Patents by Inventor Mark G. Phillips
Mark G. Phillips has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9389263Abstract: Methods and apparatus are presented for detecting degrading filter capacitors in motor drives or other power converters, in which an expected DC equivalent voltage and a measured DC equivalent voltage are computed according to sampled filter circuit currents and voltages, and compared to selectively identify filter capacitor degradation conditions in a power converter filter circuit.Type: GrantFiled: June 5, 2014Date of Patent: July 12, 2016Assignee: Rockwell Automation Technologies, Inc.Inventors: Christian Sartler, Yogesh Patel, Lixiang Wei, Mark G. Phillips
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Patent number: 9225093Abstract: A connector system is provided for use in power applications, such as for conveying three phase power in electrical enclosures. The system comprises plug assemblies in which a power conductor is mounted in a floating arrangement with elastically deformable conductive structures extending from either side thereof. A mating receptacle may be mounted on a bus conductor. Three such arrangements may be provided for conveying three phase power. The structures allow for plug-in mating of the system components while accommodating considerable translational and angular misalignment between the connector parts.Type: GrantFiled: June 3, 2014Date of Patent: December 29, 2015Assignee: Rockwell Automation Technologies, Inc.Inventors: Abdolmehdi Kaveh Ahangar, Steven C. Kaishian, Mark G. Phillips
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Publication number: 20150355259Abstract: Methods and apparatus are presented for detecting degrading filter capacitors in motor drives or other power converters, in which an expected DC equivalent voltage and a measured DC equivalent voltage are computed according to sampled filter circuit currents and voltages, and compared to selectively identify filter capacitor degradation conditions in a power converter filter circuit.Type: ApplicationFiled: June 5, 2014Publication date: December 10, 2015Applicant: ROCKWELL AUTOMATION TECHNOLOGIES, INC.Inventors: Christian Sartler, Yogesh Patel, Lixiang Wei, Mark G. Phillips
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Publication number: 20140287633Abstract: A connector system is provided for use in power applications, such as for conveying three phase power in electrical enclosures. The system comprises plug assemblies in which a power conductor is mounted in a floating arrangement with elastically deformable conductive structures extending from either side thereof. A mating receptacle may be mounted on a bus conductor. Three such arrangements may be provided for conveying three phase power. The structures allow for plug-in mating of the system components while accommodating considerable translational and angular misalignment between the connector parts.Type: ApplicationFiled: June 3, 2014Publication date: September 25, 2014Applicant: ROCKWELL AUTOMATION TECHNOLOGIES, INC.Inventors: Abdolmehdi Kaveh Ahangar, Steven C. Kaishian, Mark G. Phillips
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Patent number: 8764495Abstract: A connector system is provided for use in power applications, such as for conveying three phase power in electrical enclosures. The system comprises plug assemblies in which a power conductor is mounted in a floating arrangement with elastically deformable conductive structures extending from either side thereof. A mating receptacle may be mounted on a bus conductor. Three such arrangements may be provided for conveying three phase power. The structures allow for plug-in mating of the system components while accommodating considerable translational and angular misalignment between the connector parts.Type: GrantFiled: July 31, 2012Date of Patent: July 1, 2014Assignee: Rockwell Automation Technologies, Inc.Inventors: Abdolmehdi Kaveh Ahangar, Steven C. Kaishian, Mark G. Phillips
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Publication number: 20140038472Abstract: A connector system is provided for use in power applications, such as for conveying three phase power in electrical enclosures. The system comprises plug assemblies in which a power conductor is mounted in a floating arrangement with elastically deformable conductive structures extending from either side thereof. A mating receptacle may be mounted on a bus conductor. Three such arrangements may be provided for conveying three phase power. The structures allow for plug-in mating of the system components while accommodating considerable translational and angular misalignment between the connector parts.Type: ApplicationFiled: July 31, 2012Publication date: February 6, 2014Applicant: Rockwell Automation Technologies, Inc.Inventors: Abdolmehdi Kaveh Ahangar, Steven C. Kaishian, Mark G. Phillips
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Patent number: 7450388Abstract: EMI shielding is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: September 16, 2003Date of Patent: November 11, 2008Assignee: Rockwell Automation Technologies, Inc.Inventors: Bruce C. Beihoff, Dennis L. Kehl, Lee A. Gettelfinger, Steven C. Kaishian, Mark G. Phillips, Lawrence D. Radosevich
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Publication number: 20080266802Abstract: A technique is disclosed for cooling connections points in power electronic circuits, such as points at which wire bonding connections are made. A phase change heat spreader is thermally coupled at or near the connection point and a continuous phase change takes place in the heat spreader to extract heat from the connection point during operation. The heat spreader may extend over a area larger than the connection point to enhance cooling and to dissipate heat over a larger area. Small, specifically directed applications are possible in which specific points are cooled together or individually.Type: ApplicationFiled: April 30, 2007Publication date: October 30, 2008Inventors: Bruce W. Weiss, Mark G. Phillips
