Abstract: The present invention provides a UV curable adhesive, wherein based on a total weight of the UV curable adhesive, the UV curable adhesive comprises: from 30 to 70 wt % of an acrylate oligomer; from 20 to 65 wt % of an acrylate monomer; from 1 to 10 wt % of acryloyl morpholine; from 1 to 15 wt % of a photo initiator; and from 0 to 10 wt % of a thickening agent, wherein the acrylate oligomer has a weight average molecular weight in a range of from 10,000 to 100,000 grams/mole and a glass transition temperature in a range of from ?50 to 0° C. According to the technical solution of the present invention, the adhesive layer obtained from curing the UV curable adhesive is relatively thick (for example, 0.8 mm), and the adhesive layer has good adhesion property, cohesive force, and tackiness.

Abstract: A crosslinkable composition, a crosslinked composition formed upon exposure of the crosslinkable composition to ultraviolet radiation or ionizing radiation, articles containing these compositions, and methods of making the articles are described. The crosslinkable compositions contain two different (meth)acrylate copolymers and can be applied to a substrate using an extrusion process. While being extruded, the crosslinkable compositions advantageously are resistant to crosslinking and/or increased molecular weights. The crosslinked compositions can function as adhesive compositions that are particularly well suited for use in electronic devices.

Abstract: The present invention is an optically clear adhesive composition including a free-radically polymerizable acrylate or meth(acrylate) functional group oligomer, a trialkyl borane complex initiator, a photoacid generator, and a photosensitizer. A viscosity of the composition immediately after mixing and a viscosity of the composition about 24 hours after mixing changes by less than about 10%.

Abstract: A crosslinkable composition, a crosslinked composition formed upon exposure of the crosslinkable composition to ultraviolet radiation or ionizing radiation, articles containing these crosslinkable or crosslinked compositions, and methods of making the articles are described. The crosslinkable compositions contain two different (meth)acrylate polymers and can be applied to a substrate using an extrusion process. While being extruded, the crosslinkable compositions advantageously are resistant to crosslinking and/or significantly increasing in molecular weight. The crosslinked compositions can function as either a pressure-sensitive adhesive composition or a heat bondable adhesive composition and are particularly well suited for use in electronic devices.

Abstract: A curable mixture, a partially cured composition, a cured composition, an article containing either the partially cured composition or the cured composition, and a method of bonding two substrates are provided. The partially cured composition functions as a pressure-sensitive adhesive while the cured composition functions as a structural or semi-structural adhesive. The curable mixture can be applied to a first substrate by printing or dispensing, if desired.

Abstract: Curable adhesive compositions are provided that can be cured using ultraviolet or visible light radiation. These curable adhesive compositions, which contain a curable (meth)acrylate copolymer, have a creep compliance that is less than 5(10?4) inverse Pascals at 25° C., a creep compliance that is greater than 1(10?3) inverse Pascals at 70° C., and a shear storage modulus greater than 40 kiloPascals when measured at 25° C. at a frequency of 1 radian/second.

Abstract: Curable compositions, cured compositions, articles containing the curable or cured compositions, and methods of making the articles are provided. More particularly, the curable compositions contain a (meth)acrylate-based polymer having pendant (meth)acryloyl groups, at least one monomer having a single ethylenically unsaturated group, a photoinitiator that includes an acyl phosphine oxide, and a thixotropic agent. The curable compositions can be printed or dispensed, if desired, and the cured compositions are pressure-sensitive adhesives.

Abstract: Adhesive articles with multi-layer adhesive constructions include a substrate and a multi-layered adhesive. The multi-layered adhesive includes a layer of a first adhesive in contact with the surface of the substrate, and a layer of siloxane-based pressure sensitive adhesive in contact with the first adhesive. The siloxane-based pressure sensitive adhesive includes a siloxane-(meth)acrylate co-polymer. The thickness of the siloxane-based pressure sensitive adhesive layer is less than the thickness of the first adhesive layer.

Abstract: The present invention provides a UV curable adhesive, wherein based on a total weight of the UV curable adhesive, the UV curable adhesive comprises: from 30 to 70 wt % of an acrylate oligomer; from 20 to 65 wt % of an acrylate monomer; from 1 to 10 wt % of acryloyl morpholine; from 1 to 15 wt % of a photo initiator; and from 0 to 10 wt % of a thickening agent, wherein the acrylate oligomer has a weight average molecular weight in a range of from 10,000 to 100,000 grams/mole and a glass transition temperature in a range of from ?50 to 0° C. According to the technical solution of the present invention, the adhesive layer obtained from curing the UV curable adhesive is relatively thick (for example, 0.8 mm), and the adhesive layer has good adhesion property, cohesive force, and tackiness.

