Patents by Inventor Mark Finkle

Mark Finkle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ROOM TEMPERATURE GLASS-TO-GLASS, GLASS-TO-PLASTIC AND GLASS-TO-GLASS CERAMIC/SEMICONDUCTOR BONDING
    Publication number: 20230124770
    Abstract: A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.
    Type: Application
    Filed: December 21, 2022
    Publication date: April 20, 2023
    Inventors: Pascal R. Ackermann-Karam, Mark Finkle, Daniella M. Harvey, Raymond Miller Karam, Georges Roussos
  • Room temperature glass-to-glass, glass-to-plastic and glass-to-ceramic/semiconductor bonding
    Patent number: 11571860
    Abstract: A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: February 7, 2023
    Assignee: CORNING INCORPORATED
    Inventors: Raymond Miller Karam, Georges Roussos, Mark Finkle, Danielle M. Harvey, Pascal R. Ackermann-Karam
  • Automatic stator wire lead routing
    Patent number: 10523075
    Abstract: An apparatus for automatically routing a wire lead of a stator from a first position to a second position includes a base assembly to receive the stator. A clamp assembly is mounted on the base assembly to hold the wire lead in the first position. An arbor rotates the wire lead. The arbor has a holder to hold the wire lead. An end effector grips and moves the wire lead. A controller moves the end effector to grip the wire lead at the first position and to couple the wire lead with the arbor. Further, the controller rotates the arbor to rotate the wire lead along the circumference of the stator by a pre-determined angle. The controller moves the end effector to grip the wire lead held by the holder, and to move the wire lead to the second position.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: December 31, 2019
    Assignee: Tesla, Inc.
    Inventors: James Paul Murphy, Mark Finkle, Christopher James Whelan, Patrick David Hunter, Nicholas Andrew Parrotta, Tal Fix
  • ROOM TEMPERATURE GLASS-TO-GLASS, GLASS-TO-PLASTIC AND GLASS-TO-CERAMIC/SEMICONDUCTOR BONDING
    Publication number: 20190232569
    Abstract: A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.
    Type: Application
    Filed: April 8, 2019
    Publication date: August 1, 2019
    Inventors: Raymond Miller Karam, Georges Roussos, Mark Finkle, Daniella M. Harvey, Pascal R. Ackermann-Karam
  • Room temperature glass-to-glass, glass-to-plastic and glass-to-ceramic/semiconductor bonding
    Patent number: 10293551
    Abstract: A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: May 21, 2019
    Assignee: PICOSYS INCORPORATED
    Inventors: Raymond Miller Karam, Georges Roussos, Mark Finkle, Daniella M. Harvey, Pascal R. Ackermann-Karam
  • AUTOMATIC STATOR WIRE LEAD ROUTING
    Publication number: 20180138771
    Abstract: An apparatus for automatically routing a wire lead of a stator from a first position to a second position includes a base assembly to receive the stator. A clamp assembly is mounted on the base assembly to hold the wire lead in the first position. An arbor rotates the wire lead. The arbor has a holder to hold the wire lead. An end effector grips and moves the wire lead. A controller moves the end effector to grip the wire lead at the first position and to couple the wire lead with the arbor. Further, the controller rotates the arbor to rotate the wire lead along the circumference of the stator by a pre-determined angle. The controller moves the end effector to grip the wire lead held by the holder, and to move the wire lead to the second position.
    Type: Application
    Filed: November 16, 2017
    Publication date: May 17, 2018
    Applicant: Tesla, Inc.
    Inventors: James Paul Murphy, Mark Finkle, Christopher James Whelan, Patrick David Hunter, Nicholas Andrew Parrotta, Tal Fix
  • ROOM TEMPERATURE GLASS-TO-GLASS, GLASS-TO-PLASTIC AND GLASS-TO-CERAMIC/SEMICONDUCTOR BONDING
    Publication number: 20170008223
    Abstract: A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.
    Type: Application
    Filed: September 23, 2016
    Publication date: January 12, 2017
    Inventors: Raymond Miller Karam, Georges Roussos, Mark Finkle, Daniella M. Harvey, Pascal R. Ackermann-Karam
  • Room temperature glass-to-glass, glass-to-plastic and glass-to-ceramic/semiconductor bonding
    Patent number: 9492990
    Abstract: A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.
    Type: Grant
    Filed: November 8, 2011
    Date of Patent: November 15, 2016
    Assignee: PICOSYS INCORPORATED
    Inventors: Ramond Miller Karam, Georges Roussos, Mark Finkle, Daniella M. Harvey, Pascal R. Ackermann-Karam
  • ROOM TEMPERATURE GLASS-TO-GLASS, GLASS-TO-PLASTIC AND GLASS-TO-CERAMIC/SEMICONDUCTOR BONDING
    Publication number: 20130112650
    Abstract: A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.
    Type: Application
    Filed: November 8, 2011
    Publication date: May 9, 2013
    Applicant: INVENIOS
    Inventors: Raymond Miller Karam, Georges Roussos, Mark Finkle, Daniella M. Harvey, Pascal R. Ackermann-Karam