Abstract: In various embodiments, methods and systems for implementing a multi-device mixed interactivity system are provided. The interactivity system includes paired mixed-input devices for interacting and controlling virtual objects. In operation, a selection profile associated with a virtual object is accessed. The selection profile is generated based on a selection input determined using real input associated with a selection device and virtual input associated with a mixed-reality device. The selection device has a first display and the mixed-reality device has a second display that both display the virtual object. An annotation input for the virtual object based on a selected portion corresponding to the selection profile is received. An annotation profile based on the annotation input is generated. The annotation profile includes annotation profile attributes for annotating a portion of the virtual object. An annotation of the selected portion of the virtual reality object is caused to be displayed.

Abstract: In various embodiments, methods and systems for implementing a multi-device mixed interactivity system are provided. The interactivity system includes paired mixed-input devices for interacting and controlling virtual objects. In operation, a selection profile associated with a virtual object is accessed. The selection profile is generated based on a selection input determined using real input associated with a selection device and virtual input associated with a mixed-reality device. The selection device has a first display and the mixed-reality device has a second display that both display the virtual object. An annotation input for the virtual object based on a selected portion corresponding to the selection profile is received. An annotation profile based on the annotation input is generated. The annotation profile includes annotation profile attributes for annotating a portion of the virtual object. An annotation of the selected portion of the virtual reality object is caused to be displayed.

Abstract: In various embodiments, methods and systems for implementing a multi-device mixed interactivity system are provided. The interactivity system includes paired mixed-input devices for interacting and controlling virtual objects. In operation, a selection profile associated with a virtual object is accessed. The selection profile is generated based on a selection input determined using real input associated with a selection device and virtual input associated with a mixed-reality device. The selection device has a first display and the mixed-reality device has a second display that both display the virtual object. An annotation input for the virtual object based on a selected portion corresponding to the selection profile is received. An annotation profile based on the annotation input is generated. The annotation profile includes annotation profile attributes for annotating a portion of the virtual object. An annotation of the selected portion of the virtual reality object is caused to be displayed.

Abstract: In various embodiments, methods and systems for implementing a multi-device mixed interactivity system are provided. The interactivity system includes paired mixed-input devices for interacting and controlling virtual objects. In operation, a selection input associated with a virtual object is accessed. The selection input is based on real input associated with a selection device and virtual input associated with a mixed-reality device. The selection device has a first display that displays the virtual object and the mixed-reality device has a second display that displays the virtual object. A selection profile is generated based on the selection input. The selection profile comprises one or more selection profile attributes for isolating a portion of the virtual object. A selected portion of the virtual object is determined based on the selection profile. The selected portion of the virtual reality object is caused to be displayed on the first display of the selection device.

Abstract: Methods and systems for rendering augmented reality display data to locations of a physical presentation environment based on a presentation configuration are provided. A physical presentation environment configuration may be accessed that includes locations of a physical presentation environment for mapping augmented reality display data. The augmented reality display data may include a plurality of augmented reality objects that are rendered for display. Presentation attributes of the augmented reality display data may be used in conjunction with the presentation configuration for mapping and rendering the augmented reality display data. The rendered augmented reality display data may be dynamically interactive, and may be generated based on previous presentation configurations, mapping preferences, mapping limitations, and/or other factors.

Abstract: In various embodiments, methods and systems for implementing a multi-device mixed interactivity system are provided. The interactivity system includes paired mixed-input devices for interacting and controlling virtual objects. In operation, a selection input associated with a virtual object is accessed. The selection input is based on real input associated with a selection device and virtual input associated with a mixed-reality device. The selection device has a first display that displays the virtual object and the mixed-reality device has a second display that displays the virtual object. A selection profile is generated based on the selection input. The selection profile comprises one or more selection profile attributes for isolating a portion of the virtual object. A selected portion of the virtual object is determined based on the selection profile. The selected portion of the virtual reality object is caused to be displayed on the first display of the selection device.

Abstract: In various embodiments, methods and systems for implementing a multi-device mixed interactivity system are provided. The interactivity system includes paired mixed-input devices for interacting and controlling virtual objects. In operation, a selection profile associated with a virtual object is accessed. The selection profile is generated based on a selection input determined using real input associated with a selection device and virtual input associated with a mixed-reality device. The selection device has a first display and the mixed-reality device has a second display that both display the virtual object. An annotation input for the virtual object based on a selected portion corresponding to the selection profile is received. An annotation profile based on the annotation input is generated. The annotation profile includes annotation profile attributes for annotating a portion of the virtual object. An annotation of the selected portion of the virtual reality object is caused to be displayed.

Abstract: A multi-layer foam fitness apparatus for use in strength and stretching exercises is provided. The apparatus has a user-engaging portion and a surface-engaging portion. The user-engaging portion is comprised of closed cell EVA foam of a first hardness, and the surface-engaging portion is comprised of a closed cell EVA foam of a second, lesser hardness, wherein the surface-engaging portion is comprised of non-slip memory foam. The user-engaging portion comprises one or more faces, which may be flat, angled, or curved, or some combination of the foregoing.

Abstract: A semiconductor structure is formed with first and second semiconductor wafers and a redistribution layer. The first semiconductor wafer is formed with a first active layer and a first interconnect layer. The second semiconductor wafer is formed with a second active layer and a second interconnect layer. The second semiconductor wafer is inverted and bonded to the first semiconductor wafer, and a substrate is removed from the second semiconductor wafer. The redistribution layer redistributes electrical connective pad locations on a side of the second semiconductor wafer. The redistribution layer also electrically contacts the first interconnect layer through a hole in the second active layer and the second interconnect layer.

