Patents by Inventor Mark Gerard Courtney

Mark Gerard Courtney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for cooling of chips using blind holes with customized depth
    Patent number: 5819402
    Abstract: The present invention relates generally to a new apparatus and method for customized cooling of chips. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by varying the depth of thermal compound filled gap or the blind hole that is above each chip.
    Type: Grant
    Filed: June 4, 1997
    Date of Patent: October 13, 1998
    Assignee: International Business Machines Corporation
    Inventors: David Linn Edwards, Mark Gerard Courtney, Albert Joseph Fahey, Gregory Scott Hopper, Sushumna Iruvanti, Charles Frederick Jones, Gaetano Paolo Messina, Raed A. Sherif
  • Apparatus for cooling of chips using blind holes with customized depth
    Patent number: 5757620
    Abstract: The present invention relates generally to a new apparatus and method for customized cooling of chips. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by varying the depth of thermal compound filled gap or the blind hole that is above each chip.
    Type: Grant
    Filed: August 2, 1996
    Date of Patent: May 26, 1998
    Assignee: International Business Machines Corporation
    Inventors: David Linn Edwards, Mark Gerard Courtney, Albert Joseph Fahey, Gregory Scott Hopper, Sushumna Iruvanti, Charles Frederick Jones, Gaetano Paolo Messina, Raed A. Sherif
  • Method and apparatus for cooling of chips using a plurality of customized thermally conductive materials
    Patent number: 5724729
    Abstract: The present invention relates generally to a new apparatus and method for customized cooling of chips using a plurality of thermally conductive materials. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by using a plurality of thermally conductive materials.
    Type: Grant
    Filed: April 15, 1996
    Date of Patent: March 10, 1998
    Assignee: International Business Machines Corporation
    Inventors: Raed A. Sherif, Mark Gerard Courtney, David Linn Edwards, Albert Joseph Fahey, Gregory Scott Hopper, Sushumna Iruvanti, Charles Frederick Jones, Gaetano Paolo Messina