Abstract: Apparatus for a modular fire control assembly for a firearm. The modular fire control assembly integrates a hammer, a sear, a disconnector, and sear and disconnector springs in a single housing. The force applied by the sear spring is adjustable by a set screw, which enables the sear spring force to be dialed in. The sear spring and set screw are contained in a block in the housing. The sear spring engages a detent that applies spring force to the sear. The sear spring moves in a smooth bore that has a ledge that allows the spring to maintain a minimum force even when the set screw is removed. A self-contained disconnector spring ensures constant spring force on the disconnector regardless of adjustments to the sear spring force. The modular assembly is configured to be received in a lock cavity of the firearm and secured using conventional pins.

Abstract: Apparatus for a modular fire control assembly for a firearm. The modular fire control assembly integrates a hammer, a sear, a disconnector, and sear and disconnector springs in a single housing. The force applied by the sear spring is adjustable by a set screw, which enables the sear spring force to be dialed in. The sear spring and set screw are contained in a block in the housing. The sear spring engages a detent that applies spring force to the sear. The sear spring moves in a smooth bore that has a ledge that allows the spring to maintain a minimum force even when the set screw is removed. A self-contained disconnector spring ensures constant spring force on the disconnector regardless of adjustments to the sear spring force. The modular assembly is configured to be received in a lock cavity of the firearm and secured using conventional pins.

Abstract: A cost effective and environmentally sound method for quickly removing liquid from surfaces of a substrate under manufacture without leaving behind substantial residue (e.g., silicon elements from the substrate, commonly known in the field as “water marks”). The process includes first providing a substrate (e.g., a semiconductor wafer, glass flat panel, or disc media), which has undergone one or more liquid-based processes (e.g., cleaning, scrubbing, rinsing, etc.). An upper surface and a lower surface of the substrate are then subjected to vacuum suction, thereby removing liquid thereon. An apparatus for removing liquid from surfaces of a substrate is also provided. The apparatus includes a plurality of vacuum application members configured for applying vacuum suction to surfaces of a substrate, thereby removing liquid therefrom.

Abstract: A cost effective and environmentally sound method for quickly removing liquid from surfaces of a substrate under manufacture without leaving behind substantial residue (e.g., silicon elements from the substrate, commonly known in the field as “water marks”). The process includes first providing a substrate (e.g., a semiconductor wafer, glass flat panel, or disc media), which has undergone one or more liquid-based processes (e.g., cleaning, scrubbing, rinsing, etc.). An upper surface and a lower surface of the substrate are then subjected to vacuum suction, thereby removing liquid thereon. An apparatus for removing liquid from surfaces of a substrate is also provided. The apparatus includes a plurality of vacuum application members configured for applying vacuum suction to surfaces of a substrate, thereby removing liquid therefrom.

Abstract: A cost effective and environmentally sound method for quickly removing liquid from surfaces of a substrate under manufacture without leaving behind substantial residue (e.g., silicon elements from the substrate, commonly known in the field as “water marks”). The process includes first providing a substrate (e.g., a semiconductor wafer, glass flat panel, or disc media), which has undergone one or more liquid-based processes (e.g., cleaning, scrubbing, rinsing, etc.). An upper surface and a lower surface of the substrate are then subjected to vacuum suction, thereby removing liquid thereon. An apparatus for removing liquid from surfaces of a substrate is also provided. The apparatus includes a plurality of vacuum application members configured for applying vacuum suction to surfaces of a substrate, thereby removing liquid therefrom.

Abstract: A cost effective and environmentally sound method for quickly removing liquid from surfaces of a substrate under manufacture without leaving behind substantial residue (e.g., silicon elements from the substrate, commonly known in the field as “water marks”). The process includes first providing a substrate (e.g., a semiconductor wafer, glass flat panel, or disc media), which has undergone one or more liquid-based processes (e.g., cleaning, scrubbing, rinsing, etc.). An upper surface and a lower surface of the substrate are then subjected to vacuum suction, thereby removing liquid thereon. An apparatus for removing liquid from surfaces of a substrate is also provided. The apparatus includes a plurality of vacuum application members configured for applying vacuum suction to surfaces of a substrate, thereby removing liquid therefrom.