Abstract: An apparatus and method for monitoring pressure within an adhesion promotion unit is provided. The apparatus in one embodiment includes a chamber configured to receive and heat a semiconductor wafer. A vacuum device is in fluid communication with a processing space within the chamber, wherein the vacuum device is configured to create a vacuum within the processing space. A vacuum monitor is also in fluid communication with the processing space, wherein the vacuum monitor generates a first electrical signal if gas pressure within the processing space is below a predetermined value. The apparatus may further include a processor in data communication with the vacuum monitor and the vacuum device. The vacuum device may generate a second electrical signal, and the processor generates a third electrical signal if the vacuum monitor fails to generate the first electrical signal within a predetermined amount of time after the vacuum device generates the second signal.

Abstract: An apparatus is disclosed for coating a semiconductor wafer with polyimide so that excess polyimide is removed from the wafer edge, back side and coating process area and is conveniently drained. A developer, such as dilute TMAH, that mixes with the excess polyimide is injected into a chamber. The soluble mixture of TMAH and excess polymide may then be drained into a bulk drain, obviating the accumulation of excess polymide in the coater cup. The method is implemented through an assembly that includes a coater cup, spin chuck disposed within the coater cup, and a pair of nozzles intruding into the coater cup at a lower portion of the cup. A fist nozzle operates to inject developing fluid onto the back side of the wafer in the cup, and a second nozzle, positioned nearer the center of the cup and the spin chuck, operates to inject rinsing fluid.

Abstract: A system for improving manufacture, said system including but not limited to a Polyimide solvent dispensing nozzle proximate to a Polyimide dispensing nozzle. In one embodiment, the Polyimide solvent dispensing nozzle proximate to a Polyimide dispensing nozzle further includes but is not limited to the Polyimide solvent dispensing nozzle coupled with a bracket assembly adjustable in three dimensions. In one embodiment, the Polyimide solvent dispensing nozzle coupled with a bracket assembly adjustable in three dimensions further includes but is not limited to a bracket assembly adjustable in an x-axis direction, y-axis direction, and z-axis direction. In one embodiment, the Polyimide solvent dispensing nozzle proximate to a Polyimide dispensing nozzle further includes but is not limited to the Polyimide solvent dispensing nozzle mounted on an arm holding the Polyimide dispensing nozzle.

Abstract: In a semiconductor device fabrication process, a method of, and apparatus for, coating a semiconductor wafer with polyimide so that excess polyimide is removed from the wafer edge, back side and coating process area and is conveniently drained. The method comprises the injection into the chamber of a developer, such as dilute TMAH, that mixes with the excess polyimide. The soluble mixture of TMAH and excess polyimide may then be drained into a bulk drain, obviating the accumulation of excess polyimide in the coater cup. The method is implemented through an assembly that includes a coater cup, spin chuck disposed within the coater cup, and a pair of nozzles intruding into the coater cup at a lower portion of the cup. A fist nozzle operates to inject developing fluid onto the back side of the wafer in the cup, and a second nozzle, positioned nearer the center of the cup and the spin chuck, operates to inject rinsing fluid.