Patents by Inventor Mark H. MacKenzle

Mark H. MacKenzle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and systems for forming slots in a semiconductor substrate
    Patent number: 8510948
    Abstract: A method of fabricating a fluid feed slot in a print head substrate includes making a cut into a first surface of a substrate using a cutting disk having a generally planar surface oriented generally perpendicular to the first surface, and removing material from a second surface of the substrate. Making the cut and removing the material form, in combination, the fluid feed slot in the substrate at least a portion of which passes entirely through the substrate, with a full length of the fluid feed slot extending less than a full length of the substrate, and making the cut into the first surface includes providing a first completed portion of the fluid feed slot with curved surfaces at opposite end walls thereof converging from the first surface toward the second surface.
    Type: Grant
    Filed: April 17, 2007
    Date of Patent: August 20, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Shen Buswell, Rio T. Rivas, Mahrgan Khavarl, Paul Templin, Mark H. MacKenzle, Conrad Jenssen