Abstract: A multi-die sensor system comprises a package and one or more transducer dies mounted in the package. Each transducer die includes one or more transducers, a temperature control element, and temperature sensor. The temperature control element changes the temperature of at least a portion of the transducer during operation of the temperature control element. A temperature sensor senses the temperature of at least the portion of the transducer. An output circuitry die mounted in the package receives transducer signals and a sensed temperature signal from the temperature sensor.

Abstract: A sensor device comprises a device structure and a cap coupled with the device structure to produce a cavity in which components of the sensor device are located. The device structure includes a substrate and a movable element spaced apart from a surface of the substrate. A port extends through the substrate underlying the movable element. A sense element is spaced apart from the movable element and is displaced away from the port. The movable element and the sense element form an inertial sensor to sense a motion stimulus as movement of the movable element relative to the sense element. An additional sense element together with a diaphragm spans across the port. The movable element and the additional sense element form a pressure sensor for sensing a pressure stimulus from an external environment as movement of the additional sense element together with the diaphragm relative to the movable element.

Abstract: Systems and methods are provided for monitoring operation of MEMS accelerometers (100). In these embodiments a control loop (112) having a forward path (114) is coupled a MEMS transducer (110), and a test signal generator (124) and test signal detector (126) is provided. The test signal generator (124) is configured to generate a test signal and apply the test signal to the forward path (114) of the control loop (112) during operation of the MEMS accelerometer transducer (110). The test signal detector (126) is configured to receive an output signal from the control loop and detect the effects of the test signal in the output signal. Finally, the test signal detector (126) is further configured to generate a monitor output indicative of the operation of the sensing device to provide for the continuous monitoring of the operation of the MEMS accelerometer (100).

Abstract: A tester configured to test a strip of devices is provided. The tester may include a communications system, a plurality of communication lines, a plurality of multiplexors, each multiplexor having at least two outputs, wherein each multiplexor is configured to receive a signal generated by the communications system via one of the plurality of communication lines, and each multiplexor may be selectably coupled to at least two of the devices in the strip of devices. The tester may be configured to index the plurality of communication lines to a first subset of the devices, initiate at least one test, command the devices to generate data for each of the at least one tests, retrieve data from a first set of the devices, and retrieve data from a second set of the devices.

Abstract: A MEMS device (20) includes a movable element (20) suspended above a substrate (22) by a spring member (34) having a spring constant (104). A spring softening voltage (58) is applied to electrodes (24, 26) facing the movable element (20) during a powered mode (100) to decrease the stiffness of the spring member (34) and thereby increase the sensitivity of the movable element (32) to an input stimulus (46). Upon detection of a stiction condition (112), the spring softening voltage (58) is effectively removed to enable recovery of the movable element (32) from the stiction condition (112). A higher mechanical spring constant (104) yields a stiffer spring (34) having a larger restoring force (122) in the unpowered mode (96) in order to enable recovery from the stiction condition (112). A feedback voltage (56) can be applied to feedback electrodes (28, 30) facing the movable element (32) to provide electrical damping.

Abstract: A multi-mass resonator and a common-mode detection circuit are provided. The common-mode detection circuit, for example, may include a plurality of sensing electrodes, an interface circuit configured to interface with the plurality of sensing electrodes, and a common-mode capacitance extractor circuit electrically coupled in parallel to the interface circuit and configured to detect common-mode capacitance between the plurality of sensing electrodes and output a voltage representative the detected common-mode capacitance, and a differential-mode capacitance extractor circuit electrically coupled in parallel to the interface circuit and configured to detect differential-mode capacitance between the plurality of sensing electrodes and output a voltage representative the detected differential-mode capacitance.

Abstract: An assembly (220) includes a MEMS die (222) and an integrated circuit (IC) die (224) attached to a substrate (226). The MEMS die (222) includes a MEMS device (237) formed on a substrate (242). A packaging process (264) entails forming the MEMS device (237) on the substrate (242) and removing a material portion of the substrate (237) surrounding the device (237) to form a cantilevered substrate platform (246) suspended above the substrate (226) at which the MEMS device (237) resides. The MEMS die (222) is electrically interconnected with the IC die (224). A plug element (314) can be positioned overlying the platform (246). Molding compound (32) is applied to encapsulate the die (222), the IC die (224), and substrate (226). Following encapsulation, the plug element (314) can be removed, and a cap (236) can be coupled to the substrate (242) overlying an active region (244) of the MEMS device (237).

