component satisfies a second defined criterion.

Abstract: Techniques that facilitate two-phase liquid cooling electronics are provided. In one example, a server system comprises a two-phase cooling system and an air moving system. The two-phase cooling system reduces a first temperature of a first electronic component in the server system using a pump that circulates a coolant refrigerant through a two-phase refrigerant loop associated with the first electronic component, where first electronic component satisfies a first defined criterion. The air moving system reduces a second temperature of a second electronic component in the server system using one or more fans associated with the second electronic component, where the second electronic component satisfies a second defined criterion.

Abstract: Techniques are provided for system level modeling of two-phase cooling systems. In one example, a computer-implemented method comprises determining, by a system operatively coupled to a processor, respective sets of steady state values for parameters at inlet-outlet junctions using a system model, wherein the determining is based on first user input specifying a cooling system design comprising a plurality of part objects, wherein adjacent part objects in a flow direction are connected at the inlet-outlet junctions. The computer-implemented method can also comprise generating, by the system, a graphical display that depicts the respective sets of parameter values at the inlet-outlet junctions.