Patents by Inventor Mark J. Kapeckas

Mark J. Kapeckas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroplating process
    Patent number: 5683565
    Abstract: A process for electroplating a substrate by coating the substrate with a coating of conductive particles. The coating of conductive particles is applied to the substrate from an aqueous dispersion containing a dissolution agent for metallic regions of the substrate. The dissolution agent removes the top surface of the metal as the conductive particle coating is formed thereby facilitating removal of the same from the metallic regions of the substrate.
    Type: Grant
    Filed: May 23, 1996
    Date of Patent: November 4, 1997
    Assignee: Shipley Company, L.L.C.
    Inventors: Steven M. Florio, Jeffrey P. Burress, Carl J. Colangelo, Edward C. Couble, Mark J. Kapeckas
  • Electroplating process
    Patent number: 5626736
    Abstract: A process for electroplating a metal clad substrate by forming a sacrificial coating over the metal cladding and then coating the substrate with a coating of carbonaceous particles. The coating of particles is applied to the substrate from an aqueous dispersion and then the coating is contacted with an etchant for the sacrificial coating to undercut the carbonaceous coating and facilitate its removal from areas where plating is undesired.
    Type: Grant
    Filed: January 19, 1996
    Date of Patent: May 6, 1997
    Assignee: Shipley Company, L.L.C.
    Inventors: Steven M. Florio, Jeffrey P. Burress, Carl J. Colangelo, Edward C. Couble, Mark J. Kapeckas
  • Electroplating process
    Patent number: 5618400
    Abstract: A process for electroplating a substrate by coating the substrate with a coating of conductive particles. The coating of conductive particles is applied to the substrate from an unstable aqueous dispersion essentially free of a dispersing agent using physical dispersion means to maintain the stability of the dispersion.
    Type: Grant
    Filed: September 19, 1995
    Date of Patent: April 8, 1997
    Assignee: Shipley Company, L.L.C.
    Inventors: Steven M. Florio, Jeffrey P. Burress, Carl J. Colangelo, Edward C. Couble, Mark J. Kapeckas
  • Electroplating process
    Patent number: 5611905
    Abstract: A process for electroplating a substrate by coating the substrate with a coating of conductive particles. The coating of conductive particles is applied to the substrate from an aqueous dispersion containing a dissolution agent for metallic regions of the substrate. The dissolution agent removes the top surface of the metal as the conductive particle coating is formed thereby facilitating removal of the same from the metallic regions of the substrate.
    Type: Grant
    Filed: June 9, 1995
    Date of Patent: March 18, 1997
    Assignee: Shipley Company, L.L.C.
    Inventors: Steven M. Florio, Jeffrey P. Burress, Carl J. Colangelo, Edward C. Couble, Mark J. Kapeckas