Abstract: A gripper head for handling and varying the spacing of electronic components arranged in a matrix structure, including multiple grippers arranged in a matrix orientation of X rows and Y columns of grippers; and individually controllable displacement drives acting between adjoining gripper rows and between adjoining gripper columns. A device and a method for handling and varying the spacing of electronic components.

Abstract: The invention relates to a sawing device for forming saw-cuts into a semiconductor product, including: a carrier for holding the semiconductor product, a saw blade, a first position sensor for determining the position of the semiconductor product held by the carrier, a second position sensor for determining the position of the saw blade, and a control unit configured for controlling the relative movement of the saw blade and the carrier, wherein the sawing device further includes a reference for linking the position of the first position sensor to the position of the second position sensor, wherein the control unit is configured to process, with aid of the reference, the positions determined by the reference sensors into a position of the point on the free surface of the semiconductor product relative to the point on the cutting edge of the saw blade, and, based on this positional information, control the relative movement of the saw blade and the carrier.

Abstract: The invention relates to a sawing device for forming saw-cuts into a semiconductor product, including: a carrier for holding the semiconductor product, a saw blade, a first position sensor for determining the position of the semiconductor product held by the carrier, a second position sensor for determining the position of the saw blade, and a control unit configured for controlling the relative movement of the saw blade and the carrier, wherein the sawing device further includes a reference for linking the position of the first position sensor to the position of the second position sensor, wherein the control unit is configured to process, with aid of the reference, the positions determined by the reference sensors into a position of the point on the free surface of the semiconductor product relative to the point on the cutting edge of the saw blade, and, based on this positional information, control the relative movement of the saw blade and the carrier.

Abstract: The present invention relates to a method of processing a solder masked carrier with electronic components, comprising the detection of a carrier related reference and the detection of a solder mask dependent reference, which detected reference are used for processing the position of the solder mask on the carrier. The invention also relates to an electronic component as produced with such method.

Abstract: The invention relates to a seal for a sawing machine (1) for separating electronic components (12), comprising: an elongate form-retaining holder (20,22), a flexible, elongate expandable body (8,9)and a pressure source (24) for a medium, wherein the elongate expandable body (8,9) is provided with a strengthened elongate edge (21) which lies clear of the form-retaining holder (20,22) The invention also relates to a sawing machine (1) for separating electronic components (12) provided with such a seal.

Abstract: The present invention relates to a method of processing a solder masked carrier with electronic components, comprising the detection of a carrier related reference and the detection of a solder mask dependent reference, which detected reference are used for processing the position of the solder mask on the carrier. The invention also relates to an electronic component as produced with such method.

Abstract: A device for separating electronic components including sawing means and positioning means, wherein between the positioning means and the sawing means at least one transfer position is defined for the purpose of transferring positioned electronic components. A separating device for electronic components including sawing means, positioning means, inspection means, and sorting means, wherein between the positioning means and the sawing means at least one transfer position is defined for the purpose of transferring positioned electronic components between the positioning means and the sawing means, and wherein between the inspection means and the sorting means at least another transfer position is defined for the purpose of transferring the inspected separated electronic components between the inspection means and the sorting means.

Abstract: The invention relates to a seal for a sawing machine (1) for separating electronic components (12), comprising: an elongate form-retaining holder (20,22), a flexible, elongate expandable body (8,9)and a pressure source (24) for a medium, wherein the elongate expandable body (8,9) is provided with a strengthened elongate edge (21) which lies clear of the form-retaining holder (20,22) The invention also relates to a sawing machine (1) for separating electronic components (12) provided with such a seal.

Abstract: The invention relates to a device for separating electronic components, provided with: sawing means and positioning means, wherein between the positioning means and the sawing means at least one transfer position is defined for the purpose of transferring positioned electronic components. The invention further comprises a separating device for electronic components, provided with: sawing means, inspection means, and sorting means, wherein between the inspection means and the sorting means at least one transfer position is defined for the purpose of transferring separated electronic components. Finally, the invention also relates to a method for separating electronic components.