Abstract: An integrated circuit assembly includes an insulating layer having a having a first surface and a second surface. A first active layer contacts the first surface of the insulating layer. A metal bond pad is electrically connected to the first active layer and formed on the second surface of the insulating layer. A substrate having a first surface and a second surface, with a second active layer formed in the first surface, is provided such that the first active layer is coupled to the second surface of the substrate.

Abstract: A first wafer is provided that includes an insulating layer, a first active layer, and a handle layer. The insulating layer has a first surface and a second surface. The first active layer contacts the first surface of the insulating layer. The handle layer contacts the second surface of the insulating layer. A second wafer is provided that includes a substrate and a second active layer. The substrate has a first surface and a second surface. The second active layer contacts the first surface of the substrate. The second wafer is bonded to the first wafer by physically connecting the first active layer to the second surface of the substrate. The handle layer is removed. A metal bond pad is formed on the second surface of the insulating layer. The metal bond pad is electrically connected to the first active layer.

Abstract: Descried herein are various technologies to visualizing data in a spreadsheet application. Customized visualizations are generated by binding a user-defined equation with a parameter of a primitive visual shape that has been selected by the user to visualized a dataset. The user-defined equation takes as input a value of data in a cell of the spreadsheet application, and the primitive visual shape is displayed to the user as a function of the output of the user-defined equation.

Abstract: An integrated circuit assembly includes an insulating layer having a having a first surface and a second surface, where the first surface of the insulating layer is less than 10 microns below an upper plane of the integrated circuit assembly. An active layer contacts the first surface of the insulating layer. A metal bond pad is electrically connected to the active layer and formed on the second surface of the insulating layer, and is also electrically connected to a printed circuit board.

Abstract: A treadmill, having: (a) a frame with front and rear rollers and a continuous tread wrapped therearound; (b) a flywheel connected to one of the front or rear rollers; and (c) a magnetic resistance unit positioned near the flywheel to provide resistance to rotation of the flywheel. The magnetic resistance unit is moved up and down by an operator to move a series of magnets to different positions near the flywheel such that the position of the magnets determines the amount of resistance provided to rotation of the flywheel.

Abstract: A sequence of low-level user input events that takes place during a demonstration is converted into a sequence of high-level events which is used to identify portions of a screencast video of the demonstration as event portions. A presenter rehearses, edits, and re-performs the demonstration during a live presentation by playing back an augmented version of the video that is generated on-the-fly and during at least one point in time includes visualizations of the current and next high-level events that are automatically overlaid on top of the video at the screen locations where these events takes place. A graphical user interface that includes a video sector and a timeline sector is displayed to the presenter. The augmented version of the video is played back within the video sector. An event timeline that includes an overall timeline showing each of the portions of the video is displayed within the timeline sector.

Abstract: An integrated circuit assembly includes an insulating layer having a having a first surface and a second surface. A first active layer contacts the first surface of the insulating layer. A metal bond pad is electrically connected to the first active layer and formed on the second surface of the insulating layer. A substrate having a first surface and a second surface, with a second active layer formed in the first surface, is provided such that the first active layer is coupled to the second surface of the substrate.

Abstract: An integrated circuit assembly includes an insulating layer having a having a first surface and a second surface, where the first surface of the insulating layer is less than 10 microns below an upper plane of the integrated circuit assembly. An active layer contacts the first surface of the insulating layer. A metal bond pad is electrically connected to the active layer and formed on the second surface of the insulating layer, and is also electrically connected to a printed circuit board. A method of fabricating an integrated circuit assembly includes coupling a handle wafer to the active layer of a semiconductor-on-insulator wafer, removing the substrate of the semiconductor-on-insulator, forming a bond pad connecting to the active layer on the exposed insulator surface, bonding the bond pad to a printed circuit board using a solder bump, and removing the handle wafer.

Abstract: An integrated circuit assembly includes an insulating layer having a having a first surface and a second surface, where the first surface of the insulating layer is less than 10 microns below an upper plane of the integrated circuit assembly. An active layer contacts the first surface of the insulating layer. A metal bond pad is electrically connected to the active layer and formed on the second surface of the insulating layer, and is also electrically connected to a printed circuit board. A method of fabricating an integrated circuit assembly includes coupling a handle wafer to the active layer of a semiconductor-on-insulator wafer, removing the substrate of the semiconductor-on-insulator, forming a bond pad connecting to the active layer on the exposed insulator surface, bonding the bond pad to a printed circuit board using a solder bump, and removing the handle wafer.

Abstract: An integrated circuit assembly includes an insulating layer having a having a first surface and a second surface. A first active layer contacts the first surface of the insulating layer. A metal bond pad is electrically connected to the first active layer and formed on the second surface of the insulating layer. A substrate having a first surface and a second surface, with a second active layer formed in the first surface, is provided such that the first active layer is coupled to the second surface of the substrate.

Abstract: The pluggable web-based visualization technique described herein pertains to a method for providing pluggable web-based visualizations for applications. The method selects visualizations from the web to be embedded into a host application on a desktop computing device. The visualizations can be plugged in to a variety of host applications. This empowers end-users, application designers, and visualization designers by allowing greater reuse of existing code. Additionally, end-users do not have to wait for new revisions of existing applications to use the latest techniques. Designers of domain specific visualizations can work on just the visualization and have them incorporated into a variety of different host applications. Users can perform local processing and visualizations on their own machine, yet obtain new visualizations from the web where they can be updated more frequently and where special purpose visualizations are available.