Abstract: A device and method of manufacture for producing electrically conductive regions in hermetically sealed insulative plates or hermetically sealed electronic component enclosures. The electrically conductive regions consist of a monolithic composite material comprising particles of an insulative material and a conductive metal. The material of the insulative particles, their size, and the type of conductive metal used are selected so that the coefficient of thermal expansion (CTE) of the resulting electrically conductive region approximates the CTE of the surrounding material.

Abstract: A circuit card assembly thermal core includes a composite material that includes particles of diamond and a conductive metal such as aluminum, copper, nickel and beryllium and which may be made by pressure infiltration casting. The diamond particles are 110 to 160 microns in size and 10 to 80 percent by volume, and preferably 140 to 160 microns in size and 40 to 60 percent by volume. The composite material has both a high thermal conductivity and low density which may be matched with the coefficient of thermal expansion of other materials with which used.

Abstract: A ceramic feedthrough for a package for an electronic device provides a plurality of electrical connections through an opening in the package. A method of making the feedthrough and of packaging the electronic device includes electrically conductive paths that are formed from a metal paste applied between green sheets that are joined and cofired to form a ceramic body. Vias extend from an exterior surface of the ceramic body to the paths to complete the electrical connection from outside the package to inside the package. A density of 50 paths per inch or greater may be achieved. The ceramic body may be hermetically sealed into an opening in the package and the body may have a peripheral extension to facilitate attachment of the feedthrough to the package.

Abstract: A heat transfer device and method may be used to conduct heat from a heat source to a heat sink. The device and method improve thermal conduction in composite material mounting boards for heat generating components. The composite material fibers in the board may be parallel to the mounting surface of the board throughout their length. The matrix material for the composite material may be a metal, such as aluminum, that has some capacity to conduct heat. The device may include at least two thermally conductive wedges in the board for conducting heat into and out of the interior of the board. The wedges and the metal matrix may be the same conductive metal. A plurality of the fibers and the metal matrix contact both wedges to conduct heat to a surface adapted to transfer heat to the sink. A method of manufacture of the device provides that the wedges may be formed by placing the fibers in layers having decreasing lengths and adding the metal matrix material.

Abstract: A heat transfer device and method may be used to conduct heat from a heat source to a heat sink. The device and method improved thermal conduction in composite material mounting boards for heat generating components. The composite material fibers in the core of the board may be parallel to the mounting surface of the core throughout their length. The device may include at least two thermally conductive wedges embedded in the core for conducting heat into and out of the interior of the core. The wedges may be milled metal that may be mechanically and/or thermally attached to the composite material. The wedges may also be chemically plated to the composite. A plurality of the fibers contact both wedges to conduct heat to a surface adapted to transfer heat to the sink. A method of manufacture of the device provides that cavities for the wedges may be milled in the composite material of the core.