Patents by Inventor Mark Harless
Mark Harless has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9464992Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc., and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.Type: GrantFiled: April 7, 2016Date of Patent: October 11, 2016Assignee: Rudolph Technologies, Inc.Inventors: Jeffrey L. O'Dell, Thomas Verburgt, Mark Harless, Cory Watkins
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Publication number: 20160223470Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc., and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.Type: ApplicationFiled: April 7, 2016Publication date: August 4, 2016Inventors: Jeffrey L. O'Dell, Thomas Verburgt, Mark Harless, Cory Watkins
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Patent number: 9337071Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc., and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.Type: GrantFiled: May 28, 2010Date of Patent: May 10, 2016Assignee: Rudolph Technologies, Inc.Inventors: Jeffrey L. O'Dell, Thomas Verburgt, Mark Harless, Cory Watkins
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Publication number: 20120087569Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc., and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.Type: ApplicationFiled: October 14, 2011Publication date: April 12, 2012Applicant: RUDOLPH TECHNOLOGIES, INC.Inventors: Jeffrey O'Dell, Thomas Verburgt, Mark Harless, Cory Watkins
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Patent number: 8130372Abstract: A wafer holding mechanism for holding a wafer of the type used in the manufacture of semiconductor devices is herein described. The mechanism has a first plate having a number of offsets that define at least one lip that extends radially inward of the offsets. A second plate is positioned adjacent the first plate and generally between the first plate and the lip such that one or more fingers coupled to the second plate oppose the lip that depends from the first plate. When the second plate is moved to a closed position, the at least one lip and the one or more fingers cooperatively grasp an edge of a wafer therebetween. The wafer holding mechanism is coupled to a drive that rotates the wafer before an imaging mechanism for capturing images of the wafer as it rotates.Type: GrantFiled: March 12, 2010Date of Patent: March 6, 2012Assignee: Rudolph Technologies, Inc.Inventors: Mark Harless, Cory Watkins, Pat Simpkins, Kevin Barr
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Patent number: 7822260Abstract: A semiconductor inspection tool comprises an edge top camera for obtaining images of a top edge of a wafer, an edge normal camera for obtaining images of a normal edge of the wafer, and a controller for receiving the images of the top edge of the wafer and the images of the normal edge of the wafer and for analyzing the images of the top edge of the wafer and the images of the normal edge of the wafer for wafer edge defects.Type: GrantFiled: March 4, 2008Date of Patent: October 26, 2010Assignee: Rudolph Technologies, Inc.Inventors: Cory Watkins, Mark Harless, Francy Abraham
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Publication number: 20100239157Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc., and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.Type: ApplicationFiled: May 28, 2010Publication date: September 23, 2010Applicant: RUDOLPH TECHNOLOGIES, INC.Inventors: Jeffrey O'Dell, Thomas Verburgt, Mark Harless, Cory Watkins
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Publication number: 20100166292Abstract: A wafer holding mechanism for holding a wafer of the type used in the manufacture of semiconductor devices is herein described. The mechanism has a first plate having a number of offsets that define at least one lip that extends radially inward of the offsets. A second plate is positioned adjacent the first plate and generally between the first plate and the lip such that one or more fingers coupled to the second plate oppose the lip that depends from the first plate. When the second plate is moved to a closed position, the at least one lip and the one or more fingers cooperatively grasp an edge of a wafer therebetween. The wafer holding mechanism is coupled to a drive that rotates the wafer before an imaging mechanism for capturing images of the wafer as it rotates.Type: ApplicationFiled: March 12, 2010Publication date: July 1, 2010Inventors: Mark Harless, Cory Watkins, Pat Simpkins, Kevin Barr
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Patent number: 7729528Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.Type: GrantFiled: August 10, 2004Date of Patent: June 1, 2010Assignee: Rudolph Technologies, Inc.Inventors: Jeffrey O'Dell, Thomas Verburgt, Mark Harless, Cory Watkins