Abstract: A microelectromechanical system (MEMS) package is disclosed herein. The MEMS package includes a movable mass. The MEMS package further includes a first and second sense electrodes spaced apart from the movable mass. The first and second sense electrodes are configured to be electrically coupled with a controller. The MEMS package further includes a first test electrode and a second test electrode spaced apart from the movable mass. The first and the second test electrodes are configured to be electrically connected to first and second external electrical connectors, respectively. The first and second test electrodes are biased at a first voltage and a second voltage, respectively, when the first and second external electrical connectors are connected to external voltage sources.

Abstract: A MEMS resonator system comprises a MEMS resonator, kick start circuitry, feedback circuitry, an oscillator, and a switch. The MEMS resonator system is configured to provide a pulsed kick-start signal having a frequency and period such that energy delivered to the MEMS resonator is optimized in a short period of time, resulting is reduced oscillator startup time. The MEMS resonator system is configured to switch out the kick-start signal when the MEMS resonator oscillation has been achieved, and switch in feedback circuitry to maintain the MEMS resonator in a state of oscillation.

Abstract: Systems and methods are provided for monitoring operation of MEMS gyroscopes (110). A test signal generator (124) is configured to generate and apply a test signal to the rate feedback loop (112) of a MEMS gyroscope (110). A test signal detector (126) is coupled to the quadrature feedback loop (114) of the MEMS gyroscope (110) and is configured to receive a quadrature output signal from the quadrature feedback loop (114). The test signal detector (126) demodulates the quadrature output signal to detect effects of the test signal. Finally, the test signal detector (126) is configured to generate a monitor output indicative of the operation of the sensing device based at least in part on the detected effects of the test signal in the quadrature output signal. Thus, the system is able to provide for the continuous monitoring of the operation of the MEMS gyroscope (110).

Abstract: Systems and methods are provided for improved multifunction sensing. In these embodiments a multifunction sensing device (100) includes a microelectromechanical (MEMS) gyroscope (110) and at least a second sensor (112). The MEMS gyroscope (110) is configured to generate a first clock signal, and the second sensor includes a second clock signal. The multifunction sensing device further includes a reset mechanism (114), the reset mechanism (114) configured to generate a reset signal to set the relative periodic phase alignment of the second clock signal to the first clock signal. Consistently setting the relative periodic phase alignment of the clocks for the other sensor devices (112) to the clock of the MEMS gyroscope (110) can improve the performance of the devices by reducing the probability that varying output offsets will occur in the multiple sensing devices.

Abstract: An assembly (20) includes a MEMS die (22) having a pressure transducer device (40) formed on a substrate (44) and a cap layer (38). A packaging process (74) entails forming the device (40) on the substrate, creating an aperture (70) through a back side (58) of the substrate underlying a diaphragm (46) of the device (40), and coupling a cap layer (38) to the front side of the substrate overlying the device. A trench (54) is produced extending through both the cap layer and the substrate, and the trench surrounds a cantilevered platform (48) at which the diaphragm resides. The MEMS die is suspended above a substrate (26) so that a clearance space (60) is formed between the cantilevered platform and the substrate. The diaphragm is exposed to an external environment (68) via the aperture, the clearance space, and an external port.

Abstract: A multi-mass resonator and a common-mode detection circuit are provided. The common-mode detection circuit, for example, may include a plurality of sensing electrodes, an interface circuit configured to interface with the plurality of sensing electrodes, and a common-mode capacitance extractor circuit electrically coupled in parallel to the interface circuit and configured to detect common-mode capacitance between the plurality of sensing electrodes and output a voltage representative the detected common-mode capacitance, and a differential-mode capacitance extractor circuit electrically coupled in parallel to the interface circuit and configured to detect differential-mode capacitance between the plurality of sensing electrodes and output a voltage representative the detected differential-mode capacitance.

Abstract: A multi-die sensor system comprises a package and one or more transducer dies mounted in the package. Each transducer die includes one or more transducers, a temperature control element, and temperature sensor. The temperature control element changes the temperature of at least a portion of the transducer during operation of the temperature control element. A temperature sensor senses the temperature of at least the portion of the transducer. An output circuitry die mounted in the package receives transducer signals and a sensed temperature signal from the temperature sensor.

