Abstract: Airflow in a computer chassis may be enhanced or reduced to affect cooling of heat generating devices using an ionic air moving device. A plurality of ionic air moving devices enhance or reduce airflow through a plurality of fluidically parallel airflow zones of the computer chassis in an airflow direction established by a nonionic air moving device. Each ionic air moving device comprises an ion emitter electrode disposed a spaced distance from a collector electrode, wherein a controller independently controls an electrical potential between the emitter and collector electrodes of each ionic air moving device for affecting the rate of airflow through one or more of the plurality of airflow zones.

Abstract: An apparatus for cooling a memory module installed in a computer system includes a liquid coolant conduit that is connected to a conduit support structure having a form factor selectively securable within a first preconfigured memory module socket of the computer system in order to position the liquid coolant conduit above the first socket. A heat pipe provides direct thermal contact between the liquid conduit and a heat spreader assembly in direct thermal contact with a face of the memory module. The apparatus may include a second heat pipe and second heat spreader assembly for similarly cooling a second memory module. In alternative configurations, the apparatus may cool memory modules on opposing sides of the conduit or memory modules that are both on the same side of the conduit.

Abstract: One embodiment of the present invention provides a computer memory system that includes at least one DIMM connector having a DIMM socket for releasably receiving a terminal edge of a DIMM. A metallic or otherwise highly heat-conductive base is secured to the DIMM connector. A pair of heat spreaders is secured to the base on opposing sides of the DIMM socket. Each heat spreader includes a DIMM-engagement portion spaced from the base. The heat spreaders are nondestructively moveable between an open position spaced apart for receiving the DIMM between the heat spreaders and a closed position for thermally engaging opposing faces of the DIMM. The heat spreaders provide a continuous thermally-conductive pathway between the DIMM-engagement portion and the base. Heatsink fins extend laterally from the base to provide cooling.

Abstract: Methods, apparatus, and products are disclosed for improving the airflow exiting a blower that has one or more adjustable guide vanes that are affixed to the blower at one or more pivot points located in an outlet of the blower that include: determining a rotational speed of an impeller in the blower and adjusting a position of at least one of the adjustable guide vanes in dependence upon the rotational speed of the impeller.

Abstract: Methods, apparatus, and products are disclosed for improving the airflow exiting a blower that has one or more adjustable guide vanes that are affixed to the blower at one or more pivot points located in an outlet of the blower that include: determining a rotational speed of an impeller in the blower and adjusting a position of at least one of the adjustable guide vanes in dependence upon the rotational speed of the impeller.

Abstract: Methods, apparatus, and products are disclosed for improving the airflow exiting a blower that has one or more adjustable guide vanes that are affixed to the blower at one or more pivot points located in an outlet of the blower that include: determining a rotational speed of an impeller in the blower and adjusting a position of at least one of the adjustable guide vanes in dependence upon the rotational speed of the impeller.

Abstract: Embodiments of the present invention include a cooling system and method for cooling a computer rack by circulating liquid coolant through different sections of a rack heat exchanger under separately controlled flow and temperature conditions. In a method according to one embodiment, a first liquid coolant is supplied to a first section of an air-to-liquid heat exchanger. A second liquid coolant is supplied to a second section of the air-to-liquid heat exchanger at a different temperature than the first liquid coolant. Airflow is generated through rack-mounted computer components to the first and second sections of the air-to-liquid heat exchanger. The flow rates of the first and second liquid coolants are independently controlled to enforce a target cooling parameter. The independent operation of the first and second fin tube sections allows for the increased use of un-chilled water without sacrificing heat removal objectives.

Abstract: A testing system includes a single air collection box and a laminar flow system for obtain an airflow measurement. The single airflow box has air inlet and outlet ports at opposite ends. The laminar flow element has a laminar flow element inlet in fluid communication with the air collection box and a laminar flow element outlet sealed with the air outlet port of the air collection box. A blower in fluid communication with the laminar flow element outlet draws airflow into the air collection box through a unit under test and out of the air collection box through the laminar flow element. A pressure transducer senses the differential air pressure across the laminar flow element and enables a determination of the airflow rate.

