Patents by Inventor Mark Geppert

Mark Geppert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dislocation reduction in semiconductor compounds
    Patent number: 12701828
    Abstract: A solution for fabricating a semiconductor structure and the corresponding semiconductor structure are provided. The semiconductor structure includes a plurality of semiconductor layers grown over a substrate using a set of epitaxial growth periods. During each epitaxial growth period, a first semiconductor layer having one of: a tensile stress or a compressive stress is grown followed by growth of a second semiconductor layer having the other of: the tensile stress or the compressive stress directly on the first semiconductor layer.
    Type: Grant
    Filed: March 16, 2023
    Date of Patent: August 4, 2026
    Assignee: Sensor Electronic Technology, Inc.
    Inventors: Rakesh B. Jain, Mohamed Lachab, Joseph Dion, Brandon Alexander Robinson, Devendra Diwan, Mark Geppert
  • Dislocation Reduction in Semiconductor Compounds
    Publication number: 20230299238
    Abstract: A solution for fabricating a semiconductor structure and the corresponding semiconductor structure are provided. The semiconductor structure includes a plurality of semiconductor layers grown over a substrate using a set of epitaxial growth periods. During each epitaxial growth period, a first semiconductor layer having one of: a tensile stress or a compressive stress is grown followed by growth of a second semiconductor layer having the other of: the tensile stress or the compressive stress directly on the first semiconductor layer.
    Type: Application
    Filed: March 16, 2023
    Publication date: September 21, 2023
    Inventors: Rakesh B. Jain, Mohamed Lachab, Joseph Dion, Brandon Alexander Robinson, Devendra Diwan, Mark Geppert