Abstract: An assembly (20) includes a MEMS die (22) having a pressure transducer device (40) formed on a substrate (44) and a cap layer (38). A packaging process (74) entails forming the device (40) on the substrate, creating an aperture (70) through a back side (58) of the substrate underlying a diaphragm (46) of the device (40), and coupling a cap layer (38) to the front side of the substrate overlying the device. A trench (54) is produced extending through both the cap layer and the substrate, and the trench surrounds a cantilevered platform (48) at which the diaphragm resides. The MEMS die is suspended above a substrate (26) so that a clearance space (60) is formed between the cantilevered platform and the substrate. The diaphragm is exposed to an external environment (68) via the aperture, the clearance space, and an external port.

Abstract: An assembly (20) includes a MEMS die (22) having a pressure transducer device (40) formed on a substrate (44) and a cap layer (38). A packaging process (74) entails forming the device (40) on the substrate, creating an aperture (70) through a back side (58) of the substrate (44) underlying a diaphragm (46) of the device (40), and coupling a cap layer (38) to the front side of the substrate (44) overlying the device (40). A trench (54) is produced extending through both the cap layer (38) and the substrate (44), and surrounds a cantilevered platform (48) at which the diaphragm (46) resides. The die (22) is suspended above a substrate (26) so that a clearance space (60) is formed between the platform (48) and the substrate (26). The diaphragm (46) is exposed to an external environment (68) via the aperture (70) and the space (60), and an external port.

Abstract: A MEMS resonator system comprises a MEMS resonator, kick start circuitry, feedback circuitry, an oscillator, and a switch. The MEMS resonator system is configured to provide a pulsed kick-start signal having a frequency and period such that energy delivered to the MEMS resonator is optimized in a short period of time, resulting is reduced oscillator startup time. The MEMS resonator system is configured to switch out the kick-start signal when the MEMS resonator oscillation has been achieved, and switch in feedback circuitry to maintain the MEMS resonator in a state of oscillation.

Abstract: Systems and methods are provided for improved multifunction sensing. In these embodiments a multifunction sensing device (100) includes a microelectromechanical (MEMS) gyroscope (110) and at least a second sensor (112). The MEMS gyroscope (110) is configured to generate a first clock signal, and the second sensor includes a second clock signal. The multifunction sensing device further includes a reset mechanism (114), the reset mechanism (114) configured to generate a reset signal to set the relative periodic phase alignment of the second clock signal to the first clock signal. Consistently setting the relative periodic phase alignment of the clocks for the other sensor devices (112) to the clock of the MEMS gyroscope (110) can improve the performance of the devices by reducing the probability that varying output offsets will occur in the multiple sensing devices.

Abstract: Systems and methods are provided for monitoring operation of MEMS gyroscopes (110). A test signal generator (124) is configured to generate and apply a test signal to the rate feedback loop (112) of a MEMS gyroscope (110). A test signal detector (126) is coupled to the quadrature feedback loop (114) of the MEMS gyroscope (110) and is configured to receive a quadrature output signal from the quadrature feedback loop (114). The test signal detector (126) demodulates the quadrature output signal to detect effects of the test signal. Finally, the test signal detector (126) is configured to generate a monitor output indicative of the operation of the sensing device based at least in part on the detected effects of the test signal in the quadrature output signal. Thus, the system is able to provide for the continuous monitoring of the operation of the MEMS gyroscope (110).

Abstract: Systems and methods are provided for monitoring operation of MEMS accelerometers (100). In these embodiments a control loop (112) having a forward path (114) is coupled a MEMS transducer (110), and a test signal generator (124) and test signal detector (126) is provided. The test signal generator (124) is configured to generate a test signal and apply the test signal to the forward path (114) of the control loop (112) during operation of the MEMS accelerometer transducer (110). The test signal detector (126) is configured to receive an output signal from the control loop and detect the effects of the test signal in the output signal. Finally, the test signal detector (126) is further configured to generate a monitor output indicative of the operation of the sensing device to provide for the continuous monitoring of the operation of the MEMS accelerometer (100).