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Patent number: 7703823Abstract: A wafer holding mechanism for holding a wafer of the type used in the manufacture of semiconductor devices is herein described. The mechanism has a first plate having a number of offsets that define at least one lip that extends radially inward of the offsets. A second plate is positioned adjacent the first plate and generally between the first plate and the lip such that one or more fingers coupled to the second plate oppose the lip that depends from the first plate. When the second plate is moved to a closed position, the at least one lip and the one or more fingers cooperatively grasp an edge of a wafer therebetween. The wafer holding mechanism is coupled to a drive that rotates the wafer before an imaging mechanism for capturing images of the wafer as it rotates.Type: GrantFiled: July 11, 2005Date of Patent: April 27, 2010Assignee: Rudolph Technologies, Inc.Inventors: Mark Harless, Cory Watkins, Pat Simpkins, Kevin Barr
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Patent number: 7629993Abstract: A defect inspection system for the semiconductor and microelectronics industry. More particularly, the present invention relates to an automated defect inspection system for wafers or other semiconductor or electronic substrates of any kind or type that are transparent, translucent, opaque or otherwise capable of allowing at least some light to pass through.Type: GrantFiled: September 30, 2002Date of Patent: December 8, 2009Assignee: Rudolph Technologies, Inc.Inventors: Mark Harless, Jeremy Jenum, Willard Charles Raymond
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Publication number: 20080212084Abstract: A semiconductor inspection tool comprises an edge top camera for obtaining images of a top edge of a wafer, an edge normal camera for obtaining images of a normal edge of the wafer, and a controller for receiving the images of the top edge of the wafer and the images of the normal edge of the wafer and for analyzing the images of the top edge of the wafer and the images of the normal edge of the wafer for wafer edge defects.Type: ApplicationFiled: March 4, 2008Publication date: September 4, 2008Inventors: Cory Watkins, Mark Harless, Francy Abraham
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Patent number: 7340087Abstract: A semiconductor inspection tool comprises an edge top camera for obtaining images of a top edge of a wafer, an edge normal camera for obtaining images of a normal edge of the wafer, and a controller for receiving the images of the top edge of the wafer and the images of the normal edge of the wafer and for analyzing the images of the top edge of the wafer and the images of the normal edge of the wafer for wafer edge defects.Type: GrantFiled: July 14, 2004Date of Patent: March 4, 2008Assignee: Rudolph Technologies, Inc.Inventors: Cory Watkins, Mark Harless, Francy Abraham
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Patent number: 7321108Abstract: A method and apparatus for dynamically focusing an imaging mechanism on a moving target surface having a variable geometry is herein disclosed. Apparatus for focusing an imaging mechanism may include an objective, a prism, or another optical device that forms part of an optical train of an imaging mechanism, a sensor for measuring a distance to the target surface, and a mechanism for modifying the depth of focus of the objective, prism or other optical device. Data from the sensor may be used to create a predictive model of the target surface. Data from the sensor is also used to fit or correlate the generated model to an exemplary target. Data from the correlated model is used to drive the mechanism for modifying the depth of focus of the objective, prism, or other optical device to maintain the surface of the exemplary target in focus.Type: GrantFiled: January 22, 2007Date of Patent: January 22, 2008Assignee: Rudolph Technology, Inc.Inventors: Cory Watkins, Mark Harless, David Vaughnn, Pat Simpkins, Shaileshkumar Goyal, Gerald Brown, Brian Delsey
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Publication number: 20070114358Abstract: A method and apparatus for dynamically focusing an imaging mechanism on a moving target surface having a variable geometry is herein disclosed. Apparatus for focusing an imaging mechanism may include an objective, a prism, or another optical device that forms part of an optical train of an imaging mechanism, a sensor for measuring a distance to the target surface, and a mechanism for modifying the depth of focus of the objective, prism or other optical device. Data from the sensor may be used to create a predictive model of the target surface. Data from the sensor is also used to fit or correlate the generated model to an exemplary target. Data from the correlated model is used to drive the mechanism for modifying the depth of focus of the objective, prism, or other optical device to maintain the surface of the exemplary target in focus.Type: ApplicationFiled: January 22, 2007Publication date: May 24, 2007Inventors: Cory Watkins, Mark Harless, David Vaughnn, Pat Simpkins, Shaileshkumar Goyal, Gerald Brown, Brian Delsey
