Abstract: Methods of forming a NFT the methods including forming a hard mask positioned over at least a portion of the rod, the hard mask including at least one layer; patterning a resist mask over the hard mask, the resist mask having an edge positioned over at least a portion of the rod; etching a portion of the hard mask to expose a back edge of the rod and to form a back edge of the hard mask, wherein the back edge of the rod is equivalent to the back edge of the peg; and wherein a forward portion of the rod which is the portion of the rod forward of the back edge is covered by the hard mask; forming a disc mask including a void configured to form a disc of a NFT, the disc mask being formed over at least a portion of the hard mask so that the exposed back edge of the rod is within the void configured to form the disc; etching an area exposed in the void of the disc mask to remove both a rear portion of the rod and the surrounding dielectric up to the back edge of the hard mask edge; depositing a disc material in th

Abstract: Methods of forming a NFT the methods including forming a hard mask positioned over at least a portion of the rod, the hard mask including at least one layer; patterning a resist mask over the hard mask, the resist mask having an edge positioned over at least a portion of the rod; etching a portion of the hard mask to expose a back edge of the rod and to form a back edge of the hard mask, wherein the back edge of the rod is equivalent to the back edge of the peg; and wherein a forward portion of the rod which is the portion of the rod forward of the back edge is covered by the hard mask; forming a disc mask including a void configured to form a disc of a NFT, the disc mask being formed over at least a portion of the hard mask so that the exposed back edge of the rod is within the void configured to form the disc; etching an area exposed in the void of the disc mask to remove both a rear portion of the rod and the surrounding dielectric up to the back edge of the hard mask edge; depositing a disc material in th

Abstract: Methods of forming a NFT the methods including forming a hard mask positioned over at least a portion of the rod, the hard mask including at least one layer; patterning a resist mask over the hard mask, the resist mask having an edge positioned over at least a portion of the rod; etching a portion of the hard mask to expose a back edge of the rod and to form a back edge of the hard mask, wherein the back edge of the rod is equivalent to the back edge of the peg; and wherein a forward portion of the rod which is the portion of the rod forward of the back edge is covered by the hard mask; forming a disc mask including a void configured to form a disc of a NFT, the disc mask being formed over at least a portion of the hard mask so that the exposed back edge of the rod is within the void configured to form the disc; etching an area exposed in the void of the disc mask to remove both a rear portion of the rod and the surrounding dielectric up to the back edge of the hard mask edge; depositing a disc material in th

Abstract: Methods of forming a NFT the methods including forming a hard mask positioned over at least a portion of the rod, the hard mask including at least one layer; patterning a resist mask over the hard mask, the resist mask having an edge positioned over at least a portion of the rod; etching a portion of the hard mask to expose a back edge of the rod and to form a back edge of the hard mask, wherein the back edge of the rod is equivalent to the back edge of the peg; and wherein a forward portion of the rod which is the portion of the rod forward of the back edge is covered by the hard mask; forming a disc mask including a void configured to form a disc of a NFT, the disc mask being formed over at least a portion of the hard mask so that the exposed back edge of the rod is within the void configured to form the disc; etching an area exposed in the void of the disc mask to remove both a rear portion of the rod and the surrounding dielectric up to the back edge of the hard mask edge; depositing a disc material in th

Abstract: A patterned magnetic recording media and method thereof is provided. A recording layer comprises a continuous surface of more-noble elements and less-noble elements, such as CoXYZ, wherein X can be Pt, Pd, Ru, Rh, Ir, Os, or Au, wherein Y can be null or Cr, and wherein Z can be null, Cu, Ta, Ti, O, B, Ag, or TiO2. The recording layer is masked, shielding areas for recording domains and exposing areas between the recording domains. A voltage bias establishes the substrate as an anode in the presence of Pt cathode, in an electrolyte bath. Ions of the less-noble element are anodically removed predominantly from the exposed areas of the recording layer for a controlled time. The controlled time minimizes oxidation of the nobler element and reduces undercutting of the recording domains. The article produced can have separating areas with surfaces substantially formed of the more-noble element.

Abstract: A patterned magnetic recording media and method thereof is provided. A recording layer comprises a continuous surface of more-noble elements and less-noble elements, such as CoXYZ, wherein X can be Pt, Pd, Ru, Rh, Ir, Os, or Au, wherein Y can be null or Cr, and wherein Z can be null, Cu, Ta, Ti, O, B, Ag, or TiO2. The recording layer is masked, shielding areas for recording domains and exposing areas between the recording domains. A voltage bias establishes the substrate as an anode in the presence of Pt cathode, in an electrolyte bath. Ions of the less-noble element are anodically removed predominantly from the exposed areas of the recording layer for a controlled time. The controlled time minimizes oxidation of the nobler element and reduces undercutting of the recording domains. The article produced can have separating areas with surfaces substantially formed of the more-noble element.

Abstract: Aspects include methods to produce pattern media templates and the templates. A pattern of resist structures is formed on a first material layer. A conformal layer of a second material is deposited on the resist pattern, covering tops and side walls of the resist structures. The first material is more resistant to ion milling than the second material, and less resistant to plasma etching than the second material. The first material can be amorphous carbon and the second material can be aluminum oxide. The second material is removed on the tops, and preserved on the side walls. The resist structures and portions of the first layer not supporting second layer material are removed by plasma. The remaining structure is 2× denser than the resist pattern. Conformal deposition of second material and ion milling can be repeated.