Abstract: A method for polishing a metal layer (20) containing a combination of wide features (12), low density features (14), and high density features (18), is illustrated. A hydrophilic polish pad (24) having a shore D hardness of greater than 50 is used along with slurry (22) containing silica and an acidic based oxidizer such as oxadic acid in a chemical mechanical polishing (CMP) process. The result is less than 5:1 and preferably 1:1. This low selectivity results in the metal layer (20) being polished to a level below the surface of the surrounding oxide in a timed-controlled polish.

Abstract: An electrical strip assembly providing a light fixture supporting main body having a plurality of electrical outlets.

Abstract: A method and apparatus employed in an X-ray apparatus for compensating for attenuation caused by a subject to perform an improved X-ray exposure. A table is created comprising entries accessible via power and attenuation values. Each of the entries includes a first value T representing a time for radiation in the system to reach a base ion count, and a second value C representing an offset ion count from the base ion count. A first set of entries in the table are referenced using a first power setting, and a first base ion count is determined based upon the first power setting, and a maximum radiation exposure is determined for the first power setting and a subject's mass. Then, an X-ray emitter is activated until a current ion count from a radiation sampling means has exceeded the base ion count or total radiation emitted has exceeded the maximum radiation allowed for the given mass of a subject.

Abstract: A method and apparatus employed in an X-ray apparatus for compensating for attenuation caused by a subject to perform an improved X-ray exposure. A table is created comprising entries accessible via power and attenuation values. Each of the entries includes a first value T representing a time for radiation in the system to reach a base ion count, and a second value C representing an offset ion count from the base ion count. A first set of entries in the table are referenced using a first power setting, and a first base ion count is determined based upon the first power setting, and a maximum radiation exposure is determined for the first power setting and a subject's mass. Then, an X-ray emitter is activated until a current ion count from a radiation sampling means has exceeded the base ion count or total radiation emitted has exceeded the maximum radiation allowed for the given mass of a subject.