Patents by Inventor Mark Denome
Mark Denome has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7497932Abstract: The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electro-chemical deposition system includes a spin-rinse-dry (SRD) station disposed between the loading station and the mainframe, a rapid thermal anneal chamber attached to the loading station, and a system controller for controlling the electro-chemical deposition process and the components of the electro-chemical deposition system.Type: GrantFiled: June 27, 2006Date of Patent: March 3, 2009Assignee: Applied Materials, Inc.Inventors: Yezdi Dordi, Donald J. Olgado, Ratson Morad, Peter Hey, Mark Denome, Michael Sugarman, Anna Marie Lloyd, legal representative, Joseph Stevens, Dan Marohl, Ho Seon Shin, Eugene Ravinovich, Robin Cheung, Ashok K. Sinha, Avi Tepman, Dan Carl, George Birkmaier, Mark Lloyd
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Publication number: 20060246690Abstract: The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electro-chemical deposition system includes a spin-rinse-dry (SRD) station disposed between the loading station and the mainframe, a rapid thermal anneal chamber attached to the loading station, and a system controller for controlling the electro-chemical deposition process and the components of the electro-chemical deposition system.Type: ApplicationFiled: June 27, 2006Publication date: November 2, 2006Inventors: Yezdi Dordi, Donald Olgado, Ratson Morad, Peter Hey, Mark Denome, Michael Sugarman, Mark Lloyd, Anna Lloyd, Joseph Stevens, Dan Marohl, Ho Shin, Eugene Ravinovich, Robin Cheung, Ashok Sinha, Avi Tepman, Dan Carl, George Birkmaier
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Patent number: 6837978Abstract: A method and associated apparatus for electro-chemically depositing a metal film on a substrate having a metal seed layer. The apparatus comprises a substrate holder that holds the substrate. The electrolyte cell receives the substrate in a processing position. The actuator is connected to the substrate holder and adjustably positions the substrate relative to the electrolyte cell. The method involves electro-chemically depositing a metal film on a substrate having a metal seed layer comprising disposing the substrate in an electrolyte cell that is configured to receive the substrate. The method comprises adjustably positioning the substrate relative to the electrolyte cell.Type: GrantFiled: October 12, 2000Date of Patent: January 4, 2005Assignee: Applied Materials, Inc.Inventors: H. Peter W. Hey, Yezdi N. Dordi, Donald J. K. Olgado, Mark Denome
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Publication number: 20040084301Abstract: The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electro-chemical deposition system includes a spin-rinse-dry (SRD) station disposed between the loading station and the mainframe, a rapid thermal anneal chamber attached to the loading station, and a system controller for controlling the electro-chemical deposition process and the components of the electro-chemical deposition system.Type: ApplicationFiled: October 20, 2003Publication date: May 6, 2004Applicant: APPLIED MATERIALS, INC.Inventors: Yezdi Dordi, Donald J. Olgado, Ratson Morad, Peter Hey, Mark Denome, Michael Sugarman, Mark Lloyd, Anna Marie Lloyd, Joseph Stevens, Dan Marohl, Ho Seon Shin, Eugene Ravinovich, Robin Cheung, Ashok K. Sinha, Avi Tepman, Dan Carl, George Birkmaier
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Publication number: 20040020781Abstract: An apparatus and method for electro-chemically depositing a uniform metal layer onto a substrate is provided. In one aspect, the apparatus includes a cathode connected to the substrate plating surface, an anode disposed above the substrate support member and an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface. In another aspect, the apparatus further includes a dual catch-cup system having an electroplating solution catch-cup and a rinse catch-cup. The dual catch-cup system provides separation of the electroplating solution and the rinse solutions during processing and provides re-circulating systems for the different solutions of the electroplating system.Type: ApplicationFiled: July 29, 2003Publication date: February 5, 2004Applicant: Applied Materials, Inc.Inventors: Yezdi Dordi, Joe Stevens, Roy Edwards, Robert B. Lowrance, Michael Sugarman, Mark Denome
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Patent number: 6635157Abstract: The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electro-chemical deposition system includes a spin-rinse-dry (SRD) station disposed between the loading station and the mainframe, a rapid thermal anneal chamber attached to the loading station, and a system controller for controlling the electro-chemical deposition process and the components of the electro-chemical deposition system.Type: GrantFiled: May 29, 2001Date of Patent: October 21, 2003Assignee: Applied Materials, Inc.Inventors: Yezdi Dordi, Donald J. Olgado, Ratson Morad, Peter Hey, Mark Denome, Michael Sugarman, Mark Lloyd, Joseph Stevens, Dan Marohl, Ho Seon Shin, Eugene Ravinovich, Robin Cheung, Ashok K. Sinha, Avi Tepman, Dan Carl, George Birkmaier
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Publication number: 20030168346Abstract: An electroplating system that includes a wet area comprising one or more electrochemical processing cells for processing one or more semiconductor substrates in an electrolyte solution, a dry area for transferring the semiconductor substrates to the wet area prior to processing the semiconductor substrates and for receiving the semiconductor substrates from the wet area after processing the semiconductor substrates, and a cleaning module for removing unwanted deposits from the semiconductor substrates after processing the semiconductor substrates in the wet area but prior to transferring the semiconductor substrates to the dry area.Type: ApplicationFiled: March 13, 2003Publication date: September 11, 2003Applicant: Applied Materials, Inc.Inventors: H. Peter W. Hey, Michael N. Sugarman, Mark Denome
