Patents by Inventor Mark Dye

Mark Dye has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for removing liquid from substrate surfaces using suction
    Patent number: 7415780
    Abstract: A cost effective and environmentally sound method for quickly removing liquid from surfaces of a substrate under manufacture without leaving behind substantial residue (e.g., silicon elements from the substrate, commonly known in the field as “water marks”). The process includes first providing a substrate (e.g., a semiconductor wafer, glass flat panel, or disc media), which has undergone one or more liquid-based processes (e.g., cleaning, scrubbing, rinsing, etc.). An upper surface and a lower surface of the substrate are then subjected to vacuum suction, thereby removing liquid thereon. An apparatus for removing liquid from surfaces of a substrate is also provided. The apparatus includes a plurality of vacuum application members configured for applying vacuum suction to surfaces of a substrate, thereby removing liquid therefrom.
    Type: Grant
    Filed: September 12, 2005
    Date of Patent: August 26, 2008
    Assignee: P.C.T. Systems, Inc.
    Inventors: Henry R. Miranda, Mark Dye
  • Method and apparatus for removing liquid from substrate surfaces using suction
    Publication number: 20060005421
    Abstract: A cost effective and environmentally sound method for quickly removing liquid from surfaces of a substrate under manufacture without leaving behind substantial residue (e.g., silicon elements from the substrate, commonly known in the field as “water marks”). The process includes first providing a substrate (e.g., a semiconductor wafer, glass flat panel, or disc media), which has undergone one or more liquid-based processes (e.g., cleaning, scrubbing, rinsing, etc.). An upper surface and a lower surface of the substrate are then subjected to vacuum suction, thereby removing liquid thereon. An apparatus for removing liquid from surfaces of a substrate is also provided. The apparatus includes a plurality of vacuum application members configured for applying vacuum suction to surfaces of a substrate, thereby removing liquid therefrom.
    Type: Application
    Filed: September 12, 2005
    Publication date: January 12, 2006
    Applicant: P.C.T. Systems, Inc.
    Inventors: Henry Miranda, Mark Dye
  • Method and apparatus for removing liquid from substrate surfaces using suction
    Patent number: 6959503
    Abstract: A cost effective and environmentally sound method for quickly removing liquid from surfaces of a substrate under manufacture without leaving behind substantial residue (e.g., silicon elements from the substrate, commonly known in the field as “water marks”). The process includes first providing a substrate (e.g., a semiconductor wafer, glass flat panel, or disc media), which has undergone one or more liquid-based processes (e.g., cleaning, scrubbing, rinsing, etc.). An upper surface and a lower surface of the substrate are then subjected to vacuum suction, thereby removing liquid thereon. An apparatus for removing liquid from surfaces of a substrate is also provided. The apparatus includes a plurality of vacuum application members configured for applying vacuum suction to surfaces of a substrate, thereby removing liquid therefrom.
    Type: Grant
    Filed: June 13, 2003
    Date of Patent: November 1, 2005
    Assignee: P.C.T. Systems, Inc.
    Inventors: Henry R. Miranda, Mark Dye
  • Method and apparatus for removing liquid from substrate surfaces using suction
    Publication number: 20040250444
    Abstract: A cost effective and environmentally sound method for quickly removing liquid from surfaces of a substrate under manufacture without leaving behind substantial residue (e.g., silicon elements from the substrate, commonly known in the field as “water marks”). The process includes first providing a substrate (e.g., a semiconductor wafer, glass flat panel, or disc media), which has undergone one or more liquid-based processes (e.g., cleaning, scrubbing, rinsing, etc.). An upper surface and a lower surface of the substrate are then subjected to vacuum suction, thereby removing liquid thereon. An apparatus for removing liquid from surfaces of a substrate is also provided. The apparatus includes a plurality of vacuum application members configured for applying vacuum suction to surfaces of a substrate, thereby removing liquid therefrom.
    Type: Application
    Filed: June 13, 2003
    Publication date: December 16, 2004
    Applicant: P.C.T. Systems, Inc.
    Inventors: Henry R. Miranda, Mark Dye