Patents by Inventor Mark E. Steinke, Jr.

Mark E. Steinke, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Memory module connector having memory module cooling structures
    Patent number: 8139355
    Abstract: One embodiment of the present invention provides a computer memory system that includes at least one DIMM connector having a DIMM socket for releasably receiving a terminal edge of a DIMM. A metallic or otherwise highly heat-conductive base is secured to the DIMM connector. A pair of heat spreaders is secured to the base on opposing sides of the DIMM socket. Each heat spreader includes a DIMM-engagement portion spaced from the base. The heat spreaders are nondestructively moveable between an open position spaced apart for receiving the DIMM between the heat spreaders and a closed position for thermally engaging opposing faces of the DIMM. The heat spreaders provide a continuous thermally-conductive pathway between the DIMM-engagement portion and the base. Heatsink fins extend laterally from the base to provide cooling.
    Type: Grant
    Filed: May 24, 2010
    Date of Patent: March 20, 2012
    Assignee: International Business Machines Corporation
    Inventors: David R. Motschman, Mark E. Steinke, Jr., Aparna Vallury