Patents by Inventor Mark J. Hettick

Mark J. Hettick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11107703
    Abstract: Methods of manufacturing a biocompatible, hermetic feedthrough monolithically integrated with a biocompatible ribbon cable are described, as well as the resulting devices themselves. The hermetic feedthrough is created by placing glass over a mold of doped silicon or other material with a higher melting temperature than the glass and heating it to reflow the glass into the mold. The glass is then ground or otherwise removed to reveal a flat surface, and tiny pillars that were in the mold are isolated in the glass to form electrically conductive vias. The flat surface is used to cast a polymer and build up a ribbon cable, photolithographically or otherwise, that is monolithically attached to the vias.
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: August 31, 2021
    Assignee: Neuralink Corp.
    Inventors: Vanessa M. Tolosa, Camilo A. Diaz-Botia, Supin Chen, Felix Deku, Yu Niu Huang, Mark J. Hettick, Zachary M. Tedoff
  • Publication number: 20210013051
    Abstract: Methods of manufacturing a biocompatible, hermetic feedthrough monolithically integrated with a biocompatible ribbon cable are described, as well as the resulting devices themselves. The hermetic feedthrough is created by placing glass over a mold of doped silicon or other material with a higher melting temperature than the glass and heating it to reflow the glass into the mold. The glass is then ground or otherwise removed to reveal a flat surface, and tiny pillars that were in the mold are isolated in the glass to form electrically conductive vias. The flat surface is used to cast a polymer and build up a ribbon cable, photolithographically or otherwise, that is monolithically attached to the vias.
    Type: Application
    Filed: July 9, 2020
    Publication date: January 14, 2021
    Applicant: Neuralink Corp.
    Inventors: Vanessa M. Tolosa, Camilo A. Diaz-Botia, Supin Chen, Felix Deku, Yu Niu Huang, Mark J. Hettick, Zachary M. Tedoff