Patents by Inventor Mark E. Thurston

Mark E. Thurston has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package substrate for integrated circuit and method of making the substrate
    Patent number: 7152313
    Abstract: In some embodiments, an article of manufacture includes a metal layer and a first dielectric layer in contact with a first face of the metal layer. The article of manufacture also includes a second dielectric layer in contact with a second face of the metal layer. The second face of the metal layer is opposite to the first face of the metal layer. The metal layer may be a continuous sheet having slots formed therein to allow the first and second dielectric layers to adhere to each other by way of the slots.
    Type: Grant
    Filed: November 26, 2003
    Date of Patent: December 26, 2006
    Assignee: Intel Corporation
    Inventors: Dustin P. Wood, Mark E. Thurston, Mahadevan Suryakumar