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Patent number: 7196300Abstract: A method and apparatus for dynamically focusing an imaging mechanism on a moving target surface having a variable geometry is herein disclosed. Apparatus for focusing an imaging mechanism may include an objective, a prism, or another optical device that forms part of an optical train of an imaging mechanism, a sensor for measuring a distance to the target surface, and a mechanism for modifying the depth of focus of the objective, prism or other optical device. Data from the sensor may be used to create a predictive model of the target surface. Data from the sensor is also used to fit or correlate the generated model to an exemplary target. Data from the correlated model is used to drive the mechanism for modifying the depth of focus of the objective, prism, or other optical device to maintain the surface of the exemplary target in focus.Type: GrantFiled: July 11, 2005Date of Patent: March 27, 2007Assignee: Rudolph Technologies, Inc.Inventors: Cory Watkins, Mark Harless, David Vaughnn, Pat Simpkins, Shaileshkumar Goyal, Gerald Brown, Brian Delsey
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Publication number: 20070057164Abstract: An imaging system for capturing images of a tilted object includes a lens having an optical axis, a detector array, and a normalizer positioned between the lens and a detector array for realigning light passing therethrough such that the Scheimmpflug condition with respect to the tilted object being imaged is satisfied and light is incident upon the detector array in a substantially normal orientation.Type: ApplicationFiled: September 15, 2006Publication date: March 15, 2007Inventors: David Vaughnn, Mark Harless
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Publication number: 20060046396Abstract: A wafer holding mechanism for holding a wafer of the type used in the manufacture of semiconductor devices is herein described. The mechanism has a first plate having a number of offsets that define at least one lip that extends radially inward of the offsets. A second plate is positioned adjacent the first plate and generally between the first plate and the lip such that one or more fingers coupled to the second plate oppose the lip that depends from the first plate. When the second plate is moved to a closed position, the at least one lip and the one or more fingers cooperatively grasp an edge of a wafer therebetween. The wafer holding mechanism is coupled to a drive that rotates the wafer before an imaging mechanism for capturing images of the wafer as it rotates.Type: ApplicationFiled: July 11, 2005Publication date: March 2, 2006Inventors: Mark Harless, Cory Watkins, Pat Simpkins, Kevin Barr
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Publication number: 20060033056Abstract: A method and apparatus for dynamically focusing an imaging mechanism on a moving target surface having a variable geometry is herein disclosed. Apparatus for focusing an imaging mechanism may include an objective, a prism, or another optical device that forms part of an optical train of an imaging mechanism, a sensor for measuring a distance to the target surface, and a mechanism for modifying the depth of focus of the objective, prism or other optical device. Data from the sensor may be used to create a predictive model of the target surface. Data from the sensor is also used to fit or correlate the generated model to an exemplary target. Data from the correlated model is used to drive the mechanism for modifying the depth of focus of the objective, prism, or other optical device to maintain the surface of the exemplary target in focus.Type: ApplicationFiled: July 11, 2005Publication date: February 16, 2006Inventors: Cory Watkins, Mark Harless, David Vaughnn, Pat Simpkins, Shaileshkumar Goyal, Gerald Brown, Brian Delsey
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Patent number: 6937753Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.Type: GrantFiled: April 29, 2000Date of Patent: August 30, 2005Assignee: August Technology Corp.Inventors: Jeffrey O'Dell, Thomas Verburgt, Mark Harless, Steve Herrmann