Abstract: Crosslinkable compositions, crosslinked compositions, articles containing these compositions, and methods of making the articles are provided. The crosslinkable compositions, which include two (meth)acrylate polymers, are used to form the crosslinked compositions upon exposure to ultraviolet radiation. The crosslinkable and crosslinked compositions are free or substantially free of tackifiers. The crosslinked compositions can function as pressure-sensitive adhesives. The crosslinkable compositions are well suited for use with hot melt processing methods.

Abstract: Curable compositions, cured compositions, articles containing the curable or cured compositions, and methods of making the articles are provided. More particularly, the curable compositions contain a (meth)acrylate-based polymer having pendant (meth)acryloyl groups, at least one monomer having a single ethylenically unsaturated group, a photoinitiator that includes an acyl phosphine oxide, and a thixotropic agent. The curable compositions can be printed or dispensed, if desired, and the cured compositions are pressure-sensitive adhesives.

Abstract: Curable adhesive compositions are provided that can be cured using ultraviolet or visible light radiation. These curable adhesive compositions, which contain a curable (meth)acrylate copolymer, have a creep compliance that is less than 5(10?4) inverse Pascals at 25° C., a creep compliance that is greater than 1(10?3) inverse Pascals at 70° C., and a shear storage modulus greater than 40 kiloPascals when measured at 25° C. at a frequency of 1 radian/second.

Abstract: Curable adhesive compositions are provided that can be cured using ultraviolet or visible light radiation. These curable adhesive compositions, which contain a curable (meth)acrylate copolymer, have a creep compliance that is less than 5(10?4) inverse Pascals at 25° C., a creep compliance that is greater than 1(10?3) inverse Pascals at 70° C., and a shear storage modulus greater than 40 kiloPascals when measured at 25° C. at a frequency of 1 radian/second.

Abstract: The present invention is an optically clear adhesive composition including a free-radically polymerizable acrylate or meth(acrylate) functional group oligomer, a trialkyl borane complex initiator, a photoacid generator, and a photosensitizer. A viscosity of the composition immediately after mixing and a viscosity of the composition about 24 hours after mixing changes by less than about 10%.

Abstract: Methods for preparing silicone-containing polymers by essentially adiabatic polymerization methods are disclosed. The polymerization system includes free radically polymerizable monomers. The monomers include ethylenically unsaturated silicone-containing monomers and/or mercapto-functional silicones as well as additional free radically polymerizable monomers. The silicone-containing polymers are useful as adhesives or release materials.

Abstract: A curable mixture, a partially cured composition, a cured composition, an article containing either the partially cured composition or the cured composition, and a method of bonding two substrates are provided. The partially cured composition functions as a pressure-sensitive adhesive while the cured composition functions as a structural or semi-structural adhesive. The curable mixture can be applied to a first substrate by printing or dispensing, if desired.

Abstract: Methods for preparing silicone-containing polymers by essentially adiabatic polymerization methods are disclosed. The polymerization system includes free radically polymerizable monomers. The monomers include ethylenically unsaturated silicone-containing monomers and/or mercapto-functional silicones as well as additional free radically polymerizable monomers. The silicone-containing polymers are useful as adhesives or release materials.

Abstract: Crosslinkable compositions, crosslinked compositions, articles containing these compositions, and methods of making the articles are provided. The crosslinkable compositions, which include two (meth)acrylate polymers, are used to form the crosslinked compositions upon exposure to ultraviolet radiation. The crosslinkable and crosslinked compositions are free or substantially free of tackifiers. The crosslinked compositions can function as pressure-sensitive adhesives. The crosslinkable compositions are well suited for use with hot melt processing methods.

Abstract: Curable adhesive compositions are provided that can be cured using ultraviolet or visible light radiation. These curable adhesive compositions, which contain a curable (meth)acrylate copolymer, have a creep compliance that is less than 5(10?4) inverse Pascals at 25° C., a creep compliance that is greater than 1(10?3) inverse Pascals at 70° C., and a shear storage modulus greater than 40 kiloPascals when measured at 25° C. at a frequency of 1 radian/second.

Abstract: Methods for preparing silicone-containing polymers by essentially adiabatic polymerization methods are disclosed. The polymerization system includes free radically polymerizable monomers. The monomers include ethylenically unsaturated silicone-containing monomers and/or mercapto-functional silicones as well as additional free radically polymerizable monomers. The silicone-containing polymers are useful as adhesives or release materials.