Patents by Inventor Mark H. Severson

Mark H. Severson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10020641
    Abstract: A resistance-limited electrical interface includes a printed wiring board, a bus bar, a U-shaped conductor, and a retainer. The bus bar extends from the printed wiring board. The U-shaped conductor has a first wall and an opposed second wall, the bus bar arranged between the first and second wall to define a conductive joint between the first wall and the bus bar. The retainer is compressively seated between the second wall and bus bar opposite the conductive joint to exert force on the bus bar for retaining the bus bar in the U-shaped conductor and limiting electrical resistance of the conductive joint.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: July 10, 2018
    Assignee: HAMILTON SUNDSTRAND CORPORATION
    Inventors: Debabrata Pal, Mark H. Severson
  • Publication number: 20180183218
    Abstract: A resistance-limited electrical interface includes a printed wiring board, a bus bar, a U-shaped conductor, and a retainer. The bus bar extends from the printed wiring board. The U-shaped conductor has a first wall and an opposed second wall, the bus bar arranged between the first and second wall to define a conductive joint between the first wall and the bus bar. The retainer is compressively seated between the second wall and bus bar opposite the conductive joint to exert force on the bus bar for retaining the bus bar in the U-shaped conductor and limiting electrical resistance of the conductive joint.
    Type: Application
    Filed: December 22, 2016
    Publication date: June 28, 2018
    Inventors: Debabrata Pal, Mark H. Severson
  • Patent number: 9839156
    Abstract: A circuit board arrangement includes a deflector configured to guide flow over an electronic component on a circuit board disposed in an air flow. A method for thermal management of a circuit board includes modifying an air flow over the circuit board to increase speed or direction the air flow over a component of the circuit board using a deflector.
    Type: Grant
    Filed: April 6, 2016
    Date of Patent: December 5, 2017
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Kris H. Campbell, Shin Katsumata, Mark H. Severson
  • Publication number: 20170295669
    Abstract: A circuit board arrangement includes a deflector configured to guide flow over an electronic component on a circuit board disposed in an air flow. A method for thermal management of a circuit board includes modifying an air flow over the circuit board to increase speed or direction the air flow over a component of the circuit board using a deflector.
    Type: Application
    Filed: April 6, 2016
    Publication date: October 12, 2017
    Inventors: Kris H. Campbell, Shin Katsumata, Mark H. Severson
  • Patent number: 6130818
    Abstract: An electronic assembly provides fault tolerant cooling for the electrical components of the electronic assembly to prevent premature failure of the electronic components due to overheating. The electronic assembly includes a chassis (20) having an exterior surface (22) and an interior cavity (24), a plurality of heat generating components (26) mounted in the cavity (24) and in heat exchange relation to the chassis (20) to reject generated heat to the chassis (20), and a fault tolerant heat exchanger (28) on the exterior surface (22) in heat exchange relation with the chassis (20). The heat exchanger (28) includes a passive heat sink (30) and an active heat sink (32). The passive heat sink (30) is configured and sized to reject the generated heat of the electrical components (26) at a first rate from the chassis (20) to the environment surround the chassis (20) via radiation and natural convection.
    Type: Grant
    Filed: May 27, 1999
    Date of Patent: October 10, 2000
    Assignee: Hamilton Sundstrand Corporation
    Inventor: Mark H. Severson
  • Patent number: 5474120
    Abstract: A cooling system is provided for compartments containing a heat generating apparatus, such as solid state variable speed constant frequency system, whose functionality is essential and whose cooling needs vary significantly during use. A main coolant channel is used to provide cooling to the heat generating apparatus under normal operating conditions. During an overtemperature condition; an auxiliary coolant channel provides additional coolant to the heat generating apparatus. Both of the channels are partially disposed within the heat generating apparatus, and they are both completely separate and free of fluid communication with each other. Each channel also contains a pump, such as a fan, for applying a motive force necessary to deliver the coolant to the heat generating apparatus.
    Type: Grant
    Filed: October 15, 1991
    Date of Patent: December 12, 1995
    Assignee: Sundstrand Corporation
    Inventors: Mark H. Severson, Ian Tinkler
  • Patent number: 4865267
    Abstract: A ram air flow system for an aircraft or the like wherein a ram air duct is provided with an inlet through which air enters the duct and an outlet through which air leaves the duct. A fan is located in the duct between the inlet and the outlet and is located to define a bypass portion of the duct through which air can pass through the duct past the fan. Doors are mounted in the duct for movement between a first position covering the fan to allow air to bypass the fan, and a second position exposing the fan while blocking the bypass portion of the duct to allow air to flow through the fan.
    Type: Grant
    Filed: February 25, 1988
    Date of Patent: September 12, 1989
    Assignee: Sundstrand Corporation
    Inventor: Mark H. Severson