Abstract: The invention can provide a method of processing a wafer using Site-Dependent (S-D) processing sequences that can include S-D creation procedures, S-D evaluation procedures, and S-D transfer sequences. The S-D creation procedures can be performed using S-D processing elements, the S-D evaluation procedures can be performed using S-D evaluation elements, and S-D transfer sequences can be performed using site-dependent transfer subsystems. Site-dependent data can be stored in site-dependent libraries and/or databases.

Abstract: A method and system for positioning a wafer on a bake plate in a processing module that includes lowering a bake plate cover assembly over the wafer during a baking process, raising the bake plate cover assembly after the baking process, removing the wafer, determining whether the bake plate cover assembly requires cleaning, then either processing another wafer if the cover assembly does not need cleaning or establishing a cleaning process for the bake plate cover assembly if the cover does need cleaning. Automated sensing of the state of the cover assembly may be employed, and cleaning process may be automatically performed in response to the cleaning need determination.

Abstract: The present invention includes a method of verifying a Site-Dependent (S-D) wafer that includes receiving a first set of S-D wafers by one or more S-D processing elements in one or more processing subsystems, creating a first set of unverified S-D wafers by performing a first S-D creation procedure, establishing S-D wafer state data for each unverified S-D wafer, establishing a first set of evaluation wafers comprising a first number of the unverified S-D wafers, establishing first operational states for a plurality of S-D evaluation elements, determining a first number of available evaluation elements, establishing a first S-D transfer sequence, transferring the first set of S-D evaluation wafers to the first number of available evaluation elements in one or more evaluation subsystems and applying a first corrective action when the number of S-D evaluation wafers is greater than the first number of available evaluation elements.

Abstract: The invention can provide a method of processing a wafer using Site-Dependent (S-D) processing sequences that can include S-D creation procedures, S-D evaluation procedures, and S-D transfer sequences. The S-D creation procedures can be performed using S-D processing elements, the S-D evaluation procedures can be performed using S-D evaluation elements, and S-D transfer sequences can be performed using site-dependent transfer subsystems. Site-dependent data can be stored in site-dependent libraries and/or databases.

Abstract: A method and system for positioning a wafer on a bake plate in a processing module that includes lowering a bake plate cover assembly over the wafer during a baking process, raising the bake plate cover assembly after the baking process, removing the wafer, determining whether the bake plate cover assembly requires cleaning, then either processing another wafer if the cover assembly does not need cleaning or establishing a cleaning process for the bake plate cover assembly if the cover does need cleaning. Automated sensing of the state of the cover assembly may be employed, and cleaning process may be automatically performed in response to the cleaning need determination.