Abstract: Disclosed herein are embodiments of systems and methods for stable and elevated idle-mode temperature for assembled semiconductor devices. In an embodiment, a processor includes a communication interface configured to receive, from a first hardware component, instructions assigned to the processor for execution. The processor also includes temperature-measurement circuitry configured to monitor an on-chip temperature of the processor. The processor also includes control logic configured to: determine whether the processor is active or idle; determine whether the on-chip temperature of the processor exceeds a first threshold; based on determining that the processor is idle and that the on-chip temperature of the processor exceeds the first threshold, disable one or more idle-mode power-saving features of the processor; and selectively adjust one or more operating parameters of the processor to keep the on-chip temperature of the processor between the first threshold and a second (higher) threshold.

Abstract: Disclosed herein are embodiments of systems and methods for stable and elevated idle-mode temperature for assembled semiconductor devices. In an embodiment, a processor includes a communication interface configured to receive, from a first hardware component, instructions assigned to the processor for execution. The processor also includes temperature-measurement circuitry configured to monitor an on-chip temperature of the processor. The processor also includes control logic configured to: determine whether the processor is active or idle; determine whether the on-chip temperature of the processor exceeds a first threshold; based on determining that the processor is idle and that the on-chip temperature of the processor exceeds the first threshold, disable one or more idle-mode power-saving features of the processor; and selectively adjust one or more operating parameters of the processor to keep the on-chip temperature of the processor between the first threshold and a second (higher) threshold.

Abstract: Systems and methods of fabricating circuit board assemblies may provide for a circuit board assembly that includes an expansion card having a first side and a second side, a first set of semiconductor packages coupled to the first side and a second set of semiconductor packages coupled to the second side. The circuit board assembly may also include a synergistic combination of cooling solutions for the expansion card such as a metallic duct, centrifugal fan or secondary plate, structural solutions for the expansion card such as a clamp structure or retention interlock, and volume reduction solutions for the expansion card such as one or more flipped power connectors.

Abstract: Systems and methods of fabricating circuit board assemblies may provide for a circuit board assembly that includes an expansion card having a first side and a second side, a first set of semiconductor packages coupled to the first side and a second set of semiconductor packages coupled to the second side. The circuit board assembly may also include a synergistic combination of cooling solutions for the expansion card such as a metallic duct, centrifugal fan or secondary plate, structural solutions for the expansion card such as a clamp structure or retention interlock, and volume reduction solutions for the expansion card such as one or more flipped power connectors.