Abstract: Molding compositions particularly useful in coating electronic devices such as integrated circuits are disclosed. The molding compositions include an epoxy resin; a hardener for the epoxy resin, and a quaternary organophosphonium salt for catalyzing a reaction between the epoxy resin and the hardener, such as ethyl triphenyl phosphonium acid acetate. The molding compositions may further include a flame retardant compound such as melamine cyanurate. In a further embodiment, the molding composition may include an additional catalyst, such as 1,8-diazabicyclo[5.4.0]undec-7-ene. Integrated circuits encapsulated with such molding compositions exhibit reduced electrothermally induced parasitic gate leakage.