Abstract: An apparatus may include a diode-pumped solid-state laser oscillator configured to output a pulsed laser beam, a modulator configured to modify an energy and a temporal profile of the pulsed laser beam, and an amplifier configured to amplify an energy of the pulse laser beam. A modified and amplified beam to laser peen a target part may have an energy of about 5 J to about 10 J, an average power (defined as energy (J)×frequency (Hz)) of from about 25 W to about 200 W, with a flattop beam uniformity of less than about 0.2. The diode-pumped solid-state oscillator may be configured to output a beam having both a single longitudinal mode and a single transverse mode, and to produce and output beams at a frequency of about 20 Hz.

Abstract: An apparatus is provided, the apparatus comprising: (i) a diode-pumped solid-state laser oscillator configured to generate a pulsed laser beam having predefined beam characteristics corresponding to a current setting selection of a controller; and (ii) an amplifier configured to amplify an energy and modify a beam profile of the pulse laser beam. A beam detector is coupled to the generated beam to monitor a combination of: (i) a beam pulse width; (ii) a beam diameter; and (iii) an energy level, and generates an error signal to be sent back as a feedback signal to the controller. The controller configures the current source to output a correction current to tune the DPSSL oscillator, the wave plate, and the first polarizer to rotate a correction polarization angle and adjust the energy amplification or temporal profile to within a defined performance tolerance.

Abstract: An apparatus may include a diode-pumped solid-state laser oscillator configured to output a pulsed laser beam, a modulator configured to modify an energy and a temporal profile of the pulsed laser beam, and an amplifier configured to amplify an energy of the pulse laser beam. A modified and amplified beam to laser peen a target part may have an energy of about 5J to about 10 J, an average power (defined as energy (J)×frequency (Hz)) of from about 25 W to about 200 W, with a flattop beam uniformity of less than about 0.2. The diode-pumped solid-state oscillator may be configured to output a beam having both a single longitudinal mode and a single transverse mode, and to produce and output beams at a frequency of about 20 Hz.

Abstract: An apparatus may include a diode-pumped solid-state laser oscillator configured to output a pulsed laser beam, a modulator configured to modify an energy and a temporal profile of the pulsed laser beam, and an amplifier configured to amplify an energy of the pulse laser beam. A modified and amplified beam to laser peen a target part may have an energy of about 5 J to about 10 J, an average power (defined as energy (J)×frequency (Hz)) of from about 25 W to about 200 W, with a flattop beam uniformity of less than about 0.2. The diode-pumped solid-state oscillator may be configured to output a beam having both a single longitudinal mode and a single transverse mode, and to produce and output beams at a frequency of about 20 Hz.

Abstract: Methods, systems, and apparatuses are disclosed for the protection of optical components used during laser bond inspection. In one embodiment, an optic surface wetting enhancement is provided on a protective optic to assist in forming a substantially flat film of transparent liquid from transparent liquid applied to a surface of a protective optic. A flat film of transparent liquid on a surface of a protective optic may be used to retain debris and effluent backscatter produced during a laser bond inspection process.

Abstract: Methods, systems, and apparatuses are disclosed for the protection of optical components used during laser bond inspection. In one embodiment, an optic surface wetting enhancement is provided on a protective optic to assist in forming a substantially flat film of transparent liquid from transparent liquid applied to a surface of a protective optic. A flat film of transparent liquid on a surface of a protective optic may be used to retain debris and effluent backscatter produced during a laser bond inspection process.

Abstract: Methods, systems, and apparatuses are disclosed for the protection of optical components used during laser bond inspection. In one embodiment, an optic surface wetting enhancement is provided on a protective optic to assist in forming a substantially flat film of transparent liquid from transparent liquid applied to a surface of a protective optic. A flat film of transparent liquid on a surface of a protective optic may be used to retain debris and effluent backscatter produced during a laser bond inspection process.

Abstract: An apparatus may include a diode-pumped solid-state laser oscillator configured to output a pulsed laser beam, a modulator configured to modify an energy and a temporal profile of the pulsed laser beam, and an amplifier configured to amplify an energy of the pulse laser beam. A modified and amplified beam to laser peen a target part may have an energy of about 5J to about 10 J, an average power (defined as energy (J) x frequency (Hz)) of from about 25 W to about 200 W, with a flattop beam uniformity of less than about 0.2. The diode-pumped solid-state oscillator may be configured to output a beam having both a single longitudinal mode and a single transverse mode, and to produce and output beams at a frequency of about 20 Hz.

Abstract: Methods, systems, and apparatuses are disclosed for the protection of optical components used during laser bond inspection. In one embodiment, an optic surface wetting enhancement is provided on a protective optic to assist in forming a substantially flat film of transparent liquid from transparent liquid applied to a surface of a protective optic. A flat film of transparent liquid on a surface of a protective optic may be used to retain debris and effluent backscatter produced during a laser bond inspection process.

