Abstract: Devices, systems, and methods for making and using highly sustainable circuit assemblies are disclosed herein. In various aspects, the highly sustainable circuit assembly includes a substrate layer; and a pattern of contact points supported by the substrate layer. The pattern of contact points can be configured to correspond to at least one terminal of an electrical component. The pattern of contact points can include a deformable conductive material. The deformable conductive material can be a non-hazardous, readily reclaimable, readily recyclable material.

Abstract: Disclosed herein are low dielectric constant (low-k) two-dimensional covalent organic framework materials that have a dielectric constant k less than 2.4, optionally less than 1.9, and are comprised of regularly porous, covalently linked, layer structures.

Abstract: A neck brace (10) comprises an impact surface (39,55) adjacent the neck of a wearer of the brace (10) that it is spaced from a helmet (42) and that is configured to limit movement of the helmet by contacting an underside (46) of the helmet, a bearing surface (15,35) bearing on the wearer's body; and a resilient structure (12) between the impact surface (39,55) and the bearing surface (15,35) for transferring impact loads from the helmet (42) on the impact surface, to the wearer's body via the bearing surface. The brace (10) further includes restraining means (58) that is attachable to the rear of the structure (12) with a releasable clip mechanism (66) and to the helmet (42) to inhibit movement of the helmet. The restraining means is in the form of a tether (58) that is attached to the helmet (42) at two spaced locations and that passes with clearance through an aperture in an anchor element (62,64), to allow the helmet (42) to be moved freely while the tether (58) slides through the aperture.