Abstract: An encapsulated integrated circuit package is disclosed. The package includes an integrated device package mounted on a substrate. The integrated device package may have a housing defining a cavity and a crystal oscillator in the cavity. The integrated device package may be encapsulated using a high-pressure molding process. The integrated circuit package may further comprise a protection layer over the integrated device package to reduce deformation during pressure processes.

Abstract: An integrated device package is disclosed. The integrated device package can include a package substrate having a plurality of contact pads on a first side of the package substrate, the plurality of contact pads configured to electrically connect to a sensor assembly. The package can include a radiation shield attached to a second side of the package substrate by way of a first adhesive, the first side opposite the second side. The package can include an integrated device die attached to the radiation shield by way of a second adhesive. The integrated device die can comprise sensitive active electronic circuitry in a sensitive active region of the integrated device die. A molding compound can be disposed over the integrated device die and the radiation shield.

Abstract: An air sterilization assembly for passenger compartment air sterilization includes a substrate and a set of bulbs. The substrate is mountable within an air conduit of a passenger compartment ventilation system of a vehicle so that the substrate is mounted to the air conduit without substantially reducing airflow through the air conduit. The set of bulbs is engaged to the substrate and is operationally engageable to an electrical circuit of the vehicle. The bulbs emit ultraviolet C radiation, which neutralizes pathogens in air passing through the air conduit.

Abstract: An integrated device package is disclosed. The integrated device package can include a package substrate having a plurality of contact pads on a first side of the package substrate, the plurality of contact pads configured to electrically connect to a sensor assembly. The package can include a radiation shield attached to a second side of the package substrate by way of a first adhesive, the first side opposite the second side. The package can include an integrated device die attached to the radiation shield by way of a second adhesive. The integrated device die can comprise sensitive active electronic circuitry in a sensitive active region of the integrated device die. A molding compound can be disposed over the integrated device die and the radiation shield.

Abstract: A memory module for an electronic system, such as a personal computer or server, includes a double-sided, 184-pin, dual in-line memory module printed circuit board. A plurality of individual electronic components are mounted on both sides of the printed circuit board. Each electronic component includes an electronic component printed circuit board, a first pair of stacked memory dies electrically connected to the electronic component printed circuit board, a second pair of stacked memory dies electrically connected to the electronic component printed circuit board, and a thin small outline ball grid array package at least partially encapsulating the first and second pairs of stacked memory dies. Preferably, an insulator is disposed between each pair of stacked memory dies.