Abstract: DIMMs are cooled by positioning a thermally conductive base between adjacent DIMMs. The thermally conductive base, such as a heat pipe or metal rod, receives heat from the DIMMs through thermally conductive elements that are selectively biased outward against the installed DIMMs. The base transfers the heat to a liquid conduit extending along the end of the DIMMs, where a circulating liquid carries away the heat. The thermally conductive elements provide an adjustable span to accommodate variations in distance between the DIMM surfaces. Embodiments of the invention may be installed without extending above the height of the DIMM.

Abstract: A testing system includes a single air collection box and a laminar flow system for obtain an airflow measurement. The single airflow box has air inlet and outlet ports at opposite ends. The laminar flow element has a laminar flow element inlet in fluid communication with the air collection box and a laminar flow element outlet sealed with the air outlet port of the air collection box. A blower in fluid communication with the laminar flow element outlet draws airflow into the air collection box through a unit under test and out of the air collection box through the laminar flow element. A pressure transducer senses the differential air pressure across the laminar flow element and enables a determination of the airflow rate.

Abstract: Detecting a fouled air filter in a computer equipment enclosure that includes an air filter, a supply plenum connecting the air filter and the computer equipment enclosure, a fan operating at a current fan speed, and a filter monitoring module connected for data communications to a management module. Detecting a fouled air filter according to embodiments of the present invention includes calculating, by the filter monitoring module, a pressure differential across the air filter; determining, for the current fan speed by the filter monitoring module in dependence upon a pressure differential profile for the air filter, whether the calculated pressure differential across the air filter exceeds a predetermined threshold value; and if the calculated pressure differential across the air filter exceeds the predetermined threshold value, reporting, by the filter monitoring module to the management module, that the calculated pressure differential across the air filter exceeds the predetermined threshold value.

Abstract: Apparatus and method are provided for facilitating air-cooling of an electronics system employing a vapor-compression heat exchange system, and front and back covers. An evaporator housing of the heat exchange system is mounted to a system housing of the electronics system and extends at least partially between air inlet and outlet sides of the system housing. The evaporator housing includes air inlet and outlet openings, and an evaporator. The front cover is mounted to the system or evaporator housing adjacent to the air inlet side or air outlet opening, and the back cover is mounted to the system or evaporator housing adjacent to the air outlet side or air inlet opening. Together, the system housing, back cover, evaporator housing and front cover define a closed loop airflow path passing through the system housing and evaporator housing, with the vapor-compression heat exchange system cooling air circulating therethrough.

Abstract: Detecting a fouled air filter in a computer equipment enclosure that includes an air filter, a supply plenum connecting the air filter and the computer equipment enclosure, a fan operating at a current fan speed, and a filter monitoring module connected for data communications to a management module. Detecting a fouled air filter according to embodiments of the present invention includes calculating, by the filter monitoring module, a pressure differential across the air filter; determining, for the current fan speed by the filter monitoring module in dependence upon a pressure differential profile for the air filter, whether the calculated pressure differential across the air filter exceeds a predetermined threshold value; and if the calculated pressure differential across the air filter exceeds the predetermined threshold value, reporting, by the filter monitoring module to the management module, that the calculated pressure differential across the air filter exceeds the predetermined threshold value.

Abstract: Apparatus and method are provided for facilitating air-cooling of an electronics system employing a vapor-compression heat exchange system, and front and back covers. An evaporator housing of the heat exchange system is mounted to a system housing of the electronics system and extends at least partially between air inlet and outlet sides of the system housing. The evaporator housing includes air inlet and outlet openings, and an evaporator. The front cover is mounted to the system or evaporator housing adjacent to the air inlet side or air outlet opening, and the back cover is mounted to the system or evaporator housing adjacent to the air outlet side or air inlet opening. Together, the system housing, back cover, evaporator housing and front cover define a closed loop airflow path passing through the system housing and evaporator housing, with the vapor-compression heat exchange system cooling air circulating therethrough.