Patents by Inventor Mark Huth

Mark Huth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11959485
    Abstract: Compressor rotor structure and methodology for harmonizing compressor aerodynamics and rotordynamics are provided. Disclosed embodiments benefit from a compressor design effective for improving rotordynamics (e.g., stiffer rotor structure) without reducing a usable aerodynamics range of the compressor. This design may involve variation of the rotor structure along the rotor axis to locate respective surfaces defined by respective inlets of the one or more impellers at a varying distance relative to the rotor axis based on respective ratios selected for the configuration of the impeller bodies. This arrangement may be effective for improving rotordynamics while satisfactorily meeting the respective varying aerodynamics requirements at the various compression stages by the impeller bodies.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: April 16, 2024
    Assignee: Siemens Energy Global GmbH & Co. KG
    Inventors: Mark J. Kuzdzal, David J. Peer, Marcus Meyer, Sebastian Huth, James M. Sorokes, Kevin Miny, Martin Reimann, Roman Mensing, Jesus Pacheco, Steven Nove
  • Patent number: 7938512
    Abstract: The described embodiments relate to slotted substrates. One exemplary method forms a feature into a substrate, at least in part, by directing a laser beam at the substrate. During at least a portion of said directing, the method supplies a conductive material proximate the substrate.
    Type: Grant
    Filed: December 4, 2006
    Date of Patent: May 10, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jong-Souk Yeo, Mark Huth, Mehrgan Khavari, Alexey S Kabalnov, Craig M. Gates, Sean P Mcclelland
  • Patent number: 7923658
    Abstract: A method of laser machining a substrate is provided. The method comprises directing laser energy at a first surface of the substrate, while providing an assist medium at the first surface of the substrate at least at approximately the area at which the laser energy is being directed. The assist medium is no longer provided prior to completion of formation of a feature in the substrate created utilizing the laser energy.
    Type: Grant
    Filed: October 29, 2004
    Date of Patent: April 12, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Mark Huth, Philip G Rourke, Craig M. Gates
  • Publication number: 20070090088
    Abstract: The described embodiments relate to slotted substrates. One exemplary method forms a feature into a substrate, at least in part, by directing a laser beam at the substrate. During at least a portion of said directing, the method supplies a conductive material proximate the substrate.
    Type: Application
    Filed: December 4, 2006
    Publication date: April 26, 2007
    Inventors: Jong-Souk Yeo, Mark Huth, Mehrgan Khavari, Alexey Kabalnov, Craig Gates, Sean Mcclelland
  • Patent number: 7163640
    Abstract: The described embodiments relate to slotted substrates. One exemplary method forms a feature into a substrate, at least in part, by directing a laser beam at the substrate. During at least a portion of said directing, the method supplies a conductive material proximate the substrate.
    Type: Grant
    Filed: May 21, 2004
    Date of Patent: January 16, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jong-Souk Yeo, Mark Huth, Mehrgan Khavari, Alexey S Kabalnov, Craig M. Gates, Sean P Mcclelland
  • Publication number: 20060054605
    Abstract: A method of laser machining a substrate is provided. The method comprises directing laser energy at a first surface of the substrate, while providing an assist medium at the first surface of the substrate at least at approximately the area at which the laser energy is being directed. The assist medium is no longer provided prior to completion of formation of a feature in the substrate created utilizing the laser energy.
    Type: Application
    Filed: October 29, 2004
    Publication date: March 16, 2006
    Inventors: Mark Huth, Philip Rourke, Craig Gates
  • Publication number: 20050260778
    Abstract: The described embodiments relate to slotted substrates. One exemplary method forms a feature into a substrate, at least in part, by directing a laser beam at the substrate. During at least a portion of said directing, the method supplies a conductive material proximate the substrate.
    Type: Application
    Filed: May 21, 2004
    Publication date: November 24, 2005
    Inventors: Jong-Souk Yeo, Mark Huth, Mehrgan Khavari
  • Publication number: 20050103758
    Abstract: The described embodiments relate to laser micromachining a substrate. One exemplary method includes forming a feature into a substrate, at least in part, by directing a laser beam at the substrate. During at least a portion of said forming, the method includes supplying liquid to at least a first region of the feature along a first liquid supply path and supplying liquid to at least a second different region of the feature along at least a second liquid supply path.
    Type: Application
    Filed: November 14, 2003
    Publication date: May 19, 2005
    Inventors: Charles Otis, Mehrgan Khavari, Jeffrey Pollard, Mark Huth
  • Patent number: 6636919
    Abstract: In a bridged, pipelined network (FIG. 1), a network-to-host bridge (140) identifies the address space of a host computer (FIG. 2) as not being contained within the host computer memory space (120). During the removal of the host computer (100) and its replacement by a new host computer, the network-to-host bridge (140) momentarily locks out traffic (FIG. 3, step 320) in order to disable peripheral components (FIG. 1, 160, 180) from initiating bus transactions. When the new host computer is installed (FIG. 3, step 320) and the bus lockout is removed (step 340), the new host memory area is protected from direct memory access transactions which were stored in the bus hierarchy during the host computer swap.
    Type: Grant
    Filed: October 16, 2000
    Date of Patent: October 21, 2003
    Assignee: Motorola, Inc.
    Inventor: Mark Huth
  • Patent number: 6042225
    Abstract: Disclosed is a novel multi-chamber ink-jet print cartridge (pen) that is formed of a main body member divided into three sections, a center section, and two side sections. Cover members are attached to this main body section to define three ink chambers. Each ink chamber contains a synthetic foam member that receives a respective one of three primary colored inks. The main body member is molded to be a single unitary part, so that the only ink-to-ink sealing interface between inks of different colors occurs at the interface between the main body member and the printhead. The main body member is formed to have a center ink pipe that extends upwardly into compressive contact with the foam member in the center chamber, and two side ink pipes that extend outwardly in a direction orthogonal to the center ink pipe into compressive contact with the foam held in the side ink chambers.
    Type: Grant
    Filed: March 3, 1997
    Date of Patent: March 28, 2000
    Assignee: Hewlett-Packard Company
    Inventors: John M. Altendorf, Joseph R. Elliot, Mark Huth
  • Patent number: 5477255
    Abstract: An ink cartridge having an improved ink-retaining capacity. The cartridge (preferably of the thermal inkjet type) includes a housing having a multi-cellular foam member therein. To increase the ink-retaining capacity of the foam member, one or more elongate bores are positioned entirely through the foam member. Each bore is preferably uniform in cross-sectional size and configuration along its entire length, and may encompass numerous cross-sectional configurations (e.g. circular or rectangular). The longitudinal axis of each bore is preferably perpendicular to the longitudinal axis of the foam member. When the foam member is supplied with ink, an additional portion of ink is retained within each bore. As a result, the ink-retaining capacity of the foam member is increased compared with foam members which lack any bores. The bores function as internal ink reservoirs from which ink may be drawn during cartridge operation.
    Type: Grant
    Filed: September 7, 1993
    Date of Patent: December 19, 1995
    Assignee: Hewlett Packard Corporation
    Inventor: Mark Huth