Abstract: An image processing system for monitoring a laser peening process includes a laser peening system having a workpiece positioner and a system controller. A video camera is utilized for forming an electronic image of at least a portion of a workpiece. An image processing computer is connected to the video camera, and the laser peening controller includes a program to determine a position of the workpiece.

Abstract: A method of testing the operation of a laser peening system includes providing a sensor in a possible laser beam path, applying a transparent overlay material to the sensor, directing a pulse of coherent energy to the sensor through the transparent overlay material to create a shock wave, and determining a characteristic of the created shock wave with the sensor.

Abstract: A method of producing a workpiece involves positioning the workpiece at a current processing position indicated by a hard-coded part program and then collecting position data which defines the positional arrangement of a current target area of the workpiece. The collected position data is processed by comparing it to reference position information that represents the positional arrangement of the same target area in an ideal workpiece employed in the development of the part program. The position of the workpiece (and hence the target area) is adjusted in accordance with the comparison results. A laser shock processing operation is performed on the workpiece at the current target area following the position adjustment step.

Abstract: A monitor of a plurality of optical signals utilizing fiber optics which form an array. An image of the array is captured and the captured image is processed for detecting a quality of an optical signal such as the presence, absence, intensity, wavelength, or other quality of the optical signal. A method of monitoring a plurality of optical signals by capturing a plurality of optical signals from an array of signals and detecting a quality of at least one optical signal is also disclosed.

Abstract: An image processing system for monitoring a laser peening process includes a laser peening system having a workpiece positioner and a system controller. A video camera is utilized for forming an electronic image of at least a portion of a workpiece. An image processing computer is connected to the video camera, and the laser peening controller includes a program to determine a position of the workpiece.

Abstract: An image processing system for monitoring a laser peening process includes a laser peening system having a workpiece positioner and a system controller. A video camera is utilized for forming an electronic image of at least a portion of a workpiece. An image processing computer is connected to the video camera, and the laser peening controller includes a program to determine a position of the workpiece.

Abstract: A laser shock processing apparatus with controller for controlling laser shock processing operation. The controller generates an operator perceivable alert when a processing value is not within a predetermined range of a preset value. The controller may adjust the processing value to be within the predetermined range or may deactivate a laser from directing a beam of coherent energy to a workpiece. In one embodiment, a plurality of controllers comprise distributed processing of various processing values for controlling laser shock processing operation.

Abstract: An apparatus creating a processing cell for laser peening operations includes an enclosure which substantially defines a work cell or processing cell with a transparent overlay material applicator disposed therein. A cleaning system is utilized that may include a vapor exhaust, liquid removal system, and a gas or air supply. A vapor exhaust system is connected to the enclosure for removing vapor from within the processing cell. A liquid removal system is connected to the enclosure for removing liquid from the processing cell. A gas or air supply is connected to the enclosure to flood the enclosure with gas or air to flush airborne debris therefrom. A workpiece manipulator may be disposed or operate within the cell for moving workpieces therein.

Abstract: An apparatus creating a processing cell for laser peening operations includes an enclosure which substantially defines a work cell or processing cell with a transparent overlay material applicator located therein. A cleaning system is utilized that may include a vapor exhaust, liquid removal system, and a gas or air supply. A vapor exhaust system is connected to the enclosure for removing vapor from within the processing cell. A liquid removal system is connected to the enclosure for removing liquid from the processing cell. A gas or air supply is connected to the enclosure to flood the enclosure with gas or air to flush airborne debris therefrom. A workpiece manipulator may be disposed or operate within the cell for moving workpieces therein.

Abstract: A temperature sensing system for over-heat detection includes a temperature sensing cable, interface unit and termination unit. The interface unit is configured to issue interrogation, communication and power signals to the termination unit through the temperature sensing cable. During normal operation issuance of the interrogation signal results in no reflection pulses, as the signal is dissipated through the termination resistance in the termination unit. When an over-heat, short circuit or open circuit condition exists, a reflected pulse is detected by the interface unit and this information is used to determine the type and location of the condition. The interface unit is also configured to supply power to the termination unit which in turn is stored in the termination unit to power its operations, including setting of the resistor values. The termination unit is used as an instrument of calibration in the subject system.

Abstract: Methods and apparatus for reading a luminescent and substantially transparent bar code 1 on a background surface 2 whose reflectance may vary over the coded area. Light 7 scans (70), and excites luminescence 8 in, the bar code 1. The light 7 also reflects (9) without luminescence from the background surface 2 of the bar code 1. A first electrical or optical signal 11 is provided (4) responsive to the reflected nonluminescent light 9, and a second electrical or optical signal 10 is provided (4) responsive to the luminescent 8. Typically the first signal 11 is processed (5) to provide a third signal 31 that varies with background reflectance substantially as does the second signal 10; and the second and third signals 10, 31 are combined (5) to provide a fourth signal 12 that is substantially independent of background reflectance in the coded area, and which is decoded (6) to provide the desired reading.