Abstract: A method and system in which a semiconductor wafer having a plurality of dies is inspected through a visual inspection and/or an electrical test. If certain of the dies on the wafer pass the inspection, then windows are mounted or affixed above those certain dies while they are still a part of the wafer.

Abstract: A method and system in which a semiconductor wafer having a plurality of dies is inspected through a visual inspection and/or an electrical test. If certain of the dies on the wafer pass the inspection, then windows are mounted or affixed above those certain dies while they are still a part of the wafer.

Abstract: A method for enhancing the optical performance of a reflective spatial light modulator by micro-planarizing surfaces within the SLM, such as the reflective surface of each pixel, by gas-cluster-ion-beam bombardment.

Abstract: A method and system in which a semiconductor wafer having a plurality of dies is inspected through a visual inspection and/or an electrical test. If certain of the dies on the wafer pass the inspection, then windows are mounted or affixed above those certain dies while they are still a part of the wafer.

Abstract: A method for enhancing the optical performance of a reflective spatial light modulator by micro-planarizing surfaces within the SLM, such as the reflective surface of each pixel, by gas-cluster-ion-beam bombardment.

Abstract: A method and system in which a semiconductor wafer having a plurality of dies is inspected through a visual inspection and/or an electrical test. If certain of the dies on the wafer pass the inspection, then windows are mounted or affixed above those certain dies while they are still a part of the wafer.

Abstract: A method for enhancing the optical performance of a reflective spatial light modulator by micro-planarizing surfaces within the SLM, such as the reflective surface of each pixel, by gas-cluster-ion-beam bombardment.

Abstract: A method for enhancing the optical performance of a reflective spatial light modulator by micro-planarizing surfaces within the SLM, such as the reflective surface of each pixel, by gas-cluster-ion-beam bombardment.

Abstract: A method and system of reducing the permanent accumulated deformation of a deflectable member of a micromechanical device through thermal stabilization. The accumulated deformation is due to the repeated bending or twisting of a flexible component of the micromechanical deice typically the repetitive deformation of a flexible hinge connecting a rigid member to substrate. After the device is fabricated, passivated (316), and packaged (322), the packaged device is baked (326) at a temperature of at least 120° C. A 150° C. bake for 12 to 16 hours is preferred. Lower temperatures required longer baking periods.

Abstract: A micromechanical device (50) with spring tips (60) and its method of manufacture. A micromechanical device (50) is formed such that there is a deflectable element (36) suspended by at least one hinge (24a) over an air gap, at the bottom of which are landing stops (34a). The element (36) deflects on said hinge and comes into contact with the landing stops (34a) via at least one small metal protrusion (60), or spring tip. The spring tip flexes upon contact allowing more even distribution of forces and less wear and adhesion. The spring tips are formed in standard semiconductor processing steps with the addition of patterning the metal layer (64) from which the hinges are formed to create separated metal elements. When the deflectable element is formed, the metal forming that element bonds to the separated metal elements at the tips, thereby forming the spring tips.