Abstract: A powered fastener driver includes a driver blade movable from a top-dead-center (TDC) position to a bottom-dead-center (BDC) position for driving a fastener into a workpiece and a drive unit for providing torque to move the driver blade from the BDC position toward the TDC position. A rotary lifter is engageable with the driver blade and configured to receive torque from the drive unit for returning the driver blade from the BDC position toward the TDC position. The lifter has a body, a drive pin coupled to the body, and a roller positioned on the drive pin. The roller includes an engagement section configured to receive an end portion of a tooth of the driver blade. The lifter includes a means for aligning the engagement section with the end portion of the tooth on the driver blade to facilitate meshing between the end portion and the roller.

Abstract: An electrical connector system for use with independently heated hoses includes a first electrical connector, a second electrical connector, a third electrical connector, and a fourth electrical connector. The first electrical connector includes a first key that mates with a second key of the second electrical connector. The third electrical connector includes a third key that mates with a fourth key of the fourth electrical connector. The first and second keys differ from the third and fourth keys, ensuring the electrical connectors are correctly connected.

Abstract: A monolithic microwave integrated circuit (MMIC) flip chip interconnect is formed by coating an active side of the chip with a dielectric coating, such as benzocyclobutene (BCB), that inhibits deposition of metal plating materials. A portion of the dielectric coating is removed to expose bond pads on the active side of the chip, stud bumps are bonded to the bond pads, and the active side is then plated with first and second consecutive metal plating materials, such as nickel and gold, respectively, that do not adhere to the dielectric coating. The chip is then oriented such that the plated stud bumps on the active side of the chip face bond pads on a substrate, and the stud bumps on the chip are bonded to the bond pads on the substrate.

Abstract: A monolithic microwave integrated circuit (MMIC) flip chip interconnect is formed by coating an active side of the chip with a dielectric coating, such as benzocyclobutene (BCB), that inhibits deposition of metal plating materials. A portion of the dielectric coating is removed to expose bond pads on the active side of the chip, stud bumps are bonded to the bond pads, and the active side is then plated with first and second consecutive metal plating materials, such as nickel and gold, respectively, that do not adhere to the dielectric coating. The chip is then oriented such that the plated stud bumps on the active side of the chip face bond pads on a substrate, and the stud bumps on the chip are bonded to the bond pads on the substrate.

Abstract: A scented fishing weight having a housing and a porous insert. The housing is comprised of a material having a high specific gravity relative to water, and includes a channel to accommodate a fishing line. The insert can fit within a recess in the housing, and is capable of receiving and dispersing scented fish attractant. In one configuration, an aperture adjacent the porous insert is smaller than the radial dimension of the porous insert such that the insert can be squeezed then passed through the aperture and into the recess, after which the insert expands back to its pre-squeezed radial dimension. In another configuration, the housing is capped off at the end nearest the insert with the end cap in a press-fit arrangement, while in another, the end cap is threadably engageable with the housing to facilitate the exchange of inserts containing different scents, depending on the type of fish the user is attempting to attract.

Abstract: This disclosure relates to a plasma generation device particularly adapted to an electrothermal-chemical propulsion system. The device comprises a membranous conductive substance having structural compositions which enable the formation of a continuous and volumetrically distributed, segmentally varied plasma arc. The membranous substance is versatile and operates, inter alia, as a fuse wire, plasma incubator, plasma container, plasma distributor, plasma infusion and permeation media as well as a fuel container.

Abstract: This disclosure relates to a plasma generation device particularly adapted to an electrothermal-chemical propulsion system. The device comprises a membranous conductive substance having structural compositions which enable the formation of a continuous and volumetrically distributed plasma arc. The membranous substance is versatile and operates, inter alia, as a fuse wire, plasma incubator, plasma container, plasma distributor, plasma infusion and permeation media as well as a fuel container.

Abstract: This disclosure relates to a plasma generation device particularly adapted to an electrothermal-chemical propulsion system. The device comprises a membranous conductive substance having structural compositions which enable the formation of a continuous and volumetrically distributed plasma arc. The membranous substance is versatile and operates, inter alia, as a fuse wire, plasma incubator, plasma container, plasma distributor, plasma infusion and permeation media as well as a fuel container.

Abstract: The method and apparatus disclosed herein relates to harnessing plasma to ignite, pressurize and distribute plasma, plasma-ignited chemical fluid and fuel throughout a propellant mass. Particularly, the present invention enables the creation of a progressive burning surface whereby the propellant reaches maximum pressure controllably and losses pressure much more slowly thus creating high piezometric efficiency. More particularly, in gun-charge-projectile systems, by using radial perforations designed to provide a balanced plasma discharge through a capillary wall and by developing forward accelerating thrust components, induced by the plasma pressure on a plasma-ignited chemical fluid and fuel mixture, the propelling charge travels down the gun tube with the projectile thus exerting substantial uniform pressure throughout the tube length and yielding a high ballistic efficiency which results in the attainment of high muzzle velocities.

Abstract: The apparatus and method disclosed herein relates to the generation of primary and fuel-enriched plasma to provide ignition and delivery for large amounts of electrical and electrothermal power to a propellant mass. Particularly, the present invention enables the creation of zones of controlled combustion by initially incubating primary plasma in a capillary chamber and mixing the primary plasma with fuel in a fuel chamber thus creating a fuel-enriched plasma. The primary plasma and the fuel-enriched plasma are segregatively, collectively and substantially simultaneously injected into the propellant mass via outlet ports and nozzles. The capillary and fuel chambers, and the nozzles and outlet ports undergo staged disintegration at reaching predetermined pressures and temperatures and are thereby consumed in the combustion process.

Abstract: The apparatus and method disclosed herein relates to axially aligned electrical contacts which connect a high electrical power pulse forming network to an electrothermal ammunition integrated plasma injector in a combustion augmented plasma gun for launching projectiles thereof. The contacts transfer high energy, intermittent pulses without arcing because structure provides for axially preloading the contacts to reduce contact resistance, for axially stiffening the contacts to eliminate contact bounce and for providing complementary conical contact surfaces to facilitate a high current density transfer.

Abstract: A modulation-doped field effect transistor comprises a gate recess through a top insulating layer, having a cross-section in a semiconductor layer increasing down to an interface with a further semiconductor layer and thereafter having a cross-section in the further semiconductor layer decreasing down to the bottom of the recess in the further semiconductor layer. A gate electrode is formed in the recess.