Patents by Inventor Mark Harrison Baker

Mark Harrison Baker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Front side coating for bump devices
    Patent number: 6566762
    Abstract: Flip chips with improved solder bump strength are provided. A solder mask layer is placed and patterned on a front side of a wafer of semiconductor chips with semiconductor devices and bond pads. The solder mask is patterned to expose the bond pads. Solder bumps are electrically connected to the bond pads. The solder mask is thick enough to extend up to at least a quarter of the solder bumps and is in contact with the solder bumps. The wafer is then cut into individual chips. The chips may be sold to customers, who may mount the chip on a substrate without underfill.
    Type: Grant
    Filed: September 4, 2002
    Date of Patent: May 20, 2003
    Assignee: National Semiconductor Corporation
    Inventors: Mark Harrison Baker, Nikhil Kelkar
  • Front side coating for bump devices
    Patent number: 6468892
    Abstract: Flip chips with improved solder bump strength are provided. A solder mask layer is placed and patterned on a front side of a wafer of semiconductor chips with semiconductor devices and bond pads. The solder mask is patterned to expose the bond pads. Solder bumps are electrically connected to the bond pads. The solder mask is thick enough to extend up to at least a quarter of the solder bumps and is in contact with the solder bumps. The wafer is then cut into individual chips. The chips may be sold to customers, who may mount the chip on a substrate without underfill.
    Type: Grant
    Filed: July 14, 2000
    Date of Patent: October 22, 2002
    Assignee: National Semiconductor Corporation
    Inventors: Mark Harrison Baker, Nikhil Kelkar