Patents by Inventor Mark Eshelman

Mark Eshelman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor copper bond pad surface protection
    Publication number: 20050181191
    Abstract: Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.
    Type: Application
    Filed: March 21, 2005
    Publication date: August 18, 2005
    Applicant: Kulicke & Soffa Investments, Inc
    Inventors: Timothy Ellis, Nikhil Murdeshwar, Mark Eshelman, Christian Rheault