Patents by Inventor Mark Douglas BASSETT

Mark Douglas BASSETT has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HIGH PERFORMANCE MODULAR DIE-CAST ENCLOSURE SYSTEM
    Publication number: 20230130888
    Abstract: A modular die cast enclosure comprising a top section with a top mid-plane and a bottom section with a bottom mid-plane and an internal bottom cover. The bottom section having one or more of a first type of connectors. The top section having one or more of a second type of connectors on. The internal bottom cover having one or more of a third type of connectors. Wherein said first type of connectors couple with said second type of connectors when the top section is placed on the bottom section and allow to electrically connect said top and bottom sections via said third type of connectors.
    Type: Application
    Filed: December 23, 2022
    Publication date: April 27, 2023
    Inventors: Mark Douglas Bassett, Bradford KM Stimpson, Alexandre Gourari
  • High performance modular die-cast enclosure system
    Patent number: 11589475
    Abstract: A modular die cast enclosure comprising a top section with a top mid-plane and a bottom section with a bottom mid-plane and an internal bottom cover. The bottom section having one or more of a first type of connectors. The top section having one or more of a second type of connectors on. The internal bottom cover having one or more of a third type of connectors. Wherein said first type of connectors couple with said second type of connectors when the top section is placed on the bottom section and allow to electrically connect said top and bottom sections via said third type of connectors.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: February 21, 2023
    Assignee: Redline Communications Inc.
    Inventors: Mark Douglas Bassett, Bradford K M Stimpson, Alexandre Gourari
  • HIGH PERFORMANCE MODULAR DIE-CAST ENCLOSURE SYSTEM
    Publication number: 20230022850
    Abstract: A modular die cast enclosure comprising a top section with a top mid-plane and a bottom section with a bottom mid-plane and an internal bottom cover. The bottom section having one or more of a first type of connectors. The top section having one or more of a second type of connectors on. The internal bottom cover having one or more of a third type of connectors. Wherein said first type of connectors couple with said second type of connectors when the top section is placed on the bottom section and allow to electrically connect said top and bottom sections via said third type of connectors.
    Type: Application
    Filed: July 20, 2021
    Publication date: January 26, 2023
    Inventors: Mark Douglas BASSETT, Bradford KM STIMPSON, Alexandre GOURARI