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Patent number: 7187568Abstract: A terminal structure for power electronics circuits reduces the need for a DC bus and thereby the incidence of parasitic inductance. The structure is secured to a support that may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as by direct contact between the terminal assembly and AC and DC circuit components. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: December 23, 2002Date of Patent: March 6, 2007Assignee: Rockwell Automation Technologies, Inc.Inventors: Lawrence D. Radosevich, Daniel G. Kannenberg, Mark G. Phillips, Steven C. Kaishian
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Patent number: 7142434Abstract: EMI shielding in an electric vehicle drive is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: December 26, 2002Date of Patent: November 28, 2006Assignee: Rockwell Automation Technologies, Inc.Inventors: Bruce C. Beihoff, Dennis L. Kehl, Lee A. Gettelfinger, Steven C. Kaishian, Mark G. Phillips, Lawrence D. Radosevich
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Patent number: 7095612Abstract: A terminal structure provides interfacing with power electronics circuitry and external circuitry. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the terminal structure and the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: August 25, 2004Date of Patent: August 22, 2006Assignee: Rockwell Automation Technologies, Inc.Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Mark G. Phillips, Dennis L. Kehl, Steven C. Kaishian, Daniel G. Kannenberg
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Patent number: 7061775Abstract: EMI shielding is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: December 23, 2002Date of Patent: June 13, 2006Assignee: Rockwell Automation Technologies, Inc.Inventors: Bruce C. Beihoff, Dennis L. Kehl, Lee A. Gettelfinger, Steven C. Kaishian, Mark G. Phillips, Lawrence D. Radosevich
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Patent number: 7032695Abstract: A terminal structure for vehicle drive power electronics circuits reduces the need for a DC bus and thereby the incidence of parasitic inductance. The structure is secured to a support that may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as by direct contact between the terminal assembly and AC and DC circuit components. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: September 23, 2002Date of Patent: April 25, 2006Assignee: Rockwell Automation Technologies, Inc.Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Mark G. Phillips, Dennis L. Kehl, Steven C. Kaishian, Daniel G. Kannenberg
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Patent number: 6898072Abstract: A terminal structure provides interfacing with power electronics circuitry and external circuitry. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the terminal structure and the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: December 23, 2002Date of Patent: May 24, 2005Assignee: Rockwell Automation Technologies, Inc.Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Mark G. Phillips, Dennis L. Kehl, Steven C. Kaishian, Daniel G. Kannenberg
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Publication number: 20040066643Abstract: EMI shielding is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: ApplicationFiled: September 16, 2003Publication date: April 8, 2004Inventors: Bruce C. Beihoff, Dennis L. Kehl, Lee A. Gettelfinger, Steven C. Kaishian, Mark G. Phillips, Lawrence D. Radosevich
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Publication number: 20030132042Abstract: A terminal structure for vehicle drive power electronics circuits reduces the need for a DC bus and thereby the incidence of parasitic inductance. The structure is secured to a support that may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as by direct contact between the terminal assembly and AC and DC circuit components. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: ApplicationFiled: September 23, 2002Publication date: July 17, 2003Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Mark G. Phillips, Dennis L. Kehl, Steven C. Kaishian, Daniel G. Kannenberg
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Publication number: 20030133267Abstract: A terminal structure provides interfacing with power electronics circuitry and external circuitry. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the terminal structure and the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: ApplicationFiled: December 23, 2002Publication date: July 17, 2003Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Mark G. Phillips, Dennis L. Kehl, Steven C. Kaishian, Daniel G. Kannenberg
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Publication number: 20030133282Abstract: EMI shielding is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: ApplicationFiled: December 23, 2002Publication date: July 17, 2003Inventors: Bruce C. Beihoff, Dennis L. Kehl, Lee A. Gettelfinger, Steven C. Kaishian, Mark G. Phillips, Lawrence D. Radosevich
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Publication number: 20030133283Abstract: EMI shielding in an electric vehicle drive is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: ApplicationFiled: September 23, 2002Publication date: July 17, 2003Inventors: Bruce C. Beihoff, Dennis L. Kehl, Lee A. Gettelfinger, Steven C. Kaishian, Mark G. Phillips, Lawrence D. Radosevich
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Publication number: 20030133318Abstract: A terminal structure for power electronics circuits reduces the need for a DC bus and thereby the incidence of parasitic inductance. The structure is secured to a support that may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as by direct contact between the terminal assembly and AC and DC circuit components. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: ApplicationFiled: December 23, 2002Publication date: July 17, 2003Inventors: Lawrence D. Radosevich, Daniel G. Kannenberg, Mark G. Phillips, Steven C. Kaishian