Patents by Inventor Mark Dobrzelewski

Mark Dobrzelewski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for fabricating electronic components using liquid injection molding
    Patent number: 8609472
    Abstract: A process for fabricating an electronic component includes a liquid injection molding method for overmolding a semiconductor device. The liquid injection molding method includes: i) placing the semiconductor device in an open mold, ii) closing the mold to form a mold cavity, iii) heating the mold cavity, iv) injection molding a curable liquid into the mold cavity to overmold the semiconductor device, v) opening the mold and removing the product of step iv), and optionally vi) post-curing the product of step v). The semiconductor device may have an integrated circuit attached to a substrate through a die attach adhesive.
    Type: Grant
    Filed: May 26, 2011
    Date of Patent: December 17, 2013
    Assignee: Dow Corning Corporation
    Inventors: Tammy Cheng, Mark Dobrzelewski, Daniel Solomon, Christopher Windiate
  • Process for Fabricating Electronic Components Using Liquid Injection Molding
    Publication number: 20110221060
    Abstract: A process for fabricating an electronic component includes a liquid injection molding method for overmolding a semiconductor device. The liquid injection molding method includes: i) placing the semiconductor device in an open mold, ii) closing the mold to form a mold cavity, iii) heating the mold cavity, iv) injection molding a curable liquid into the mold cavity to overmold the semiconductor device, v) opening the mold and removing the product of step iv), and optionally vi) post-curing the product of step v). The semiconductor device may have an integrated circuit attached to a substrate through a die attach adhesive.
    Type: Application
    Filed: May 26, 2011
    Publication date: September 15, 2011
    Inventors: Tammy Cheng, Mark Dobrzelewski, Daniel Solomon, Christopher Windiate
  • Process for fabricating electronic components using liquid injection molding
    Patent number: 8017449
    Abstract: A process for fabricating an electronic component includes a liquid injection molding method for overmolding a semiconductor device. The liquid injection molding method includes: i) placing the semiconductor device in an open mold, ii) closing the mold to form a mold cavity, iii) heating the mold cavity, iv) injection molding a curable liquid into the mold cavity to overmold the semiconductor device, v) opening the mold and removing the product of step iv), and optionally vi) post-curing the product of step v). The semiconductor device may have an integrated circuit attached to a substrate through a die attach adhesive.
    Type: Grant
    Filed: July 29, 2004
    Date of Patent: September 13, 2011
    Assignee: Dow Corning Corporation
    Inventors: Tammy Cheng, Mark Dobrzelewski, Daniel Solomon, Christopher Windiate
  • Process For Fabricating Electronic Components Using Liquid Injection Molding
    Publication number: 20080090332
    Abstract: A process for fabricating an electronic component includes a liquid injection molding method for overmolding a semiconductor device. The liquid injection molding method includes: i) placing the semiconductor device in an open mold, ii) closing the mold to form a mold cavity, iii) heating the mold cavity, iv) injection molding a curable liquid into the mold cavity to overmold the semiconductor device, v) opening the mold and removing the product of step iv), and optionally vi) post-curing the product of step v). The semiconductor device may have an integrated circuit attached to a substrate through a die attach adhesive.
    Type: Application
    Filed: July 29, 2004
    Publication date: April 17, 2008
    Inventors: Tammy Cheng, Mark Dobrzelewski, Daniel Solomon, Christopher Windiate