Patents by Inventor Mark Devenport

Mark Devenport has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9585259
    Abstract: A printed circuit board (PCB) defines a first outer surface and a second outer surface that is opposite the first outer surface. The first outer surface of the PCB defines a recess. The PCB includes a signal layer between the first outer surface and the second surface with a first portion exposed within the recess and a second portion exposed within the recess. A component is disposed within the recess and connected to the first portion and the second portion of the signal layer such that an entirety of the component is within the recess and below the first surface.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: February 28, 2017
    Assignee: Juniper Networks, Inc.
    Inventors: Boris Reynov, Oscar Diaz-Landa, Shreeram Siddhaye, Chebrolu S. Srinivas, Lee M. Forbes, Mark Simpson, Mark Devenport
  • Patent number: 9185794
    Abstract: A printed circuit board (PCB) defines a first outer surface and a second outer surface that is opposite the first outer surface. The first outer surface of the PCB defines a recess. The PCB includes a signal layer between the first outer surface and the second surface with a first portion exposed within the recess and a second portion exposed within the recess. A component is disposed within the recess and connected to the first portion and the second portion of the signal layer such that an entirety of the component is within the recess and below the first surface.
    Type: Grant
    Filed: July 31, 2013
    Date of Patent: November 10, 2015
    Assignee: Juniper Networks, Inc.
    Inventors: Boris Reynov, Oscar Diaz-Landa, Shreeram Siddhaye, Chebrolu S. Srinivas, Lee M. Forbes, Mark Simpson, Mark Devenport