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Patent number: 6599402Abstract: An apparatus and method for electro-chemically depositing a uniform metal layer onto a substrate is provided. In one aspect, the apparatus includes a cathode connected to the substrate plating surface, an anode disposed above the substrate support member and an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface. In another aspect, the apparatus further includes a dual catch-cup system having an electroplating solution catch-cup and a rinse catch-cup. The dual catch-cup system provides separation of the electroplating solution and the rinse solutions during processing and provides re-circulating systems for the different solutions of the electroplating system.Type: GrantFiled: June 24, 2002Date of Patent: July 29, 2003Assignee: Applied Materials, Inc.Inventors: Yezdi Dordi, Joe Stevens, Roy Edwards, Bob Lowrance, Michael Sugarman, Mark Denome
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Patent number: 6551488Abstract: A method and apparatus for processing a substrate is described. In one aspect, a processing system is provided which includes a wet area and a dry area. In another aspect, a method comprises processing the substrate in the process cell. The substrate is transferred from the process cell to a dry module and then transferring the substrate to a drying area.Type: GrantFiled: September 8, 2000Date of Patent: April 22, 2003Assignee: Applied Materials, Inc.Inventors: H. Peter W. Hey, Michael N. Sugarman, Mark Denome
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Patent number: 6517130Abstract: In one aspect, a vacuum chuck supports a substrate on an end effector, the vacuum chuck comprising a position reference structure and a suction cup. The position reference structure is mounted to the surface and comprises a reference surface. The suction cup is located proximate the reference surface and comprising a suction mount. In another aspect, a method of chucking a substrate to a vacuum chuck is provided. The vacuum chuck comprises a suction cup and a position reference structure. The method comprises attaching the suction cup to the substrate to form a seal therebetween. The suction cup is deformed such that the substrate contacts the position reference structure. The substrate is then leveled on the position reference structure.Type: GrantFiled: March 14, 2000Date of Patent: February 11, 2003Assignee: Applied Materials, Inc.Inventors: Bernardo Donoso, Joseph J. Stevens, Donald J. Olgado, Mark Denome
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Publication number: 20020157960Abstract: An apparatus and method for electro-chemically depositing a uniform metal layer onto a substrate is provided. In one aspect, the apparatus includes a cathode connected to the substrate plating surface, an anode disposed above the substrate support member and an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface. In another aspect, the apparatus further includes a dual catch-cup system having an electroplating solution catch-cup and a rinse catch-cup. The dual catch-cup system provides separation of the electroplating solution and the rinse solutions during processing and provides re-circulating systems for the different solutions of the electroplating system.Type: ApplicationFiled: June 24, 2002Publication date: October 31, 2002Applicant: Applied Materials, Inc.Inventors: Yezdi Dordi, Joe Stevens, Roy Edwards, Robert B. Lowrance, Michael Sugarman, Mark Denome
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Patent number: 6416647Abstract: The invention provides an electro-chemical deposition cell for face-up processing of semiconductor substrates comprising a substrate support member, a cathode connected to the substrate plating surface, an anode disposed above the substrate support member and an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface. Preferably, the anode comprises a consumable metal source disposed in a liquid permeable structure, and the anode and a cavity ring define a cavity for holding and distributing the electroplating solution to the substrate plating surface. Preferably, the substrate support member comprises a vacuum chuck having vacuum ports disposed on the substrate supporting surface that serves to provide suction during processing and to provide a blow-off gas flow to prevent backside contamination during substrate transfers.Type: GrantFiled: April 19, 1999Date of Patent: July 9, 2002Assignee: Applied Materials, Inc.Inventors: Yezdi Dordi, Joe Stevens, Roy Edwards, Bob Lowrance, Michael Sugarman, Mark Denome
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Publication number: 20020029961Abstract: The present invention provides an electrochemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electrochemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electrochemical deposition system includes a spin-rinse-dry (SRD) station disposed between the loading station and the mainframe, a rapid thermal anneal chamber attached to the loading station, and a system controller for controlling the electrochemical deposition process and the components of the electrochemical deposition system.Type: ApplicationFiled: May 29, 2001Publication date: March 14, 2002Applicant: Applied Materials, Inc.Inventors: Yezdi Dordi, Donald J. Olgado, Ratson Morad, Peter Hey, Mark Denome, Michael Sugarman, Mark Lloyd, Anna Marie Lloyd, Joseph Stevens, Dan Marohl, Ho Seon Shin, Eugene Ravinovich, Robin Cheung, Ashok K. Sinha, Avi Tepman, Dan Carl, George Birkmaier
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Patent number: 6258220Abstract: The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electro-chemical deposition system includes a spin-rinse-dry (SRD) station disposed between the loading station and the mainframe, a rapid thermal anneal chamber attached to the loading station, and a system controller for controlling the electro-chemical deposition process and the components of the electro-chemical deposition system.Type: GrantFiled: April 8, 1999Date of Patent: July 10, 2001Assignee: Applied Materials, Inc.Inventors: Yezdi Dordi, Donald J. Olgado, Ratson Morad, Peter Hey, Mark Denome, Michael Sugarman, Mark Lloyd, Joseph Stevens, Dan Marohl, Ho Seon Shin, Eugene Ravinovich, Robin Cheung, Ashok K. Sinha, Avi Tepman, Dan Carl, George Birkmaier